Intel Core 2 Duo E6600 vs Intel Core 2 Duo E4700
Comparative analysis of Intel Core 2 Duo E6600 and Intel Core 2 Duo E4700 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Duo E6600
- Around 5% better performance in PassMark - CPU mark: 942 vs 900
- Around 4% better performance in Geekbench 4 - Multi-Core: 533 vs 512
| Benchmarks | |
| PassMark - CPU mark | 942 vs 900 |
| Geekbench 4 - Multi-Core | 533 vs 512 |
Reasons to consider the Intel Core 2 Duo E4700
- Around 22% higher maximum core temperature: 73.3°C vs 60.1°C
| Specifications (specs) | |
| Maximum core temperature | 73.3°C vs 60.1°C |
| Benchmarks | |
| PassMark - Single thread mark | 949 vs 947 |
| Geekbench 4 - Single Core | 311 vs 310 |
Compare benchmarks
CPU 1: Intel Core 2 Duo E6600
CPU 2: Intel Core 2 Duo E4700
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| Name | Intel Core 2 Duo E6600 | Intel Core 2 Duo E4700 |
|---|---|---|
| PassMark - Single thread mark | 947 | 949 |
| PassMark - CPU mark | 942 | 900 |
| Geekbench 4 - Single Core | 310 | 311 |
| Geekbench 4 - Multi-Core | 533 | 512 |
Compare specifications (specs)
| Intel Core 2 Duo E6600 | Intel Core 2 Duo E4700 | |
|---|---|---|
Essentials |
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| Architecture codename | Conroe | Conroe |
| Launch date | Q3'06 | March 2008 |
| Place in performance rating | 2779 | 2787 |
| Processor Number | E6600 | E4700 |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
| Status | Discontinued | Discontinued |
| Vertical segment | Desktop | Desktop |
| Price now | $26.99 | |
| Value for money (0-100) | 16.19 | |
Performance |
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| 64 bit support | ||
| Base frequency | 2.40 GHz | 2.60 GHz |
| Bus Speed | 1066 MHz FSB | 800 MHz FSB |
| Die size | 143 mm2 | 111 mm2 |
| Manufacturing process technology | 65 nm | 65 nm |
| Maximum core temperature | 60.1°C | 73.3°C |
| Number of cores | 2 | 2 |
| Transistor count | 291 million | 167 million |
| VID voltage range | 0.8500V-1.5V | 0.8500V-1.5V |
| L1 cache | 64 KB | |
| L2 cache | 2048 KB | |
| Maximum frequency | 2.6 GHz | |
Compatibility |
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| Low Halogen Options Available | ||
| Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
| Scenario Design Power (SDP) | 0 W | |
| Sockets supported | PLGA775 | PLGA775 |
| Thermal Design Power (TDP) | 65 Watt | 65 Watt |
| Max number of CPUs in a configuration | 1 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
Memory |
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| Supported memory types | DDR1, DDR2, DDR3 | |
