Intel Core 2 Duo E6600 vs Intel Celeron J1750

Comparative analysis of Intel Core 2 Duo E6600 and Intel Celeron J1750 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Core 2 Duo E6600

  • Around 47% better performance in PassMark - Single thread mark: 946 vs 642
  • Around 75% better performance in PassMark - CPU mark: 942 vs 538
Benchmarks
PassMark - Single thread mark 946 vs 642
PassMark - CPU mark 942 vs 538

Reasons to consider the Intel Celeron J1750

  • Around 66% higher maximum core temperature: 100°C vs 60.1°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
  • 6.5x lower typical power consumption: 10 Watt vs 65 Watt
Maximum core temperature 100°C vs 60.1°C
Manufacturing process technology 22 nm vs 65 nm
Thermal Design Power (TDP) 10 Watt vs 65 Watt

Compare benchmarks

CPU 1: Intel Core 2 Duo E6600
CPU 2: Intel Celeron J1750

PassMark - Single thread mark
CPU 1
CPU 2
946
642
PassMark - CPU mark
CPU 1
CPU 2
942
538
Name Intel Core 2 Duo E6600 Intel Celeron J1750
PassMark - Single thread mark 946 642
PassMark - CPU mark 942 538
Geekbench 4 - Single Core 310
Geekbench 4 - Multi-Core 533

Compare specifications (specs)

Intel Core 2 Duo E6600 Intel Celeron J1750

Essentials

Architecture codename Conroe Bay Trail
Launch date Q3'06 1 September 2013
Place in performance rating 2773 2775
Processor Number E6600 J1750
Series Legacy Intel® Core™ Processors Intel® Celeron® Processor J Series
Status Discontinued Launched
Vertical segment Desktop Desktop
Launch price (MSRP) $72

Performance

64 bit support
Base frequency 2.40 GHz 2.41 GHz
Bus Speed 1066 MHz FSB
Die size 143 mm2
Manufacturing process technology 65 nm 22 nm
Maximum core temperature 60.1°C 100°C
Number of cores 2 2
Transistor count 291 million
VID voltage range 0.8500V-1.5V
L1 cache 112 KB
L2 cache 1 MB
Maximum frequency 2.41 GHz
Number of threads 2

Compatibility

Low Halogen Options Available
Package Size 37.5mm x 37.5mm 25mm X 27mm
Scenario Design Power (SDP) 0 W
Sockets supported PLGA775 FCBGA1170
Thermal Design Power (TDP) 65 Watt 10 Watt
Max number of CPUs in a configuration 1

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Anti-Theft technology
Intel® Identity Protection technology

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Flexible Display interface (FDI)
Intel® Optane™ Memory Supported
Intel® Rapid Storage technology (RST)
Intel® Stable Image Platform Program (SIPP)
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 36-bit

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)

Memory

Max memory channels 2
Maximum memory size 8 GB
Supported memory types DDR3L 1333

Graphics

Graphics base frequency 688 MHz
Graphics max dynamic frequency 750 MHz
Graphics max frequency 750 MHz
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel HD Graphics

Graphics interfaces

Number of displays supported 2

Peripherals

Max number of PCIe lanes 4
PCI Express revision 2.0
PCIe configurations X4, X2, X1