Intel Core 2 Duo E6600 vs Intel Celeron J1750
Comparative analysis of Intel Core 2 Duo E6600 and Intel Celeron J1750 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Duo E6600
- Around 47% better performance in PassMark - Single thread mark: 946 vs 642
- Around 75% better performance in PassMark - CPU mark: 942 vs 538
Benchmarks | |
PassMark - Single thread mark | 946 vs 642 |
PassMark - CPU mark | 942 vs 538 |
Reasons to consider the Intel Celeron J1750
- Around 66% higher maximum core temperature: 100°C vs 60.1°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
- 6.5x lower typical power consumption: 10 Watt vs 65 Watt
Maximum core temperature | 100°C vs 60.1°C |
Manufacturing process technology | 22 nm vs 65 nm |
Thermal Design Power (TDP) | 10 Watt vs 65 Watt |
Compare benchmarks
CPU 1: Intel Core 2 Duo E6600
CPU 2: Intel Celeron J1750
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core 2 Duo E6600 | Intel Celeron J1750 |
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PassMark - Single thread mark | 946 | 642 |
PassMark - CPU mark | 942 | 538 |
Geekbench 4 - Single Core | 310 | |
Geekbench 4 - Multi-Core | 533 |
Compare specifications (specs)
Intel Core 2 Duo E6600 | Intel Celeron J1750 | |
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Essentials |
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Architecture codename | Conroe | Bay Trail |
Launch date | Q3'06 | 1 September 2013 |
Place in performance rating | 2773 | 2775 |
Processor Number | E6600 | J1750 |
Series | Legacy Intel® Core™ Processors | Intel® Celeron® Processor J Series |
Status | Discontinued | Launched |
Vertical segment | Desktop | Desktop |
Launch price (MSRP) | $72 | |
Performance |
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64 bit support | ||
Base frequency | 2.40 GHz | 2.41 GHz |
Bus Speed | 1066 MHz FSB | |
Die size | 143 mm2 | |
Manufacturing process technology | 65 nm | 22 nm |
Maximum core temperature | 60.1°C | 100°C |
Number of cores | 2 | 2 |
Transistor count | 291 million | |
VID voltage range | 0.8500V-1.5V | |
L1 cache | 112 KB | |
L2 cache | 1 MB | |
Maximum frequency | 2.41 GHz | |
Number of threads | 2 | |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | 25mm X 27mm |
Scenario Design Power (SDP) | 0 W | |
Sockets supported | PLGA775 | FCBGA1170 |
Thermal Design Power (TDP) | 65 Watt | 10 Watt |
Max number of CPUs in a configuration | 1 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Anti-Theft technology | ||
Intel® Identity Protection technology | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Flexible Display interface (FDI) | ||
Intel® Optane™ Memory Supported | ||
Intel® Rapid Storage technology (RST) | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 36-bit | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Memory |
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Max memory channels | 2 | |
Maximum memory size | 8 GB | |
Supported memory types | DDR3L 1333 | |
Graphics |
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Graphics base frequency | 688 MHz | |
Graphics max dynamic frequency | 750 MHz | |
Graphics max frequency | 750 MHz | |
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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Number of displays supported | 2 | |
Peripherals |
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Max number of PCIe lanes | 4 | |
PCI Express revision | 2.0 | |
PCIe configurations | X4, X2, X1 |