Intel Core 2 Duo L7400 vs Intel Celeron M P4600

Comparative analysis of Intel Core 2 Duo L7400 and Intel Celeron M P4600 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Duo L7400

Intel Celeron M P4600

Differences

Reasons to consider the Intel Core 2 Duo L7400

Around 11% higher maximum core temperature: 100°C vs 90°C
2.1x lower typical power consumption: 17 Watt vs 35 Watt

Maximum core temperature	100°C vs 90°C
Thermal Design Power (TDP)	17 Watt vs 35 Watt

Reasons to consider the Intel Celeron M P4600

A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
Around 40% better performance in PassMark - Single thread mark: 777 vs 555
Around 61% better performance in PassMark - CPU mark: 832 vs 516

Specifications (specs)
Manufacturing process technology	32 nm vs 65 nm
Benchmarks
PassMark - Single thread mark	777 vs 555
PassMark - CPU mark	832 vs 516

Compare benchmarks

CPU 1: Intel Core 2 Duo L7400
CPU 2: Intel Celeron M P4600

PassMark - Single thread mark

CPU 1

CPU 2

555

777

PassMark - CPU mark

CPU 1

CPU 2

516

832

Name	Intel Core 2 Duo L7400	Intel Celeron M P4600
PassMark - Single thread mark	555	777
PassMark - CPU mark	516	832
Geekbench 4 - Single Core		301
Geekbench 4 - Multi-Core		556

Compare specifications (specs)

	Intel Core 2 Duo L7400	Intel Celeron M P4600
Essentials
Architecture codename	Merom	Arrandale
Launch date	Q3'06	1 October 2010
Place in performance rating	2799	2807
Processor Number	L7400	P4600
Series	Legacy Intel® Core™ Processors	Legacy Intel® Celeron® Processor
Status	Discontinued	Discontinued
Vertical segment	Mobile	Mobile
Launch price (MSRP)		$86
Performance
64 bit support
Base frequency	1.50 GHz	2.00 GHz
Bus Speed	667 MHz FSB	2.5 GT/s DMI
Die size	143 mm2	81 mm2
Manufacturing process technology	65 nm	32 nm
Maximum core temperature	100°C	90°C
Number of cores	2	2
Transistor count	291 million	382 million
VID voltage range	0.9V-1.1V
Front-side bus (FSB)		2500 MHz
L1 cache		128 KB
L2 cache		512 KB
L3 cache		2 MB
Maximum frequency		2 GHz
Number of threads		2
Compatibility
Low Halogen Options Available
Package Size	35mm x 35mm	37.5mmx37.5mm
Sockets supported	PBGA479	PGA988
Thermal Design Power (TDP)	17 Watt	35 Watt
Max number of CPUs in a configuration		1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)		36-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Memory
Max memory channels		2
Maximum memory bandwidth		17.1 GB/s
Maximum memory size		8 GB
Supported memory types		DDR3 800/1066
Graphics
Graphics base frequency		500 MHz
Graphics max dynamic frequency		667 MHz
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Processor graphics		Intel HD Graphics
Graphics interfaces
Number of displays supported		2
Peripherals
Max number of PCIe lanes		16
PCI Express revision		2.0
PCIe configurations		1x16