Intel Core 2 Duo L7400 vs Intel Celeron M P4600
Comparative analysis of Intel Core 2 Duo L7400 and Intel Celeron M P4600 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Duo L7400
- Around 11% higher maximum core temperature: 100°C vs 90°C
- 2.1x lower typical power consumption: 17 Watt vs 35 Watt
Maximum core temperature | 100°C vs 90°C |
Thermal Design Power (TDP) | 17 Watt vs 35 Watt |
Reasons to consider the Intel Celeron M P4600
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
- Around 41% better performance in PassMark - Single thread mark: 784 vs 555
- Around 64% better performance in PassMark - CPU mark: 846 vs 516
Specifications (specs) | |
Manufacturing process technology | 32 nm vs 65 nm |
Benchmarks | |
PassMark - Single thread mark | 784 vs 555 |
PassMark - CPU mark | 846 vs 516 |
Compare benchmarks
CPU 1: Intel Core 2 Duo L7400
CPU 2: Intel Celeron M P4600
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core 2 Duo L7400 | Intel Celeron M P4600 |
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PassMark - Single thread mark | 555 | 784 |
PassMark - CPU mark | 516 | 846 |
Geekbench 4 - Single Core | 301 | |
Geekbench 4 - Multi-Core | 556 |
Compare specifications (specs)
Intel Core 2 Duo L7400 | Intel Celeron M P4600 | |
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Essentials |
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Architecture codename | Merom | Arrandale |
Launch date | Q3'06 | 1 October 2010 |
Place in performance rating | 2886 | 2875 |
Processor Number | L7400 | P4600 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Celeron® Processor |
Status | Discontinued | Discontinued |
Vertical segment | Mobile | Mobile |
Launch price (MSRP) | $86 | |
Performance |
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64 bit support | ||
Base frequency | 1.50 GHz | 2.00 GHz |
Bus Speed | 667 MHz FSB | 2.5 GT/s DMI |
Die size | 143 mm2 | 81 mm2 |
Manufacturing process technology | 65 nm | 32 nm |
Maximum core temperature | 100°C | 90°C |
Number of cores | 2 | 2 |
Transistor count | 291 million | 382 million |
VID voltage range | 0.9V-1.1V | |
Front-side bus (FSB) | 2500 MHz | |
L1 cache | 128 KB | |
L2 cache | 512 KB | |
L3 cache | 2 MB | |
Maximum frequency | 2 GHz | |
Number of threads | 2 | |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 35mm x 35mm | 37.5mmx37.5mm |
Sockets supported | PBGA479 | PGA988 |
Thermal Design Power (TDP) | 17 Watt | 35 Watt |
Max number of CPUs in a configuration | 1 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 36-bit | |
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 17.1 GB/s | |
Maximum memory size | 8 GB | |
Supported memory types | DDR3 800/1066 | |
Graphics |
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Graphics base frequency | 500 MHz | |
Graphics max dynamic frequency | 667 MHz | |
Intel® Clear Video technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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Number of displays supported | 2 | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16 |