Intel Core 2 Duo L7400 vs Intel Celeron M P4600

Comparative analysis of Intel Core 2 Duo L7400 and Intel Celeron M P4600 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Core 2 Duo L7400

  • Around 11% higher maximum core temperature: 100°C vs 90°C
  • 2.1x lower typical power consumption: 17 Watt vs 35 Watt
Maximum core temperature 100°C vs 90°C
Thermal Design Power (TDP) 17 Watt vs 35 Watt

Reasons to consider the Intel Celeron M P4600

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
  • Around 41% better performance in PassMark - Single thread mark: 784 vs 555
  • Around 64% better performance in PassMark - CPU mark: 846 vs 516
Specifications (specs)
Manufacturing process technology 32 nm vs 65 nm
Benchmarks
PassMark - Single thread mark 784 vs 555
PassMark - CPU mark 846 vs 516

Compare benchmarks

CPU 1: Intel Core 2 Duo L7400
CPU 2: Intel Celeron M P4600

PassMark - Single thread mark
CPU 1
CPU 2
555
784
PassMark - CPU mark
CPU 1
CPU 2
516
846
Name Intel Core 2 Duo L7400 Intel Celeron M P4600
PassMark - Single thread mark 555 784
PassMark - CPU mark 516 846
Geekbench 4 - Single Core 301
Geekbench 4 - Multi-Core 556

Compare specifications (specs)

Intel Core 2 Duo L7400 Intel Celeron M P4600

Essentials

Architecture codename Merom Arrandale
Launch date Q3'06 1 October 2010
Place in performance rating 2886 2875
Processor Number L7400 P4600
Series Legacy Intel® Core™ Processors Legacy Intel® Celeron® Processor
Status Discontinued Discontinued
Vertical segment Mobile Mobile
Launch price (MSRP) $86

Performance

64 bit support
Base frequency 1.50 GHz 2.00 GHz
Bus Speed 667 MHz FSB 2.5 GT/s DMI
Die size 143 mm2 81 mm2
Manufacturing process technology 65 nm 32 nm
Maximum core temperature 100°C 90°C
Number of cores 2 2
Transistor count 291 million 382 million
VID voltage range 0.9V-1.1V
Front-side bus (FSB) 2500 MHz
L1 cache 128 KB
L2 cache 512 KB
L3 cache 2 MB
Maximum frequency 2 GHz
Number of threads 2

Compatibility

Low Halogen Options Available
Package Size 35mm x 35mm 37.5mmx37.5mm
Sockets supported PBGA479 PGA988
Thermal Design Power (TDP) 17 Watt 35 Watt
Max number of CPUs in a configuration 1

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 36-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Memory

Max memory channels 2
Maximum memory bandwidth 17.1 GB/s
Maximum memory size 8 GB
Supported memory types DDR3 800/1066

Graphics

Graphics base frequency 500 MHz
Graphics max dynamic frequency 667 MHz
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Processor graphics Intel HD Graphics

Graphics interfaces

Number of displays supported 2

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16