Intel Core 2 Duo T5500 vs Intel Pentium M 740
Comparative analysis of Intel Core 2 Duo T5500 and Intel Pentium M 740 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Duo T5500
- CPU is newer: launch date 2 year(s) 1 month(s) later
- 1 more cores, run more applications at once: 2 vs 1
- 1 more threads: 2 vs 1
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
Launch date | 1 February 2007 vs January 2005 |
Number of cores | 2 vs 1 |
Number of threads | 2 vs 1 |
Manufacturing process technology | 65 nm vs 90 nm |
L1 cache | 64 KB vs 32 KB |
Reasons to consider the Intel Pentium M 740
- Around 4% higher clock speed: 1.73 GHz vs 1.66 GHz
- Around 26% lower typical power consumption: 27 Watt vs 34 Watt
Maximum frequency | 1.73 GHz vs 1.66 GHz |
Thermal Design Power (TDP) | 27 Watt vs 34 Watt |
Compare benchmarks
CPU 1: Intel Core 2 Duo T5500
CPU 2: Intel Pentium M 740
Name | Intel Core 2 Duo T5500 | Intel Pentium M 740 |
---|---|---|
PassMark - Single thread mark | 617 | |
PassMark - CPU mark | 574 | |
Geekbench 4 - Single Core | 976 | |
Geekbench 4 - Multi-Core | 1533 |
Compare specifications (specs)
Intel Core 2 Duo T5500 | Intel Pentium M 740 | |
---|---|---|
Essentials |
||
Architecture codename | Merom | Dothan |
Launch date | 1 February 2007 | January 2005 |
Place in performance rating | 2515 | not rated |
Processor Number | T5500 | 740 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Pentium® Processor |
Status | Discontinued | Discontinued |
Vertical segment | Mobile | Mobile |
Performance |
||
64 bit support | ||
Base frequency | 1.66 GHz | 1.73 GHz |
Bus Speed | 667 MHz FSB | 533 MHz FSB |
Die size | 143 mm2 | 87 mm2 |
Front-side bus (FSB) | 667 MHz | 533 MHz |
L1 cache | 64 KB | 32 KB |
L2 cache | 2048 KB | 2048 KB |
Manufacturing process technology | 65 nm | 90 nm |
Maximum core temperature | 100°C | 100°C |
Maximum frequency | 1.66 GHz | 1.73 GHz |
Number of cores | 2 | 1 |
Number of threads | 2 | 1 |
Transistor count | 291 million | 144 million |
VID voltage range | 1.0375V-1.300V | 1.260V-1.356V |
Compatibility |
||
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 35mm x 35mm | 35mm x 35mm |
Scenario Design Power (SDP) | 0 W | |
Sockets supported | PPGA478, PBGA479 | PPGA478, H-PBGA479 |
Thermal Design Power (TDP) | 34 Watt | 27 Watt |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 32-bit | |
Virtualization |
||
Intel® Virtualization Technology (VT-x) |