Intel Core 2 Duo T5500 vs Intel Pentium M 740

Comparative analysis of Intel Core 2 Duo T5500 and Intel Pentium M 740 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Core 2 Duo T5500

  • CPU is newer: launch date 2 year(s) 1 month(s) later
  • 1 more cores, run more applications at once: 2 vs 1
  • 1 more threads: 2 vs 1
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
  • 2x more L1 cache, more data can be stored in the L1 cache for quick access later
Launch date 1 February 2007 vs January 2005
Number of cores 2 vs 1
Number of threads 2 vs 1
Manufacturing process technology 65 nm vs 90 nm
L1 cache 64 KB vs 32 KB

Reasons to consider the Intel Pentium M 740

  • Around 4% higher clock speed: 1.73 GHz vs 1.66 GHz
  • Around 26% lower typical power consumption: 27 Watt vs 34 Watt
Maximum frequency 1.73 GHz vs 1.66 GHz
Thermal Design Power (TDP) 27 Watt vs 34 Watt

Compare benchmarks

CPU 1: Intel Core 2 Duo T5500
CPU 2: Intel Pentium M 740

Name Intel Core 2 Duo T5500 Intel Pentium M 740
PassMark - Single thread mark 617
PassMark - CPU mark 574
Geekbench 4 - Single Core 976
Geekbench 4 - Multi-Core 1533

Compare specifications (specs)

Intel Core 2 Duo T5500 Intel Pentium M 740

Essentials

Architecture codename Merom Dothan
Launch date 1 February 2007 January 2005
Place in performance rating 2515 not rated
Processor Number T5500 740
Series Legacy Intel® Core™ Processors Legacy Intel® Pentium® Processor
Status Discontinued Discontinued
Vertical segment Mobile Mobile

Performance

64 bit support
Base frequency 1.66 GHz 1.73 GHz
Bus Speed 667 MHz FSB 533 MHz FSB
Die size 143 mm2 87 mm2
Front-side bus (FSB) 667 MHz 533 MHz
L1 cache 64 KB 32 KB
L2 cache 2048 KB 2048 KB
Manufacturing process technology 65 nm 90 nm
Maximum core temperature 100°C 100°C
Maximum frequency 1.66 GHz 1.73 GHz
Number of cores 2 1
Number of threads 2 1
Transistor count 291 million 144 million
VID voltage range 1.0375V-1.300V 1.260V-1.356V

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 35mm x 35mm 35mm x 35mm
Scenario Design Power (SDP) 0 W
Sockets supported PPGA478, PBGA479 PPGA478, H-PBGA479
Thermal Design Power (TDP) 34 Watt 27 Watt

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 32-bit

Virtualization

Intel® Virtualization Technology (VT-x)