Intel Core 2 Duo T5870 vs Intel Pentium Dual Core T3200

Comparative analysis of Intel Core 2 Duo T5870 and Intel Pentium Dual Core T3200 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Duo T5870

Intel Pentium Dual Core T3200

Differences

Reasons to consider the Intel Core 2 Duo T5870

2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 4% better performance in PassMark - Single thread mark: 744 vs 713
Around 12% better performance in PassMark - CPU mark: 705 vs 630
Around 6% better performance in Geekbench 4 - Single Core: 250 vs 235
Around 5% better performance in Geekbench 4 - Multi-Core: 429 vs 408

Specifications (specs)
L2 cache	2048 KB vs 1024 KB
Benchmarks
PassMark - Single thread mark	744 vs 713
PassMark - CPU mark	705 vs 630
Geekbench 4 - Single Core	250 vs 235
Geekbench 4 - Multi-Core	429 vs 408

Compare benchmarks

CPU 1: Intel Core 2 Duo T5870
CPU 2: Intel Pentium Dual Core T3200

PassMark - Single thread mark

CPU 1

CPU 2

744

713

PassMark - CPU mark

CPU 1

CPU 2

705

630

Geekbench 4 - Single Core

CPU 1

CPU 2

250

235

Geekbench 4 - Multi-Core

CPU 1

CPU 2

429

408

Name	Intel Core 2 Duo T5870	Intel Pentium Dual Core T3200
PassMark - Single thread mark	744	713
PassMark - CPU mark	705	630
Geekbench 4 - Single Core	250	235
Geekbench 4 - Multi-Core	429	408

Compare specifications (specs)

	Intel Core 2 Duo T5870	Intel Pentium Dual Core T3200
Essentials
Architecture codename	Merom	Merom
Launch date	1 October 2008	1 October 2008
Place in performance rating	2978	3036
Processor Number	T5870	T3200
Series	Legacy Intel® Core™ Processors	Legacy Intel® Pentium® Processor
Status	Discontinued	Discontinued
Vertical segment	Mobile	Mobile
Performance
64 bit support
Base frequency	2.00 GHz	2.00 GHz
Bus Speed	800 MHz FSB	667 MHz FSB
Die size	143 mm2	143 mm2
Front-side bus (FSB)	800 MHz	667 MHz
L2 cache	2048 KB	1024 KB
Manufacturing process technology	65 nm	65 nm
Maximum core temperature	100°C	100°C
Maximum frequency	2 GHz	2 GHz
Number of cores	2	2
Number of threads	2	2
Transistor count	291 million	291 million
VID voltage range	1.075V-1.175V	1.075V-1.175V
Compatibility
Low Halogen Options Available
Package Size	35mm x 35mm
Thermal Design Power (TDP)	35 Watt	35 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Virtualization
Intel® Virtualization Technology (VT-x)