Intel Core 3 100UL vs AMD Ryzen Embedded V2546

Comparative analysis of Intel Core 3 100UL and AMD Ryzen Embedded V2546 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Core 3 100UL

  • Around 14% higher clock speed: 4.5 GHz vs 3.95 GHz
  • Around 25% more L1 cache; more data can be stored in the L1 cache for quick access later
  • 2.5x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 25% more L3 cache; more data can be stored in the L3 cache for quick access later
  • 2.3x lower typical power consumption: 15 Watt vs 35 Watt
Maximum frequency 4.5 GHz vs 3.95 GHz
L1 cache 80 KB (per core) vs 64 KB (per core)
L2 cache 1.25 MB (per core) vs 512 KB (per core)
L3 cache 10 MB (shared) vs 8 MB (shared)
Thermal Design Power (TDP) 15 Watt vs 35 Watt

Reasons to consider the AMD Ryzen Embedded V2546

  • 4 more threads: 12 vs 8
  • Around 5% higher maximum core temperature: 105°C vs 100°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 10 nm
Number of threads 12 vs 8
Maximum core temperature 105°C vs 100°C
Manufacturing process technology 7 nm vs 10 nm

Compare benchmarks

CPU 1: Intel Core 3 100UL
CPU 2: AMD Ryzen Embedded V2546

Name Intel Core 3 100UL AMD Ryzen Embedded V2546
PassMark - Single thread mark 2513
PassMark - CPU mark 16236

Compare specifications (specs)

Intel Core 3 100UL AMD Ryzen Embedded V2546

Essentials

Place in performance rating not rated 835
Launch date 10 Nov 2020

Performance

Base frequency 1200 MHz 3 GHz
L1 cache 80 KB (per core) 64 KB (per core)
L2 cache 1.25 MB (per core) 512 KB (per core)
L3 cache 10 MB (shared) 8 MB (shared)
Manufacturing process technology 10 nm 7 nm
Maximum core temperature 100°C 105°C
Maximum frequency 4.5 GHz 3.95 GHz
Number of cores 6 6
Number of threads 8 12
Unlocked
Die size 156 mm²
Transistor count 9,800 million

Memory

ECC memory support
Supported memory types DDR4, DDR5 DDR4

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported Intel BGA 1744 FP6
Thermal Design Power (TDP) 15 Watt 35 Watt
Configurable TDP 54 Watt

Peripherals

PCIe configurations Gen 4, 8 Lanes, (CPU only) Gen 3, 20 Lanes, (CPU only)

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