Intel Core i3-2115C vs Intel Pentium B915C
Comparative analysis of Intel Core i3-2115C and Intel Pentium B915C processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Core i3-2115C
- Around 33% higher clock speed: 2 GHz vs 1.5 GHz
- Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
| Maximum frequency | 2 GHz vs 1.5 GHz |
| L3 cache | 3072 KB (shared) vs 2048 KB (shared) |
Reasons to consider the Intel Pentium B915C
- Around 67% lower typical power consumption: 15 Watt vs 25 Watt
| Thermal Design Power (TDP) | 15 Watt vs 25 Watt |
Compare specifications (specs)
| Intel Core i3-2115C | Intel Pentium B915C | |
|---|---|---|
Essentials |
||
| Architecture codename | Gladden | Gladden |
| Launch date | May 2012 | May 2012 |
| Place in performance rating | not rated | not rated |
| Processor Number | i3-2115C | B915C |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Pentium® Processor |
| Status | Launched | Launched |
| Vertical segment | Embedded | Embedded |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.00 GHz | 1.50 GHz |
| Bus Speed | 5 GT/s DMI | |
| Die size | 131 mm | 131 mm |
| L1 cache | 64 KB (per core) | 64 KB (per core) |
| L2 cache | 256 KB (per core) | 256 KB (per core) |
| L3 cache | 3072 KB (shared) | 2048 KB (shared) |
| Manufacturing process technology | 32 nm | 32 nm |
| Maximum core temperature | 100°C | 100°C |
| Maximum frequency | 2 GHz | 1.5 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 4 | 4 |
| Transistor count | 504 million | 504 million |
Memory |
||
| ECC memory support | ||
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 21.3 GB/s | 21.3 GB/s |
| Maximum memory size | 32 GB | 32 GB |
| Supported memory types | DDR3 1066/1333 | DDR3 1066/1333 |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 37.5mm x 37.5 mm | 37.5mm x 37.5 mm |
| Sockets supported | FCBGA1284 | FCBGA1284 |
| Thermal Design Power (TDP) | 25 Watt | 15 Watt |
Peripherals |
||
| Max number of PCIe lanes | 16 | 20 |
| PCI Express revision | 2 | 2 |
| PCIe configurations | 1x16 1x4 or 2x8 1x4 or 1x8 3x4 | 1x16 1x4 or 2x8 1x4 or 1x8 3x4 |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX | Intel® AVX |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||