Intel Core i3-2370M vs Intel Pentium 4-M 1.80
Comparative analysis of Intel Core i3-2370M and Intel Pentium 4-M 1.80 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core i3-2370M
- CPU is newer: launch date 9 year(s) 9 month(s) later
- 1 more cores, run more applications at once: 2 vs 1
- Around 33% higher clock speed: 2.4 GHz vs 1.8 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 130 nm
- 16x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2.3x better performance in PassMark - Single thread mark: 1053 vs 451
- 7.8x better performance in PassMark - CPU mark: 1371 vs 175
| Specifications (specs) | |
| Launch date | 1 January 2012 vs April 2002 |
| Number of cores | 2 vs 1 |
| Maximum frequency | 2.4 GHz vs 1.8 GHz |
| Manufacturing process technology | 32 nm vs 130 nm |
| L1 cache | 128 KB vs 8 KB |
| Benchmarks | |
| PassMark - Single thread mark | 1053 vs 451 |
| PassMark - CPU mark | 1371 vs 175 |
Reasons to consider the Intel Pentium 4-M 1.80
- Around 18% higher maximum core temperature: 100°C vs 85C (PGA); 100C (BGA)
- Around 17% lower typical power consumption: 30 Watt vs 35 Watt
| Maximum core temperature | 100°C vs 85C (PGA); 100C (BGA) |
| Thermal Design Power (TDP) | 30 Watt vs 35 Watt |
Compare benchmarks
CPU 1: Intel Core i3-2370M
CPU 2: Intel Pentium 4-M 1.80
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Core i3-2370M | Intel Pentium 4-M 1.80 |
|---|---|---|
| PassMark - Single thread mark | 1053 | 451 |
| PassMark - CPU mark | 1371 | 175 |
| Geekbench 4 - Single Core | 414 | |
| Geekbench 4 - Multi-Core | 882 | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 0.991 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 18.096 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.135 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 0.701 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 1.623 |
Compare specifications (specs)
| Intel Core i3-2370M | Intel Pentium 4-M 1.80 | |
|---|---|---|
Essentials |
||
| Architecture codename | Sandy Bridge | Northwood |
| Launch date | 1 January 2012 | April 2002 |
| Launch price (MSRP) | $225 | |
| Place in performance rating | 3087 | 3083 |
| Price now | $39.81 | |
| Processor Number | i3-2370M | |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Pentium® Processor |
| Status | Launched | Discontinued |
| Value for money (0-100) | 20.53 | |
| Vertical segment | Mobile | Mobile |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.40 GHz | 1.80 GHz |
| Bus Speed | 5 GT/s DMI | 400 MHz FSB |
| Die size | 149 mm | 131 mm2 |
| L1 cache | 128 KB | 8 KB |
| L2 cache | 512 KB | 512 KB |
| L3 cache | 3072 KB | |
| Manufacturing process technology | 32 nm | 130 nm |
| Maximum core temperature | 85C (PGA); 100C (BGA) | 100°C |
| Maximum frequency | 2.4 GHz | 1.8 GHz |
| Number of cores | 2 | 1 |
| Number of threads | 4 | |
| Transistor count | 624 Million | 55 million |
| Maximum case temperature (TCase) | 100 °C | |
| VID voltage range | 1.3V | |
Memory |
||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 21.3 GB/s | |
| Maximum memory size | 16 GB | |
| Supported memory types | DDR3 1066/1333 | DDR1, DDR2 |
Graphics |
||
| Device ID | 0x116 | |
| Graphics base frequency | 650 MHz | |
| Graphics max dynamic frequency | 1.15 GHz | |
| Graphics max frequency | 1.15 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel® HD Graphics 3000 | |
Graphics interfaces |
||
| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 2 | |
| SDVO | ||
| Wireless Display (WiDi) support | ||
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 37.5mm x 37.5mm (rPGA988B); 31mm x 24mm (BGA1023) | 35mm x 35mm |
| Sockets supported | PPGA988 | PPGA478 |
| Thermal Design Power (TDP) | 35 Watt | 30 Watt |
Peripherals |
||
| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Security & Reliability |
||
| Anti-Theft technology | ||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| 4G WiMAX Wireless | ||
| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX | |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| FSB parity | ||
Virtualization |
||
| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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