Intel Core i3-3217UE vs Intel Core 2 Extreme X9000

Comparative analysis of Intel Core i3-3217UE and Intel Core 2 Extreme X9000 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Core i3-3217UE

  • CPU is newer: launch date 4 year(s) 6 month(s) later
  • 2 more threads: 4 vs 2
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
  • 2.6x lower typical power consumption: 17 Watt vs 44 Watt
  • Around 24% better performance in PassMark - CPU mark: 1362 vs 1099
Specifications (specs)
Launch date August 2012 vs 10 January 2008
Number of threads 4 vs 2
Manufacturing process technology 22 nm vs 45 nm
Thermal Design Power (TDP) 17 Watt vs 44 Watt
Benchmarks
PassMark - CPU mark 1362 vs 1099

Reasons to consider the Intel Core 2 Extreme X9000

  • Around 75% higher clock speed: 2.8 GHz vs 1.6 GHz
  • 12x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 54% better performance in PassMark - Single thread mark: 1098 vs 711
Specifications (specs)
Maximum frequency 2.8 GHz vs 1.6 GHz
L2 cache 6144 KB vs 256 KB (per core)
Benchmarks
PassMark - Single thread mark 1098 vs 711

Compare benchmarks

CPU 1: Intel Core i3-3217UE
CPU 2: Intel Core 2 Extreme X9000

PassMark - Single thread mark
CPU 1
CPU 2
711
1098
PassMark - CPU mark
CPU 1
CPU 2
1362
1099
Name Intel Core i3-3217UE Intel Core 2 Extreme X9000
PassMark - Single thread mark 711 1098
PassMark - CPU mark 1362 1099
Geekbench 4 - Single Core 362
Geekbench 4 - Multi-Core 645

Compare specifications (specs)

Intel Core i3-3217UE Intel Core 2 Extreme X9000

Essentials

Architecture codename Ivy Bridge Penryn
Launch date August 2012 10 January 2008
Place in performance rating 2646 2628
Processor Number i3-3217UE X9000
Series Legacy Intel® Core™ Processors Legacy Intel® Core™ Processors
Status Launched Discontinued
Vertical segment Embedded Mobile
Launch price (MSRP) $851
Price now $409.95
Value for money (0-100) 1.37

Performance

64 bit support
Base frequency 1.60 GHz 2.80 GHz
Bus Speed 5 GT/s DMI 800 MHz FSB
Die size 118 mm 107 mm2
L1 cache 64 KB (per core) 128 KB
L2 cache 256 KB (per core) 6144 KB
L3 cache 3072 KB (shared)
Manufacturing process technology 22 nm 45 nm
Maximum core temperature 105°C 105°C
Maximum frequency 1.6 GHz 2.8 GHz
Number of cores 2 2
Number of threads 4 2
Front-side bus (FSB) 800 MHz
Transistor count 410 million
VID voltage range 1.000V-1.275V

Memory

ECC memory support
Max memory channels 2
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 16 GB
Supported memory types DDR3/DDR3L 1333/1600

Graphics

Graphics base frequency 350 MHz
Graphics max dynamic frequency 900 MHz
Graphics max frequency 900 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel® HD Graphics 4000

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 3
SDVO
Wireless Display (WiDi) support

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 31mm x 24mm 35mm x 35mm
Sockets supported FCBGA1023 PGA478
Thermal Design Power (TDP) 17 Watt 44 Watt

Peripherals

Max number of PCIe lanes 1
PCI Express revision 2.0
PCIe configurations 1x16 2x8 1x8 2x4

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
FSB parity

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)