Intel Core i3-3217UE vs Intel Core 2 Duo T5270
Comparative analysis of Intel Core i3-3217UE and Intel Core 2 Duo T5270 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core i3-3217UE
- CPU is newer: launch date 3 year(s) 10 month(s) later
- 2 more threads: 4 vs 2
- Around 14% higher clock speed: 1.6 GHz vs 1.4 GHz
- Around 5% higher maximum core temperature: 105°C vs 100°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
- 2.1x lower typical power consumption: 17 Watt vs 35 Watt
- Around 33% better performance in PassMark - Single thread mark: 711 vs 535
- 3.2x better performance in PassMark - CPU mark: 1362 vs 427
| Specifications (specs) | |
| Launch date | August 2012 vs 1 October 2008 |
| Number of threads | 4 vs 2 |
| Maximum frequency | 1.6 GHz vs 1.4 GHz |
| Maximum core temperature | 105°C vs 100°C |
| Manufacturing process technology | 22 nm vs 65 nm |
| Thermal Design Power (TDP) | 17 Watt vs 35 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 711 vs 535 |
| PassMark - CPU mark | 1362 vs 427 |
Reasons to consider the Intel Core 2 Duo T5270
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
| L2 cache | 2048 KB vs 256 KB (per core) |
Compare benchmarks
CPU 1: Intel Core i3-3217UE
CPU 2: Intel Core 2 Duo T5270
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Core i3-3217UE | Intel Core 2 Duo T5270 |
|---|---|---|
| PassMark - Single thread mark | 711 | 535 |
| PassMark - CPU mark | 1362 | 427 |
| Geekbench 4 - Single Core | 871 | |
| Geekbench 4 - Multi-Core | 1215 |
Compare specifications (specs)
| Intel Core i3-3217UE | Intel Core 2 Duo T5270 | |
|---|---|---|
Essentials |
||
| Architecture codename | Ivy Bridge | Merom |
| Launch date | August 2012 | 1 October 2008 |
| Place in performance rating | 2664 | 2674 |
| Processor Number | i3-3217UE | T5270 |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
| Status | Launched | Discontinued |
| Vertical segment | Embedded | Mobile |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.60 GHz | 1.40 GHz |
| Bus Speed | 5 GT/s DMI | 800 MHz FSB |
| Die size | 118 mm | 143 mm2 |
| L1 cache | 64 KB (per core) | |
| L2 cache | 256 KB (per core) | 2048 KB |
| L3 cache | 3072 KB (shared) | |
| Manufacturing process technology | 22 nm | 65 nm |
| Maximum core temperature | 105°C | 100°C |
| Maximum frequency | 1.6 GHz | 1.4 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 4 | 2 |
| Front-side bus (FSB) | 800 MHz | |
| Transistor count | 291 million | |
| VID voltage range | 1.075V-1.250V | |
Memory |
||
| ECC memory support | ||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 25.6 GB/s | |
| Maximum memory size | 16 GB | |
| Supported memory types | DDR3/DDR3L 1333/1600 | |
Graphics |
||
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 900 MHz | |
| Graphics max frequency | 900 MHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel® HD Graphics 4000 | |
Graphics interfaces |
||
| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | |
| SDVO | ||
| Wireless Display (WiDi) support | ||
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 31mm x 24mm | 35mm x 35mm |
| Sockets supported | FCBGA1023 | PPGA478 |
| Thermal Design Power (TDP) | 17 Watt | 35 Watt |
Peripherals |
||
| Max number of PCIe lanes | 1 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16 2x8 1x8 2x4 | |
Security & Reliability |
||
| Anti-Theft technology | ||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| 4G WiMAX Wireless | ||
| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX | |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| FSB parity | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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