Intel Core i3-3217UE vs Intel Pentium B970
Comparative analysis of Intel Core i3-3217UE and Intel Pentium B970 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core i3-3217UE
- CPU is newer: launch date 10 month(s) later
- 2 more threads: 4 vs 2
- Around 24% higher maximum core temperature: 105°C vs 85C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
- 2.1x lower typical power consumption: 17 Watt vs 35 Watt
- Around 24% better performance in PassMark - CPU mark: 1362 vs 1100
| Specifications (specs) | |
| Launch date | August 2012 vs 1 October 2011 |
| Number of threads | 4 vs 2 |
| Maximum core temperature | 105°C vs 85C |
| Manufacturing process technology | 22 nm vs 32 nm |
| L3 cache | 3072 KB (shared) vs 2048 KB |
| Thermal Design Power (TDP) | 17 Watt vs 35 Watt |
| Benchmarks | |
| PassMark - CPU mark | 1362 vs 1100 |
Reasons to consider the Intel Pentium B970
- Around 44% higher clock speed: 2.3 GHz vs 1.6 GHz
- Around 45% better performance in PassMark - Single thread mark: 1029 vs 711
| Specifications (specs) | |
| Maximum frequency | 2.3 GHz vs 1.6 GHz |
| Benchmarks | |
| PassMark - Single thread mark | 1029 vs 711 |
Compare benchmarks
CPU 1: Intel Core i3-3217UE
CPU 2: Intel Pentium B970
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Core i3-3217UE | Intel Pentium B970 |
|---|---|---|
| PassMark - Single thread mark | 711 | 1029 |
| PassMark - CPU mark | 1362 | 1100 |
| Geekbench 4 - Single Core | 364 | |
| Geekbench 4 - Multi-Core | 668 |
Compare specifications (specs)
| Intel Core i3-3217UE | Intel Pentium B970 | |
|---|---|---|
Essentials |
||
| Architecture codename | Ivy Bridge | Sandy Bridge |
| Launch date | August 2012 | 1 October 2011 |
| Place in performance rating | 2674 | 2689 |
| Processor Number | i3-3217UE | B970 |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Pentium® Processor |
| Status | Launched | Launched |
| Vertical segment | Embedded | Mobile |
| Launch price (MSRP) | $125 | |
| Price now | $50.99 | |
| Value for money (0-100) | 11.33 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.60 GHz | 2.30 GHz |
| Bus Speed | 5 GT/s DMI | 5 GT/s DMI |
| Die size | 118 mm | 149 mm |
| L1 cache | 64 KB (per core) | 128 KB |
| L2 cache | 256 KB (per core) | 512 KB |
| L3 cache | 3072 KB (shared) | 2048 KB |
| Manufacturing process technology | 22 nm | 32 nm |
| Maximum core temperature | 105°C | 85C |
| Maximum frequency | 1.6 GHz | 2.3 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 4 | 2 |
| Transistor count | 624 Million | |
Memory |
||
| ECC memory support | ||
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 25.6 GB/s | 21.3 GB/s |
| Maximum memory size | 16 GB | 16 GB |
| Supported memory types | DDR3/DDR3L 1333/1600 | DDR3 1066/1333 |
Graphics |
||
| Graphics base frequency | 350 MHz | 650 MHz |
| Graphics max dynamic frequency | 900 MHz | 1.15 GHz |
| Graphics max frequency | 900 MHz | 1.15 GHz |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel® HD Graphics 4000 | Intel HD Graphics |
Graphics interfaces |
||
| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | 2 |
| SDVO | ||
| Wireless Display (WiDi) support | ||
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 31mm x 24mm | 37.5mmx37.5mm (rPGA988B) |
| Sockets supported | FCBGA1023 | FCPGA988 |
| Thermal Design Power (TDP) | 17 Watt | 35 Watt |
Peripherals |
||
| Max number of PCIe lanes | 1 | 16 |
| PCI Express revision | 2.0 | 2.0 |
| PCIe configurations | 1x16 2x8 1x8 2x4 | 1x16, 2x8, 1x8 2x4 |
Security & Reliability |
||
| Anti-Theft technology | ||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| 4G WiMAX Wireless | ||
| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX | Intel® SSE4.1, Intel® SSE4.2 |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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