Intel Core i3-4150 vs AMD Phenom II X3 700e

Comparative analysis of Intel Core i3-4150 and AMD Phenom II X3 700e processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).

Intel Core i3-4150

AMD Phenom II X3 700e

Differences

Reasons to consider the Intel Core i3-4150

A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
Around 20% lower typical power consumption: 54 Watt vs 65 Watt
2x better performance in PassMark - Single thread mark: 1940 vs 961
2.3x better performance in PassMark - CPU mark: 3396 vs 1451

Specifications (specs)
Manufacturing process technology	22 nm vs 45 nm
Thermal Design Power (TDP)	54 Watt vs 65 Watt
Benchmarks
PassMark - Single thread mark	1940 vs 961
PassMark - CPU mark	3396 vs 1451

Reasons to consider the AMD Phenom II X3 700e

1 more cores, run more applications at once: 3 vs 2

Number of cores	3 vs 2

Compare benchmarks

CPU 1: Intel Core i3-4150
CPU 2: AMD Phenom II X3 700e

PassMark - Single thread mark

CPU 1

CPU 2

1940

961

PassMark - CPU mark

CPU 1

CPU 2

3396

1451

Name	Intel Core i3-4150	AMD Phenom II X3 700e
PassMark - Single thread mark	1940	961
PassMark - CPU mark	3396	1451
Geekbench 4 - Single Core	767
Geekbench 4 - Multi-Core	1635
3DMark Fire Strike - Physics Score	0
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	2.505
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	46.419
CompuBench 1.5 Desktop - T-Rex (Frames/s)	0.304
CompuBench 1.5 Desktop - Video Composition (Frames/s)	1.213
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)	2.987
GFXBench 4.0 - Car Chase Offscreen (Frames)	721
GFXBench 4.0 - Manhattan (Frames)	1035
GFXBench 4.0 - T-Rex (Frames)	2510
GFXBench 4.0 - Car Chase Offscreen (Fps)	721
GFXBench 4.0 - Manhattan (Fps)	1035
GFXBench 4.0 - T-Rex (Fps)	2510

Compare specifications (specs)

	Intel Core i3-4150	AMD Phenom II X3 700e
Essentials
Architecture codename	Haswell	Heka
Launch date	Q2'14	June 2009
Place in performance rating	2317	2327
Processor Number	i3-4150
Series	4th Generation Intel® Core™ i3 Processors
Status	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	3.50 GHz
Bus Speed	5 GT/s DMI2
Manufacturing process technology	22 nm	45 nm
Maximum core temperature	72°C
Number of cores	2	3
Number of threads	4
Die size		258 mm
L1 cache		128 KB (per core)
L2 cache		512 KB (per core)
L3 cache		6144 KB (shared)
Maximum frequency		2.4 GHz
Transistor count		758 million
Memory
Max memory channels	2
Maximum memory bandwidth	25.6 GB/s
Maximum memory size	32 GB
Supported memory types	DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V	DDR3
Graphics
Device ID	0x41E
Graphics base frequency	350 MHz
Graphics max dynamic frequency	1.15 GHz
Intel® Clear Video HD technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory	2 GB
Processor graphics	Intel® HD Graphics 4400
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported	3
VGA
Graphics image quality
Max resolution over DisplayPort	3840x2160@60Hz
Max resolution over eDP	3840x2160@60Hz
Max resolution over HDMI 1.4	4096x2304@24Hz
Max resolution over VGA	1920x1200@60Hz
Graphics API support
DirectX	11.1/12
OpenGL	4.3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm
Sockets supported	FCLGA1150	AM3
Thermal Design Power (TDP)	54 Watt	65 Watt
Thermal Solution	PCG 2013C
Peripherals
Max number of PCIe lanes	16
PCI Express revision	Up to 3.0
PCIe configurations	Up to 1x16, 2x8, 1x8+2x4
Scalability	1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)