Intel Core i3-4150 vs Intel Core 2 Duo E6540

Comparative analysis of Intel Core i3-4150 and Intel Core 2 Duo E6540 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the Intel Core i3-4150

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
  • Around 20% lower typical power consumption: 54 Watt vs 65 Watt
  • 2x better performance in PassMark - Single thread mark: 1938 vs 969
  • 4.2x better performance in PassMark - CPU mark: 3395 vs 808
Specifications (specs)
Manufacturing process technology 22 nm vs 65 nm
Thermal Design Power (TDP) 54 Watt vs 65 Watt
Benchmarks
PassMark - Single thread mark 1938 vs 969
PassMark - CPU mark 3395 vs 808

Compare benchmarks

CPU 1: Intel Core i3-4150
CPU 2: Intel Core 2 Duo E6540

PassMark - Single thread mark
CPU 1
CPU 2
1938
969
PassMark - CPU mark
CPU 1
CPU 2
3395
808
Name Intel Core i3-4150 Intel Core 2 Duo E6540
PassMark - Single thread mark 1938 969
PassMark - CPU mark 3395 808
Geekbench 4 - Single Core 767
Geekbench 4 - Multi-Core 1635
3DMark Fire Strike - Physics Score 0
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 2.505
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 46.419
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.304
CompuBench 1.5 Desktop - Video Composition (Frames/s) 1.213
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 2.987
GFXBench 4.0 - Car Chase Offscreen (Frames) 721
GFXBench 4.0 - Manhattan (Frames) 1035
GFXBench 4.0 - T-Rex (Frames) 2510
GFXBench 4.0 - Car Chase Offscreen (Fps) 721
GFXBench 4.0 - Manhattan (Fps) 1035
GFXBench 4.0 - T-Rex (Fps) 2510

Compare specifications (specs)

Intel Core i3-4150 Intel Core 2 Duo E6540

Essentials

Architecture codename Haswell Conroe
Launch date Q2'14 Q3'07
Place in performance rating 2320 2321
Processor Number i3-4150 E6540
Series 4th Generation Intel® Core™ i3 Processors Legacy Intel® Core™ Processors
Status Discontinued Discontinued
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 3.50 GHz 2.33 GHz
Bus Speed 5 GT/s DMI2 1333 MHz FSB
Manufacturing process technology 22 nm 65 nm
Maximum core temperature 72°C 72°C
Number of cores 2 2
Number of threads 4
Die size 143 mm2
Transistor count 291 million
VID voltage range 0.8500V-1.5V

Memory

Max memory channels 2
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 32 GB
Supported memory types DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V

Graphics

Device ID 0x41E
Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.15 GHz
Intel® Clear Video HD technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory 2 GB
Processor graphics Intel® HD Graphics 4400

Graphics interfaces

DisplayPort
DVI
eDP
HDMI
Number of displays supported 3
VGA

Graphics image quality

Max resolution over DisplayPort 3840x2160@60Hz
Max resolution over eDP 3840x2160@60Hz
Max resolution over HDMI 1.4 4096x2304@24Hz
Max resolution over VGA 1920x1200@60Hz

Graphics API support

DirectX 11.1/12
OpenGL 4.3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 37.5mm x 37.5mm 37.5mm x 37.5mm
Sockets supported FCLGA1150 PLGA775
Thermal Design Power (TDP) 54 Watt 65 Watt
Thermal Solution PCG 2013C

Peripherals

Max number of PCIe lanes 16
PCI Express revision Up to 3.0
PCIe configurations Up to 1x16, 2x8, 1x8+2x4
Scalability 1S Only

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
FSB parity
Intel® Demand Based Switching

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)