Intel Core i3-5157U vs Intel Core 2 Quad Q9400
Comparative analysis of Intel Core i3-5157U and Intel Core 2 Quad Q9400 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core i3-5157U
- CPU is newer: launch date 6 year(s) 5 month(s) later
- Around 47% higher maximum core temperature: 105°C vs 71.4°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
- 3.4x lower typical power consumption: 28 Watt vs 95 Watt
- Around 22% better performance in PassMark - Single thread mark: 1392 vs 1139
- Around 21% better performance in PassMark - CPU mark: 2593 vs 2150
- Around 45% better performance in Geekbench 4 - Single Core: 544 vs 376
- Around 10% better performance in Geekbench 4 - Multi-Core: 1271 vs 1151
Specifications (specs) | |
Launch date | 6 January 2015 vs August 2008 |
Maximum core temperature | 105°C vs 71.4°C |
Manufacturing process technology | 14 nm vs 45 nm |
Thermal Design Power (TDP) | 28 Watt vs 95 Watt |
Benchmarks | |
PassMark - Single thread mark | 1392 vs 1139 |
PassMark - CPU mark | 2593 vs 2150 |
Geekbench 4 - Single Core | 544 vs 376 |
Geekbench 4 - Multi-Core | 1271 vs 1151 |
Reasons to consider the Intel Core 2 Quad Q9400
- 2 more cores, run more applications at once: 4 vs 2
- Around 7% higher clock speed: 2.67 GHz vs 2.5 GHz
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 12x more L2 cache, more data can be stored in the L2 cache for quick access later
Number of cores | 4 vs 2 |
Maximum frequency | 2.67 GHz vs 2.5 GHz |
L1 cache | 256 KB vs 128 KB |
L2 cache | 6144 KB vs 512 KB |
Compare benchmarks
CPU 1: Intel Core i3-5157U
CPU 2: Intel Core 2 Quad Q9400
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core i3-5157U | Intel Core 2 Quad Q9400 |
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PassMark - Single thread mark | 1392 | 1139 |
PassMark - CPU mark | 2593 | 2150 |
Geekbench 4 - Single Core | 544 | 376 |
Geekbench 4 - Multi-Core | 1271 | 1151 |
3DMark Fire Strike - Physics Score | 0 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 0.574 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 26.509 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.136 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 0.094 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 4.189 |
Compare specifications (specs)
Intel Core i3-5157U | Intel Core 2 Quad Q9400 | |
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Essentials |
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Architecture codename | Broadwell | Yorkfield |
Launch date | 6 January 2015 | August 2008 |
Launch price (MSRP) | $315 | |
Place in performance rating | 2252 | 3130 |
Processor Number | i3-5157U | Q9400 |
Series | 5th Generation Intel® Core™ i3 Processors | Legacy Intel® Core™ Processors |
Status | Launched | Discontinued |
Vertical segment | Mobile | Desktop |
Price now | $33.98 | |
Value for money (0-100) | 28.99 | |
Performance |
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64 bit support | ||
Base frequency | 2.50 GHz | 2.66 GHz |
Bus Speed | 5 GT/s DMI2 | 1333 MHz FSB |
Die size | 133 mm | 164 mm2 |
L1 cache | 128 KB | 256 KB |
L2 cache | 512 KB | 6144 KB |
L3 cache | 3 MB | |
Manufacturing process technology | 14 nm | 45 nm |
Maximum case temperature (TCase) | 105 °C | 71 °C |
Maximum core temperature | 105°C | 71.4°C |
Maximum frequency | 2.5 GHz | 2.67 GHz |
Number of cores | 2 | 4 |
Number of threads | 4 | |
Transistor count | 1900 Million | 456 million |
VID voltage range | 0.8500V-1.3625V | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 16 GB | |
Supported memory types | DDR3L 1333/1600, LPDDR3 1600/1866 | DDR1, DDR2, DDR3 |
Graphics |
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Device ID | 0x162B | |
Graphics base frequency | 300 MHz | |
Graphics max dynamic frequency | 1.00 GHz | |
Graphics max frequency | 1 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 16 GB | |
Processor graphics | Intel® Iris® Graphics 6100 | |
Graphics interfaces |
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DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
Wireless Display (WiDi) support | ||
Graphics image quality |
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Max resolution over DisplayPort | 3840x2160@60Hz | |
Max resolution over HDMI 1.4 | 2560x1600@60Hz | |
Max resolution over VGA | N / A | |
Graphics API support |
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DirectX | 11.2/12 | |
OpenGL | 4.3 | |
Compatibility |
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Configurable TDP-down | 23 W | |
Configurable TDP-down Frequency | 600 MHz | |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 40mm x24mm x 1.3mm | 37.5mm x 37.5mm |
Sockets supported | FCBGA1168 | LGA775 |
Thermal Design Power (TDP) | 28 Watt | 95 Watt |
Peripherals |
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Max number of PCIe lanes | 12 | |
PCI Express revision | 2.0 | |
PCIe configurations | 4x1, 2x4 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Smart Response technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
FSB parity | ||
Intel® Demand Based Switching | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |