Intel Core i3-550 vs Intel Celeron 2.30

Comparative analysis of Intel Core i3-550 and Intel Celeron 2.30 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

Intel Core i3-550

Intel Celeron 2.30

Differences

Reasons to consider the Intel Core i3-550

CPU is newer: launch date 7 year(s) 2 month(s) later
1 more cores, run more applications at once: 2 vs 1
Around 39% higher clock speed: 3.2 GHz vs 2.3 GHz
Around 4% higher maximum core temperature: 72.6°C vs 70°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 130 nm
16x more L1 cache, more data can be stored in the L1 cache for quick access later
4x more L2 cache, more data can be stored in the L2 cache for quick access later
2.4x better performance in PassMark - Single thread mark: 1340 vs 559
7.1x better performance in PassMark - CPU mark: 1609 vs 227

Specifications (specs)
Launch date	May 2010 vs March 2003
Number of cores	2 vs 1
Maximum frequency	3.2 GHz vs 2.3 GHz
Maximum core temperature	72.6°C vs 70°C
Manufacturing process technology	32 nm vs 130 nm
L1 cache	64 KB (per core) vs 8 KB
L2 cache	256 KB (per core) vs 128 KB
Benchmarks
PassMark - Single thread mark	1340 vs 559
PassMark - CPU mark	1609 vs 227

Reasons to consider the Intel Celeron 2.30

Around 26% lower typical power consumption: 58.3 Watt vs 73 Watt

Thermal Design Power (TDP)	58.3 Watt vs 73 Watt

Compare benchmarks

CPU 1: Intel Core i3-550
CPU 2: Intel Celeron 2.30

PassMark - Single thread mark

CPU 1

CPU 2

1340

559

PassMark - CPU mark

CPU 1

CPU 2

1609

227

Name	Intel Core i3-550	Intel Celeron 2.30
PassMark - Single thread mark	1340	559
PassMark - CPU mark	1609	227
Geekbench 4 - Single Core	478
Geekbench 4 - Multi-Core	1061
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	0.529
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	31.203
CompuBench 1.5 Desktop - T-Rex (Frames/s)	0.156
CompuBench 1.5 Desktop - Video Composition (Frames/s)	0.842
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)	2.358

Compare specifications (specs)

	Intel Core i3-550	Intel Celeron 2.30
Essentials
Architecture codename	Clarkdale	Northwood
Launch date	May 2010	March 2003
Launch price (MSRP)	$101
Place in performance rating	2923	2915
Price now	$179.95
Processor Number	i3-550
Series	Legacy Intel® Core™ Processors	Legacy Intel® Celeron® Processor
Status	Discontinued	Discontinued
Value for money (0-100)	4.63
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	3.20 GHz	2.30 GHz
Bus Speed	2.5 GT/s DMI	400 MHz FSB
Die size	81 mm2	131 mm2
L1 cache	64 KB (per core)	8 KB
L2 cache	256 KB (per core)	128 KB
L3 cache	4096 KB (shared)
Manufacturing process technology	32 nm	130 nm
Maximum core temperature	72.6°C	70°C
Maximum frequency	3.2 GHz	2.3 GHz
Number of cores	2	1
Number of threads	4
Transistor count	382 million	55 million
VID voltage range	0.6500V-1.4000V	1.315V-1.525V
Memory
Max memory channels	2
Maximum memory bandwidth	21 GB/s
Maximum memory size	16.38 GB
Supported memory types	DDR3 1066/1333	DDR1, DDR2
Graphics
Graphics base frequency	733 MHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Processor graphics	Intel HD Graphics
Graphics interfaces
Number of displays supported	2
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm	35mm x 35mm
Sockets supported	FCLGA1156	PPGA478
Thermal Design Power (TDP)	73 Watt	58.3 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)	36-bit	32-bit
Thermal Monitoring
FSB parity
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® VT-x with Extended Page Tables (EPT)