Intel Core i3-550 vs Intel Core 2 Duo E8500
Comparative analysis of Intel Core i3-550 and Intel Core 2 Duo E8500 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core i3-550
- CPU is newer: launch date 1 year(s) 8 month(s) later
- Around 0% higher maximum core temperature: 72.6°C vs 72.4°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 1% better performance in PassMark - Single thread mark: 1340 vs 1321
- Around 26% better performance in PassMark - CPU mark: 1609 vs 1273
- Around 9% better performance in Geekbench 4 - Single Core: 478 vs 439
- Around 41% better performance in Geekbench 4 - Multi-Core: 1061 vs 754
- Around 54% better performance in CompuBench 1.5 Desktop - Face Detection (mPixels/s): 0.529 vs 0.344
- Around 35% better performance in CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s): 31.203 vs 23.046
- Around 81% better performance in CompuBench 1.5 Desktop - T-Rex (Frames/s): 0.156 vs 0.086
Specifications (specs) | |
Launch date | May 2010 vs August 2008 |
Maximum core temperature | 72.6°C vs 72.4°C |
Manufacturing process technology | 32 nm vs 45 nm |
L1 cache | 64 KB (per core) vs 64 KB |
Benchmarks | |
PassMark - Single thread mark | 1340 vs 1321 |
PassMark - CPU mark | 1609 vs 1273 |
Geekbench 4 - Single Core | 478 vs 439 |
Geekbench 4 - Multi-Core | 1061 vs 754 |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 0.529 vs 0.344 |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 31.203 vs 23.046 |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.156 vs 0.086 |
Reasons to consider the Intel Core 2 Duo E8500
- Around 4% higher clock speed: 3.33 GHz vs 3.2 GHz
- 12x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 12% lower typical power consumption: 65 Watt vs 73 Watt
- Around 6% better performance in CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s): 2.496 vs 2.358
Specifications (specs) | |
Maximum frequency | 3.33 GHz vs 3.2 GHz |
L2 cache | 6144 KB vs 256 KB (per core) |
Thermal Design Power (TDP) | 65 Watt vs 73 Watt |
Benchmarks | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 2.496 vs 2.358 |
Compare benchmarks
CPU 1: Intel Core i3-550
CPU 2: Intel Core 2 Duo E8500
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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CompuBench 1.5 Desktop - Face Detection (mPixels/s) |
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CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) |
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CompuBench 1.5 Desktop - T-Rex (Frames/s) |
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CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) |
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Name | Intel Core i3-550 | Intel Core 2 Duo E8500 |
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PassMark - Single thread mark | 1340 | 1321 |
PassMark - CPU mark | 1609 | 1273 |
Geekbench 4 - Single Core | 478 | 439 |
Geekbench 4 - Multi-Core | 1061 | 754 |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 0.529 | 0.344 |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 31.203 | 23.046 |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.156 | 0.086 |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 0.842 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 2.358 | 2.496 |
Compare specifications (specs)
Intel Core i3-550 | Intel Core 2 Duo E8500 | |
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Essentials |
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Architecture codename | Clarkdale | Wolfdale |
Launch date | May 2010 | August 2008 |
Launch price (MSRP) | $101 | |
Place in performance rating | 2923 | 2937 |
Price now | $179.95 | $39.99 |
Processor Number | i3-550 | E8500 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
Status | Discontinued | Discontinued |
Value for money (0-100) | 4.63 | 16.84 |
Vertical segment | Desktop | Desktop |
Performance |
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64 bit support | ||
Base frequency | 3.20 GHz | 3.16 GHz |
Bus Speed | 2.5 GT/s DMI | 1333 MHz FSB |
Die size | 81 mm2 | 107 mm2 |
L1 cache | 64 KB (per core) | 64 KB |
L2 cache | 256 KB (per core) | 6144 KB |
L3 cache | 4096 KB (shared) | |
Manufacturing process technology | 32 nm | 45 nm |
Maximum core temperature | 72.6°C | 72.4°C |
Maximum frequency | 3.2 GHz | 3.33 GHz |
Number of cores | 2 | 2 |
Number of threads | 4 | |
Transistor count | 382 million | 410 million |
VID voltage range | 0.6500V-1.4000V | 0.8500V-1.3625V |
Maximum case temperature (TCase) | 72 °C | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 21 GB/s | |
Maximum memory size | 16.38 GB | |
Supported memory types | DDR3 1066/1333 | DDR1, DDR2, DDR3 |
Graphics |
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Graphics base frequency | 733 MHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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Number of displays supported | 2 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
Sockets supported | FCLGA1156 | LGA775 |
Thermal Design Power (TDP) | 73 Watt | 65 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16, 2x8 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 36-bit | |
Thermal Monitoring | ||
FSB parity | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |