Intel Core i3-7102E vs Intel Core i7-2715QE
Comparative analysis of Intel Core i3-7102E and Intel Core i7-2715QE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core i3-7102E
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
- 3.9x more maximum memory size: 64 GB vs 16.6 GB
- Around 80% lower typical power consumption: 25 Watt vs 45 Watt
- Around 1% better performance in PassMark - Single thread mark: 1302 vs 1287
Specifications (specs) | |
Manufacturing process technology | 14 nm vs 32 nm |
Maximum memory size | 64 GB vs 16.6 GB |
Thermal Design Power (TDP) | 25 Watt vs 45 Watt |
Benchmarks | |
PassMark - Single thread mark | 1302 vs 1287 |
Reasons to consider the Intel Core i7-2715QE
- 2 more cores, run more applications at once: 4 vs 2
- 4 more threads: 8 vs 4
- Around 24% better performance in PassMark - CPU mark: 3221 vs 2599
Specifications (specs) | |
Number of cores | 4 vs 2 |
Number of threads | 8 vs 4 |
Benchmarks | |
PassMark - CPU mark | 3221 vs 2599 |
Compare benchmarks
CPU 1: Intel Core i3-7102E
CPU 2: Intel Core i7-2715QE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i3-7102E | Intel Core i7-2715QE |
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PassMark - Single thread mark | 1302 | 1287 |
PassMark - CPU mark | 2599 | 3221 |
Compare specifications (specs)
Intel Core i3-7102E | Intel Core i7-2715QE | |
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Essentials |
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Architecture codename | Kaby Lake | Sandy Bridge |
Launch date | Q1'17 | January 2011 |
Place in performance rating | 1908 | 1913 |
Processor Number | i3-7102E | i7-2715QE |
Series | 7th Generation Intel® Core™ i3 Processors | Legacy Intel® Core™ Processors |
Status | Launched | Launched |
Vertical segment | Embedded | Embedded |
Performance |
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64 bit support | ||
Base frequency | 2.10 GHz | 2.10 GHz |
Manufacturing process technology | 14 nm | 32 nm |
Maximum core temperature | 100°C | 100 C |
Number of cores | 2 | 4 |
Number of threads | 4 | 8 |
Bus Speed | 5 GT/s DMI | |
Die size | 216 mm | |
L1 cache | 64 KB (per core) | |
L2 cache | 256 KB (per core) | |
L3 cache | 6144 KB (shared) | |
Maximum frequency | 3.00 GHz | |
Transistor count | 1160 million | |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 34.1 GB/s | |
Maximum memory size | 64 GB | 16.6 GB |
Supported memory types | DDR4-2400 | DDR3 1066/1333/1600 |
ECC memory support | ||
Graphics |
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Device ID | 0x591B | |
Graphics base frequency | 350 MHz | 650 MHz |
Graphics max dynamic frequency | 950 MHz | 1.20 GHz |
Intel® Clear Video HD technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel® HD Graphics 630 | Intel® HD Graphics 3000 |
Graphics max frequency | 1.2 GHz | |
Intel® Flexible Display Interface (Intel® FDI) | ||
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | 2 |
CRT | ||
SDVO | ||
Wireless Display (WiDi) support | ||
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@30Hz | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.5 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 42mm x 28 mm | 31mm x 24mm (FCBGA1023) |
Sockets supported | FCBGA1440 | FCBGA1023 |
Thermal Design Power (TDP) | 25 Watt | 45 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | 16 |
PCI Express revision | 3.0 | 2.0 |
PCIe configurations | 1x16,2x8,1x8+2x4 | 1x16, 2x8, 1x8+2x4 |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | Intel® AVX |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Flexible Display interface (FDI) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |