Nom de code de l’architecture |
Kaby Lake |
Sandy Bridge |
Date de sortie |
Q1'17 |
January 2011 |
Position dans l’évaluation de la performance |
1908 |
1913 |
Processor Number |
i3-7102E |
i7-2715QE |
Série |
7th Generation Intel® Core™ i3 Processors |
Legacy Intel® Core™ Processors |
Status |
Launched |
Launched |
Segment vertical |
Embedded |
Embedded |
Soutien de 64-bit |
|
|
Base frequency |
2.10 GHz |
2.10 GHz |
Processus de fabrication |
14 nm |
32 nm |
Température de noyau maximale |
100°C |
100 C |
Nombre de noyaux |
2 |
4 |
Nombre de fils |
4 |
8 |
Bus Speed |
|
5 GT/s DMI |
Taille de dé |
|
216 mm |
Cache L1 |
|
64 KB (per core) |
Cache L2 |
|
256 KB (per core) |
Cache L3 |
|
6144 KB (shared) |
Fréquence maximale |
|
3.00 GHz |
Compte de transistor |
|
1160 million |
Réseaux de mémoire maximale |
2 |
2 |
Bande passante de mémoire maximale |
34.1 GB/s |
|
Taille de mémore maximale |
64 GB |
16.6 GB |
Genres de mémoire soutenus |
DDR4-2400 |
DDR3 1066/1333/1600 |
Soutien de la mémoire ECC |
|
|
Device ID |
0x591B |
|
Graphics base frequency |
350 MHz |
650 MHz |
Graphics max dynamic frequency |
950 MHz |
1.20 GHz |
Technologie Intel® Clear Video HD |
|
|
Technologie Intel® InTru™ 3D |
|
|
Intel® Quick Sync Video |
|
|
Mémoire de vidéo maximale |
64 GB |
|
Graphiques du processeur |
Intel® HD Graphics 630 |
Intel® HD Graphics 3000 |
Freéquency maximale des graphiques |
|
1.2 GHz |
Intel® Flexible Display Interface (Intel® FDI) |
|
|
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Nombre d’écrans soutenu |
3 |
2 |
CRT |
|
|
SDVO |
|
|
Soutien du Wireless Display (WiDi) |
|
|
Soutien de la resolution 4K |
|
|
Résolution maximale sur DisplayPort |
4096x2304@60Hz |
|
Résolution maximale sur eDP |
4096x2304@60Hz |
|
Résolution maximale sur HDMI 1.4 |
4096x2304@30Hz |
|
DirectX |
12 |
|
OpenGL |
4.5 |
|
Low Halogen Options Available |
|
|
Nombre de CPUs maximale dans une configuration |
1 |
1 |
Package Size |
42mm x 28 mm |
31mm x 24mm (FCBGA1023) |
Prise courants soutenu |
FCBGA1440 |
FCBGA1023 |
Thermal Design Power (TDP) |
25 Watt |
45 Watt |
Nombre maximale des voies PCIe |
16 |
16 |
Révision PCI Express |
3.0 |
2.0 |
PCIe configurations |
1x16,2x8,1x8+2x4 |
1x16, 2x8, 1x8+2x4 |
Execute Disable Bit (EDB) |
|
|
Technologie Intel® Identity Protection |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Intel® OS Guard |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Secure Boot |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
Idle States |
|
|
Extensions de l’ensemble d’instructions |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel® AVX |
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Technologie Intel® Hyper-Threading |
|
|
Intel® TSX-NI |
|
|
Technologie Intel® Turbo Boost |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Thermal Monitoring |
|
|
Flexible Display interface (FDI) |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
Intel® Demand Based Switching |
|
|
Intel® Fast Memory Access |
|
|
Intel® Flex Memory Access |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|