Intel Core i3-9100HL vs AMD Phenom II X2 560 BE

Comparative analysis of Intel Core i3-9100HL and AMD Phenom II X2 560 BE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core i3-9100HL

AMD Phenom II X2 560 BE

Differences

Reasons to consider the Intel Core i3-9100HL

CPU is newer: launch date 8 year(s) 7 month(s) later
2 more cores, run more applications at once: 4 vs 2
A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
3.2x lower typical power consumption: 25 Watt vs 80 Watt
Around 99% better performance in PassMark - CPU mark: 2745 vs 1381

Specifications (specs)
Launch date	1 Apr 2019 vs September 2010
Number of cores	4 vs 2
Manufacturing process technology	14 nm vs 45 nm
Thermal Design Power (TDP)	25 Watt vs 80 Watt
Benchmarks
PassMark - CPU mark	2745 vs 1381

Reasons to consider the AMD Phenom II X2 560 BE

Processor is unlocked, an unlocked multiplier allows for easier overclocking
Around 14% higher clock speed: 3.3 GHz vs 2.9 GHz
Around 53% better performance in PassMark - Single thread mark: 1365 vs 892

Specifications (specs)
Unlocked	Unlocked vs Locked
Maximum frequency	3.3 GHz vs 2.9 GHz
Benchmarks
PassMark - Single thread mark	1365 vs 892

Compare benchmarks

CPU 1: Intel Core i3-9100HL
CPU 2: AMD Phenom II X2 560 BE

PassMark - Single thread mark

CPU 1

CPU 2

892

1365

PassMark - CPU mark

CPU 1

CPU 2

2745

1381

Name	Intel Core i3-9100HL	AMD Phenom II X2 560 BE
PassMark - Single thread mark	892	1365
PassMark - CPU mark	2745	1381
Geekbench 4 - Single Core		426
Geekbench 4 - Multi-Core		764

Compare specifications (specs)

	Intel Core i3-9100HL	AMD Phenom II X2 560 BE
Essentials
Launch date	1 Apr 2019	September 2010
Launch price (MSRP)	$225
Place in performance rating	2361	2400
Architecture codename		Callisto
Vertical segment		Desktop
Performance
Base frequency	1600 MHz
Die size	126 mm²	258 mm
L1 cache	64 KB (per core)	128 KB (per core)
L2 cache	256 KB (per core)	512 KB (per core)
L3 cache	6 MB (shared)	6144 KB (shared)
Manufacturing process technology	14 nm	45 nm
Maximum case temperature (TCase)	72°C
Maximum core temperature	100°C
Maximum frequency	2.9 GHz	3.3 GHz
Number of cores	4	2
Number of threads	4
Unlocked
64 bit support
Transistor count		758 million
Memory
ECC memory support
Supported memory types	DDR4	DDR3
Compatibility
Max number of CPUs in a configuration	1	1
Sockets supported	Intel BGA 1440	AM3
Thermal Design Power (TDP)	25 Watt	80 Watt
Peripherals
PCIe configurations	Gen 3, 16 Lanes, (CPU only)