Intel Core i7-870 vs Intel Core 2 Duo SL9380
Comparative analysis of Intel Core i7-870 and Intel Core 2 Duo SL9380 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core i7-870
- 2 more cores, run more applications at once: 4 vs 2
- 6 more threads: 8 vs 2
- Around 100% higher clock speed: 3.60 GHz vs 1.8 GHz
Number of cores | 4 vs 2 |
Number of threads | 8 vs 2 |
Maximum frequency | 3.60 GHz vs 1.8 GHz |
Reasons to consider the Intel Core 2 Duo SL9380
- Around 44% higher maximum core temperature: 105°C vs 72.7°C
- 6x more L2 cache, more data can be stored in the L2 cache for quick access later
- 5.6x lower typical power consumption: 17 Watt vs 95 Watt
Maximum core temperature | 105°C vs 72.7°C |
L2 cache | 6 MB vs 256 KB (per core) |
Thermal Design Power (TDP) | 17 Watt vs 95 Watt |
Compare benchmarks
CPU 1: Intel Core i7-870
CPU 2: Intel Core 2 Duo SL9380
Name | Intel Core i7-870 | Intel Core 2 Duo SL9380 |
---|---|---|
PassMark - Single thread mark | 1384 | |
PassMark - CPU mark | 3157 | |
Geekbench 4 - Single Core | 547 | |
Geekbench 4 - Multi-Core | 2032 | |
3DMark Fire Strike - Physics Score | 2453 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.029 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 53.478 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.342 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.541 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 4.602 |
Compare specifications (specs)
Intel Core i7-870 | Intel Core 2 Duo SL9380 | |
---|---|---|
Essentials |
||
Architecture codename | Lynnfield | Penryn |
Launch date | September 2009 | 20 August 2009 |
Launch price (MSRP) | $197 | |
Place in performance rating | 2673 | not rated |
Price now | $98.99 | |
Processor Number | i7-870 | SL9380 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
Status | Discontinued | Discontinued |
Value for money (0-100) | 15.90 | |
Vertical segment | Desktop | Mobile |
Performance |
||
64 bit support | ||
Base frequency | 2.93 GHz | 1.80 GHz |
Bus Speed | 2.5 GT/s DMI | 800 MHz FSB |
Die size | 296 mm2 | 107 mm2 |
L1 cache | 64 KB (per core) | |
L2 cache | 256 KB (per core) | 6 MB |
L3 cache | 8192 KB (shared) | |
Manufacturing process technology | 45 nm | 45 nm |
Maximum core temperature | 72.7°C | 105°C |
Maximum frequency | 3.60 GHz | 1.8 GHz |
Number of cores | 4 | 2 |
Number of threads | 8 | 2 |
Transistor count | 774 million | 410 million |
VID voltage range | 0.6500V-1.4000V | 1.050V-1.150V |
Front-side bus (FSB) | 800 MHz | |
Memory |
||
Max memory channels | 2 | |
Maximum memory bandwidth | 21 GB/s | |
Maximum memory size | 16 GB | |
Supported memory types | DDR3 1066/1333 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | 22mm x 22mm |
Sockets supported | LGA1156 | BGA956 |
Thermal Design Power (TDP) | 95 Watt | 17 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16, 2x8 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 36-bit | |
Thermal Monitoring | ||
FSB parity | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |