Intel Core i9-10900TE vs AMD Ryzen 5 4600HS
Comparative analysis of Intel Core i9-10900TE and AMD Ryzen 5 4600HS processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core i9-10900TE
- CPU is newer: launch date 3 month(s) later
- 4 more cores, run more applications at once: 10 vs 6
- 8 more threads: 20 vs 12
- Around 13% higher clock speed: 4.50 GHz vs 4.0 GHz
- Around 82% more L3 cache; more data can be stored in the L3 cache for quick access later
- 4x more maximum memory size: 128 GB vs 32 GB
- Around 1% better performance in PassMark - Single thread mark: 2430 vs 2406
- Around 3% better performance in PassMark - CPU mark: 14679 vs 14290
| Specifications (specs) | |
| Launch date | 30 Apr 2020 vs 6 Jan 2020 |
| Number of cores | 10 vs 6 |
| Number of threads | 20 vs 12 |
| Maximum frequency | 4.50 GHz vs 4.0 GHz |
| L3 cache | 20 MB vs 11 MB |
| Maximum memory size | 128 GB vs 32 GB |
| Benchmarks | |
| PassMark - Single thread mark | 2430 vs 2406 |
| PassMark - CPU mark | 14679 vs 14290 |
Reasons to consider the AMD Ryzen 5 4600HS
- Around 5% higher maximum core temperature: 105 °C vs 100°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- Around 20% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 20% more L2 cache; more data can be stored in the L2 cache for quick access later
| Maximum core temperature | 105 °C vs 100°C |
| Manufacturing process technology | 7 nm vs 14 nm |
| L1 cache | 768 KB vs 640 KB |
| L2 cache | 3 MB vs 2.5 MB |
Compare benchmarks
CPU 1: Intel Core i9-10900TE
CPU 2: AMD Ryzen 5 4600HS
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Core i9-10900TE | AMD Ryzen 5 4600HS |
|---|---|---|
| PassMark - Single thread mark | 2430 | 2406 |
| PassMark - CPU mark | 14679 | 14290 |
Compare specifications (specs)
| Intel Core i9-10900TE | AMD Ryzen 5 4600HS | |
|---|---|---|
Essentials |
||
| Architecture codename | Comet Lake | Zen 2 |
| Launch date | 30 Apr 2020 | 6 Jan 2020 |
| Launch price (MSRP) | $444 | |
| Place in performance rating | 915 | 932 |
| Processor Number | i9-10900TE | |
| Series | 10th Generation Intel Core i9 Processors | |
| Status | Launched | |
| Vertical segment | Embedded | Mobile |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.80 GHz | 3.0 GHz |
| Bus Speed | 8 GT/s | |
| L1 cache | 640 KB | 768 KB |
| L2 cache | 2.5 MB | 3 MB |
| L3 cache | 20 MB | 11 MB |
| Manufacturing process technology | 14 nm | 7 nm |
| Maximum core temperature | 100°C | 105 °C |
| Maximum frequency | 4.50 GHz | 4.0 GHz |
| Number of cores | 10 | 6 |
| Number of threads | 20 | 12 |
| Transistor count | 9800 million | |
Memory |
||
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 45.8 GB/s | |
| Maximum memory size | 128 GB | 32 GB |
| Supported memory types | DDR4-2933 | DDR4-4266 |
| ECC memory support | ||
Graphics |
||
| Device ID | 0x9BC5 | |
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 1.20 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 64 GB | |
| Processor graphics | Intel UHD Graphics 630 | |
Graphics interfaces |
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| DisplayPort | ||
| DVI | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | |
Graphics image quality |
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| 4K resolution support | ||
| Max resolution over DisplayPort | 4096 x 2304@60Hz | |
| Max resolution over eDP | 4096 x 2304@60Hz | |
Graphics API support |
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| DirectX | 12 | |
| OpenGL | 4.5 | |
Compatibility |
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| Max number of CPUs in a configuration | 1 | |
| Package Size | 37.5mm x 37.5mm | |
| Sockets supported | FCLGA1200 | FP6 |
| Thermal Design Power (TDP) | 35 Watt | 35 Watt |
| Thermal Solution | PCG 2015B | |
Peripherals |
||
| Max number of PCIe lanes | 16 | 12 |
| PCI Express revision | 3.0 | 3.0 |
| PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
| Scalability | 1S Only | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||