Intel Core i9-12900TE vs AMD Ryzen Embedded V2718
Comparative analysis of Intel Core i9-12900TE and AMD Ryzen Embedded V2718 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core i9-12900TE
- CPU is newer: launch date 1 year(s) 1 month(s) later
- 8 more cores, run more applications at once: 16 vs 8
- 8 more threads: 24 vs 16
- Around 16% higher clock speed: 4.80 GHz vs 4.15 GHz
- 2.5x more L1 cache, more data can be stored in the L1 cache for quick access later
- 5x more L2 cache, more data can be stored in the L2 cache for quick access later
- 3.8x more L3 cache, more data can be stored in the L3 cache for quick access later
- 2x more maximum memory size: 128 GB vs 64 GB
- Around 8% better performance in PassMark - Single thread mark: 2419 vs 2240
- Around 42% better performance in PassMark - CPU mark: 22887 vs 16075
| Specifications (specs) | |
| Launch date | 4 Jan 2022 vs 10 Nov 2020 |
| Number of cores | 16 vs 8 |
| Number of threads | 24 vs 16 |
| Maximum frequency | 4.80 GHz vs 4.15 GHz |
| L1 cache | 1280 KB vs 512 KB |
| L2 cache | 20 MB vs 4 MB |
| L3 cache | 30 MB vs 8 MB |
| Maximum memory size | 128 GB vs 64 GB |
| Benchmarks | |
| PassMark - Single thread mark | 2419 vs 2240 |
| PassMark - CPU mark | 22887 vs 16075 |
Reasons to consider the AMD Ryzen Embedded V2718
- Around 5% higher maximum core temperature: 105 °C vs 100°C
- 2.3x lower typical power consumption: 15 Watt vs 35 Watt
| Maximum core temperature | 105 °C vs 100°C |
| Thermal Design Power (TDP) | 15 Watt vs 35 Watt |
Compare benchmarks
CPU 1: Intel Core i9-12900TE
CPU 2: AMD Ryzen Embedded V2718
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Core i9-12900TE | AMD Ryzen Embedded V2718 |
|---|---|---|
| PassMark - Single thread mark | 2419 | 2240 |
| PassMark - CPU mark | 22887 | 16075 |
Compare specifications (specs)
| Intel Core i9-12900TE | AMD Ryzen Embedded V2718 | |
|---|---|---|
Essentials |
||
| Architecture codename | Alder Lake | Zen 2 |
| Launch date | 4 Jan 2022 | 10 Nov 2020 |
| Launch price (MSRP) | $544 | |
| Place in performance rating | 801 | 985 |
| Processor Number | i9-12900TE | |
| Series | 12th Generation Intel Core i9 Processors | |
| Vertical segment | Embedded | |
| OPN Tray | 100-000000242 | |
Performance |
||
| 64 bit support | ||
| L1 cache | 1280 KB | 512 KB |
| L2 cache | 20 MB | 4 MB |
| L3 cache | 30 MB | 8 MB |
| Manufacturing process technology | 7 nm | 7 nm |
| Maximum core temperature | 100°C | 105 °C |
| Maximum frequency | 4.80 GHz | 4.15 GHz |
| Number of cores | 16 | 8 |
| Number of threads | 24 | 16 |
| Base frequency | 1.7 GHz | |
Memory |
||
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 76.8 GB/s | 63.58 GB/s |
| Maximum memory size | 128 GB | 64 GB |
| Supported memory types | Up to DDR5 4800 MT/s Up to DDR4 3200 MT/s | DDR4-3200, LPDDR4x-4266 |
| ECC memory support | ||
Graphics |
||
| Device ID | 0x4680 | |
| Execution Units | 32 | |
| Graphics base frequency | 300 MHz | |
| Graphics max dynamic frequency | 1.55 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel UHD Graphics 770 | Radeon Vega 7 |
| Graphics max frequency | 1600 MHz | |
| iGPU core count | 7 | |
| Number of pipelines | 448 | |
Graphics interfaces |
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| Number of displays supported | 4 | 4 |
| DisplayPort | ||
| HDMI | ||
Graphics image quality |
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| Max resolution over DisplayPort | 7680 x 4320 @ 60Hz | 4096x2160 |
| Max resolution over eDP | 5120 x 3200 @ 120Hz | |
| Max resolution over HDMI 1.4 | 4096x2160 | |
Graphics API support |
||
| DirectX | 12 | |
| OpenGL | 4.5 | |
Compatibility |
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| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 45.0 mm x 37.5 mm | |
| Sockets supported | FCLGA1700 | FP6 |
| Thermal Design Power (TDP) | 35 Watt | 15 Watt |
| Thermal Solution | PCG 2020D | |
| Configurable TDP | 10-25 Watt | |
Peripherals |
||
| Max number of PCIe lanes | 20 | 20 |
| PCI Express revision | 5.0 and 4.0 | 3.0 |
| PCIe configurations | Up to 1x16+4, 2x8+4 | |
| Scalability | 1S Only | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Turbo Boost technology | ||
| Intel® Volume Management Device (VMD) | ||
| Speed Shift technology | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||