Intel Core i9-8950HK vs Intel Core i7-3517UE
Comparative analysis of Intel Core i9-8950HK and Intel Core i7-3517UE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i9-8950HK
- CPU is newer: launch date 5 year(s) 9 month(s) later
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 4 more cores, run more applications at once: 6 vs 2
- 8 more threads: 12 vs 4
- Around 71% higher clock speed: 4.80 GHz vs 2.80 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- 3x more L1 cache, more data can be stored in the L1 cache for quick access later
- 3x more L2 cache, more data can be stored in the L2 cache for quick access later
- 3x more L3 cache, more data can be stored in the L3 cache for quick access later
- 4x more maximum memory size: 64 GB vs 16 GB
- Around 70% better performance in PassMark - Single thread mark: 2430 vs 1433
- 4.4x better performance in PassMark - CPU mark: 10462 vs 2384
Specifications (specs) | |
Launch date | 3 March 2018 vs June 2012 |
Unlocked | Unlocked vs Locked |
Number of cores | 6 vs 2 |
Number of threads | 12 vs 4 |
Maximum frequency | 4.80 GHz vs 2.80 GHz |
Manufacturing process technology | 14 nm vs 22 nm |
L1 cache | 384 KB vs 64 KB (per core) |
L2 cache | 1.5 MB vs 256 KB (per core) |
L3 cache | 12 MB vs 4096 KB (shared) |
Maximum memory size | 64 GB vs 16 GB |
Benchmarks | |
PassMark - Single thread mark | 2430 vs 1433 |
PassMark - CPU mark | 10462 vs 2384 |
Reasons to consider the Intel Core i7-3517UE
- Around 5% higher maximum core temperature: 105°C vs 100°C
- 2.6x lower typical power consumption: 17 Watt vs 45 Watt
Maximum core temperature | 105°C vs 100°C |
Thermal Design Power (TDP) | 17 Watt vs 45 Watt |
Compare benchmarks
CPU 1: Intel Core i9-8950HK
CPU 2: Intel Core i7-3517UE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i9-8950HK | Intel Core i7-3517UE |
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PassMark - Single thread mark | 2430 | 1433 |
PassMark - CPU mark | 10462 | 2384 |
Geekbench 4 - Single Core | 1117 | |
Geekbench 4 - Multi-Core | 5166 | |
3DMark Fire Strike - Physics Score | 5686 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 7.809 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 65.701 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.914 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 3.409 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 8.455 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 1687 | |
GFXBench 4.0 - Manhattan (Frames) | 812 | |
GFXBench 4.0 - T-Rex (Frames) | 1678 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 1687 | |
GFXBench 4.0 - Manhattan (Fps) | 812 | |
GFXBench 4.0 - T-Rex (Fps) | 1678 |
Compare specifications (specs)
Intel Core i9-8950HK | Intel Core i7-3517UE | |
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Essentials |
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Architecture codename | Coffee Lake | Ivy Bridge |
Launch date | 3 March 2018 | June 2012 |
Launch price (MSRP) | $583 | |
Place in performance rating | 1768 | 1775 |
Price now | $583 | |
Processor Number | i9-8950HK | i7-3517UE |
Series | 8th Generation Intel® Core™ i9 Processors | Legacy Intel® Core™ Processors |
Status | Launched | Launched |
Value for money (0-100) | 7.32 | |
Vertical segment | Mobile | Embedded |
Performance |
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64 bit support | ||
Base frequency | 2.90 GHz | 1.70 GHz |
Bus Speed | 8 GT/s DMI | 5 GT/s DMI |
Die size | 149 mm | 118 mm |
L1 cache | 384 KB | 64 KB (per core) |
L2 cache | 1.5 MB | 256 KB (per core) |
L3 cache | 12 MB | 4096 KB (shared) |
Manufacturing process technology | 14 nm | 22 nm |
Maximum case temperature (TCase) | 72 °C | |
Maximum core temperature | 100°C | 105°C |
Maximum frequency | 4.80 GHz | 2.80 GHz |
Number of cores | 6 | 2 |
Number of threads | 12 | 4 |
Unlocked | ||
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 41.8 GB/s | 25.6 GB/s |
Maximum memory size | 64 GB | 16 GB |
Supported memory types | DDR4-2666, LPDDR3-2133 | DDR3/DDR3L 1333/1600 |
ECC memory support | ||
Graphics |
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Device ID | 0x3E9B | |
Graphics base frequency | 350 MHz | 350 MHz |
Graphics max dynamic frequency | 1.20 GHz | 1.00 GHz |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel® UHD Graphics 630 | Intel® HD Graphics 4000 |
Graphics max frequency | 1 GHz | |
Intel® Flexible Display Interface (Intel® FDI) | ||
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | 3 |
CRT | ||
SDVO | ||
Wireless Display (WiDi) support | ||
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@30Hz | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.5 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 42mm x 28mm | 31mm x 24mm |
Sockets supported | FCBGA1440 | FCBGA1023 |
Thermal Design Power (TDP) | 45 Watt | 17 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | 16 |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | 1x16 2x8 1x8 2x4 |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Anti-Theft technology | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | Intel® AVX |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® Thermal Velocity Boost | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Speed Shift technology | ||
Thermal Monitoring | ||
4G WiMAX Wireless | ||
Flexible Display interface (FDI) | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |