Intel Pentium 4 HT 540 vs Intel Celeron 2.10

Comparative analysis of Intel Pentium 4 HT 540 and Intel Celeron 2.10 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Pentium 4 HT 540

  • CPU is newer: launch date 1 year(s) 7 month(s) later
  • Around 52% higher clock speed: 3.2 GHz vs 2.1 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 90 nm vs 130 nm
  • 2x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 8x more L2 cache, more data can be stored in the L2 cache for quick access later
Launch date June 2004 vs November 2002
Maximum frequency 3.2 GHz vs 2.1 GHz
Manufacturing process technology 90 nm vs 130 nm
L1 cache 16 KB vs 8 KB
L2 cache 1024 KB vs 128 KB

Reasons to consider the Intel Celeron 2.10

  • Around 50% lower typical power consumption: 55.5 Watt vs 84 Watt
Thermal Design Power (TDP) 55.5 Watt vs 84 Watt

Compare benchmarks

CPU 1: Intel Pentium 4 HT 540
CPU 2: Intel Celeron 2.10

Name Intel Pentium 4 HT 540 Intel Celeron 2.10
Geekbench 4 - Single Core 151
Geekbench 4 - Multi-Core 217
PassMark - Single thread mark 0
PassMark - CPU mark 244

Compare specifications (specs)

Intel Pentium 4 HT 540 Intel Celeron 2.10

Essentials

Architecture codename Prescott Northwood
Launch date June 2004 November 2002
Place in performance rating 3305 3348
Vertical segment Desktop Desktop
Series Legacy Intel® Celeron® Processor
Status Discontinued

Performance

Die size 109 mm 131 mm2
L1 cache 16 KB 8 KB
L2 cache 1024 KB 128 KB
Manufacturing process technology 90 nm 130 nm
Maximum frequency 3.2 GHz 2.1 GHz
Number of cores 1 1
Transistor count 125 million 55 million
64 bit support
Base frequency 2.10 GHz
Bus Speed 400 MHz FSB
Maximum core temperature 69°C
VID voltage range 1.315V-1.525V

Memory

Supported memory types DDR1, DDR2, DDR3 DDR1, DDR2

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported 775 PPGA478
Thermal Design Power (TDP) 84 Watt 55.5 Watt
Low Halogen Options Available
Package Size 35mm x 35mm

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 32-bit

Virtualization

Intel® Virtualization Technology (VT-x)