Intel Pentium 4 HT 540 vs Intel Pentium III 1000

Comparative analysis of Intel Pentium 4 HT 540 and Intel Pentium III 1000 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark.

Intel Pentium 4 HT 540

Intel Pentium III 1000

Differences

Reasons to consider the Intel Pentium 4 HT 540

Around 220% higher clock speed: 3.2 GHz vs 1 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 90 nm vs 180 nm
2x more L1 cache, more data can be stored in the L1 cache for quick access later
4x more L2 cache, more data can be stored in the L2 cache for quick access later

Maximum frequency	3.2 GHz vs 1 GHz
Manufacturing process technology	90 nm vs 180 nm
L1 cache	16 KB vs 8 KB
L2 cache	1024 KB vs 256 KB

Reasons to consider the Intel Pentium III 1000

2.9x lower typical power consumption: 29 Watt vs 84 Watt

Thermal Design Power (TDP)	29 Watt vs 84 Watt

Compare benchmarks

CPU 1: Intel Pentium 4 HT 540
CPU 2: Intel Pentium III 1000

Name	Intel Pentium 4 HT 540	Intel Pentium III 1000
Geekbench 4 - Single Core	151
Geekbench 4 - Multi-Core	217
PassMark - Single thread mark		0
PassMark - CPU mark		245

Compare specifications (specs)

	Intel Pentium 4 HT 540	Intel Pentium III 1000
Essentials
Architecture codename	Prescott	Coppermine
Launch date	June 2004	Q1'00
Place in performance rating	3315	3362
Vertical segment	Desktop	Desktop
Series		Legacy Intel® Pentium® Processor
Status		Discontinued
Performance
Die size	109 mm	80 mm
L1 cache	16 KB	8 KB
L2 cache	1024 KB	256 KB
Manufacturing process technology	90 nm	180 nm
Maximum frequency	3.2 GHz	1 GHz
Number of cores	1	1
Transistor count	125 million	44 million
64 bit support
Base frequency		1.00 GHz
Bus Speed		133 MHz FSB
Maximum case temperature (TCase)		69 °C
Maximum core temperature		75°C
VID voltage range		1.75V
Memory
Supported memory types	DDR1, DDR2, DDR3
Compatibility
Max number of CPUs in a configuration	1	1
Sockets supported	775	PPGA370, SECC2, SECC2495
Thermal Design Power (TDP)	84 Watt	29 Watt
Low Halogen Options Available
Advanced Technologies
Intel® Turbo Boost technology
Virtualization
Intel® Virtualization Technology (VT-x)