Intel Pentium 4 HT 540 vs Intel Pentium III 1133

Comparative analysis of Intel Pentium 4 HT 540 and Intel Pentium III 1133 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Pentium 4 HT 540

  • CPU is newer: launch date 2 year(s) 11 month(s) later
  • Around 183% higher clock speed: 3.2 GHz vs 1.13 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 90 nm vs 130 nm
  • 2x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
Launch date June 2004 vs July 2001
Maximum frequency 3.2 GHz vs 1.13 GHz
Manufacturing process technology 90 nm vs 130 nm
L1 cache 16 KB vs 8 KB
L2 cache 1024 KB vs 256 KB

Reasons to consider the Intel Pentium III 1133

  • 2.9x lower typical power consumption: 29.1 Watt vs 84 Watt
Thermal Design Power (TDP) 29.1 Watt vs 84 Watt

Compare benchmarks

CPU 1: Intel Pentium 4 HT 540
CPU 2: Intel Pentium III 1133

Name Intel Pentium 4 HT 540 Intel Pentium III 1133
Geekbench 4 - Single Core 151
Geekbench 4 - Multi-Core 217
PassMark - Single thread mark 0
PassMark - CPU mark 284

Compare specifications (specs)

Intel Pentium 4 HT 540 Intel Pentium III 1133

Essentials

Architecture codename Prescott Tualatin
Launch date June 2004 July 2001
Place in performance rating 3305 3353
Vertical segment Desktop Desktop
Series Legacy Intel® Pentium® Processor
Status Discontinued

Performance

Die size 109 mm 80 mm2
L1 cache 16 KB 8 KB
L2 cache 1024 KB 256 KB
Manufacturing process technology 90 nm 130 nm
Maximum frequency 3.2 GHz 1.13 GHz
Number of cores 1 1
Transistor count 125 million 44 million
64 bit support
Base frequency 1.13 GHz
Bus Speed 133 MHz FSB
Maximum case temperature (TCase) 69 °C
Maximum core temperature 69°C
VID voltage range 1.5V

Memory

Supported memory types DDR1, DDR2, DDR3

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported 775 PPGA370
Thermal Design Power (TDP) 84 Watt 29.1 Watt
Low Halogen Options Available

Advanced Technologies

Intel® Turbo Boost technology

Virtualization

Intel® Virtualization Technology (VT-x)