Intel Pentium 4 HT 540 vs Intel Pentium III 1133

Comparative analysis of Intel Pentium 4 HT 540 and Intel Pentium III 1133 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark.

Intel Pentium 4 HT 540

Intel Pentium III 1133

Differences

Reasons to consider the Intel Pentium 4 HT 540

CPU is newer: launch date 2 year(s) 11 month(s) later
Around 183% higher clock speed: 3.2 GHz vs 1.13 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 90 nm vs 130 nm
2x more L1 cache, more data can be stored in the L1 cache for quick access later
4x more L2 cache, more data can be stored in the L2 cache for quick access later

Launch date	June 2004 vs July 2001
Maximum frequency	3.2 GHz vs 1.13 GHz
Manufacturing process technology	90 nm vs 130 nm
L1 cache	16 KB vs 8 KB
L2 cache	1024 KB vs 256 KB

Reasons to consider the Intel Pentium III 1133

2.9x lower typical power consumption: 29.1 Watt vs 84 Watt

Thermal Design Power (TDP)	29.1 Watt vs 84 Watt

Compare benchmarks

CPU 1: Intel Pentium 4 HT 540
CPU 2: Intel Pentium III 1133

Name	Intel Pentium 4 HT 540	Intel Pentium III 1133
Geekbench 4 - Single Core	151
Geekbench 4 - Multi-Core	217
PassMark - Single thread mark		0
PassMark - CPU mark		284

Compare specifications (specs)

	Intel Pentium 4 HT 540	Intel Pentium III 1133
Essentials
Architecture codename	Prescott	Tualatin
Launch date	June 2004	July 2001
Place in performance rating	3315	3363
Vertical segment	Desktop	Desktop
Series		Legacy Intel® Pentium® Processor
Status		Discontinued
Performance
Die size	109 mm	80 mm2
L1 cache	16 KB	8 KB
L2 cache	1024 KB	256 KB
Manufacturing process technology	90 nm	130 nm
Maximum frequency	3.2 GHz	1.13 GHz
Number of cores	1	1
Transistor count	125 million	44 million
64 bit support
Base frequency		1.13 GHz
Bus Speed		133 MHz FSB
Maximum case temperature (TCase)		69 °C
Maximum core temperature		69°C
VID voltage range		1.5V
Memory
Supported memory types	DDR1, DDR2, DDR3
Compatibility
Max number of CPUs in a configuration	1	1
Sockets supported	775	PPGA370
Thermal Design Power (TDP)	84 Watt	29.1 Watt
Low Halogen Options Available
Advanced Technologies
Intel® Turbo Boost technology
Virtualization
Intel® Virtualization Technology (VT-x)