Intel Pentium Dual Core SU4100 vs Intel Core Duo T2300

Comparative analysis of Intel Pentium Dual Core SU4100 and Intel Core Duo T2300 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies, Memory, Security & Reliability, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Pentium Dual Core SU4100

Intel Core Duo T2300

Differences

Reasons to consider the Intel Pentium Dual Core SU4100

CPU is newer: launch date 3 year(s) 8 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
3.1x lower typical power consumption: 10 Watt vs 31 Watt

Launch date	1 September 2009 vs January 2006
Manufacturing process technology	45 nm vs 65 nm
Thermal Design Power (TDP)	10 Watt vs 31 Watt

Reasons to consider the Intel Core Duo T2300

Around 28% higher clock speed: 1.66 GHz vs 1.3 GHz

Maximum frequency	1.66 GHz vs 1.3 GHz

Compare benchmarks

CPU 1: Intel Pentium Dual Core SU4100
CPU 2: Intel Core Duo T2300

Name	Intel Pentium Dual Core SU4100	Intel Core Duo T2300
PassMark - Single thread mark		509
PassMark - CPU mark		325

Compare specifications (specs)

	Intel Pentium Dual Core SU4100	Intel Core Duo T2300
Essentials
Architecture codename	Penryn	Yonah
Launch date	1 September 2009	January 2006
Place in performance rating	not rated	3005
Series	Intel Pentium Dual Core	Legacy Intel® Core™ Processors
Vertical segment	Laptop	Mobile
Processor Number		T2300
Status		Discontinued
Performance
64 bit support
Die size	107 mm	90 mm2
Front-side bus (FSB)	800 MHz	667 MHz
L2 cache	2048 KB	2048 KB
Manufacturing process technology	45 nm	65 nm
Maximum frequency	1.3 GHz	1.66 GHz
Number of cores	2	2
Number of threads	2	2
Transistor count	410 Million	151 million
Base frequency		1.66 GHz
Bus Speed		667 MHz FSB
Maximum core temperature		100°C
VID voltage range		1.1625V - 1.30V
Compatibility
Sockets supported	BGA956	PPGA478, PBGA479
Thermal Design Power (TDP)	10 Watt	31 Watt
Low Halogen Options Available
Max number of CPUs in a configuration		1
Package Size		35mm x 35mm
Scenario Design Power (SDP)		0 W
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE)		32-bit
Memory
Supported memory types		DDR1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Virtualization
Intel® Virtualization Technology (VT-x)