Intel Pentium G2140 vs Intel Celeron D 352

Comparative analysis of Intel Pentium G2140 and Intel Celeron D 352 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Pentium G2140

Intel Celeron D 352

Differences

Reasons to consider the Intel Pentium G2140

1 more cores, run more applications at once: 2 vs 1
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
Around 56% lower typical power consumption: 55 Watt vs 86 Watt
3.2x better performance in PassMark - Single thread mark: 1842 vs 576
7.6x better performance in PassMark - CPU mark: 2092 vs 274

Specifications (specs)
Number of cores	2 vs 1
Manufacturing process technology	22 nm vs 65 nm
Thermal Design Power (TDP)	55 Watt vs 86 Watt
Benchmarks
PassMark - Single thread mark	1842 vs 576
PassMark - CPU mark	2092 vs 274

Compare benchmarks

CPU 1: Intel Pentium G2140
CPU 2: Intel Celeron D 352

PassMark - Single thread mark

CPU 1

CPU 2

1842

576

PassMark - CPU mark

CPU 1

CPU 2

2092

274

Name	Intel Pentium G2140	Intel Celeron D 352
PassMark - Single thread mark	1842	576
PassMark - CPU mark	2092	274
Geekbench 4 - Single Core	2964
Geekbench 4 - Multi-Core	4999

Compare specifications (specs)

	Intel Pentium G2140	Intel Celeron D 352
Essentials
Architecture codename	Ivy Bridge	Cedarmill
Launch date	Q2'13	May 2006
Place in performance rating	1004	2895
Processor Number	G2140	352
Series	Intel® Pentium® Processor G Series	Legacy Intel® Celeron® Processor
Status	Discontinued	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	3.30 GHz	3.20 GHz
Bus Speed	5 GT/s DMI	533 MHz FSB
Manufacturing process technology	22 nm	65 nm
Number of cores	2	1
Number of threads	2
Die size		81 mm2
L1 cache		16 KB
L2 cache		512 KB
Maximum core temperature		69.2°C
Maximum frequency		3.2 GHz
Transistor count		188 million
VID voltage range		1.25V-1.325V
Memory
Max memory channels	2
Maximum memory bandwidth	25.6 GB/s
Maximum memory size	32 GB
Supported memory types	DDR3 1333/1600	DDR1, DDR2, DDR3
Graphics
Graphics base frequency	650 MHz
Graphics max dynamic frequency	1.05 GHz
Intel® Clear Video HD technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics
Graphics interfaces
Number of displays supported	3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm	37.5mm x 37.5mm
Sockets supported	FCLGA1155	PLGA775
Thermal Design Power (TDP)	55 Watt	86 Watt
Thermal Solution	2011C
Peripherals
PCI Express revision	2.0
PCIe configurations	up to 1x16, 2x8, 1x8 & 2x4
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Optane™ Memory Supported
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
FSB parity
Intel® Demand Based Switching
Physical Address Extensions (PAE)		32-bit
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)