Intel Pentium G3470 vs AMD Phenom II X3 B75

Comparative analysis of Intel Pentium G3470 and AMD Phenom II X3 B75 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Pentium G3470

AMD Phenom II X3 B75

Differences

Reasons to consider the Intel Pentium G3470

A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
Around 79% lower typical power consumption: 53 Watt vs 95 Watt
Around 67% better performance in PassMark - Single thread mark: 2089 vs 1250
Around 39% better performance in PassMark - CPU mark: 2428 vs 1751
Around 95% better performance in Geekbench 4 - Single Core: 3722 vs 1905
Around 44% better performance in Geekbench 4 - Multi-Core: 6384 vs 4439

Specifications (specs)
Manufacturing process technology	22 nm vs 45 nm
Thermal Design Power (TDP)	53 Watt vs 95 Watt
Benchmarks
PassMark - Single thread mark	2089 vs 1250
PassMark - CPU mark	2428 vs 1751
Geekbench 4 - Single Core	3722 vs 1905
Geekbench 4 - Multi-Core	6384 vs 4439

Reasons to consider the AMD Phenom II X3 B75

1 more cores, run more applications at once: 3 vs 2
1 more threads: 3 vs 2

Number of cores	3 vs 2
Number of threads	3 vs 2

Compare benchmarks

CPU 1: Intel Pentium G3470
CPU 2: AMD Phenom II X3 B75

PassMark - Single thread mark

CPU 1

CPU 2

2089

1250

PassMark - CPU mark

CPU 1

CPU 2

2428

1751

Geekbench 4 - Single Core

CPU 1

CPU 2

3722

1905

Geekbench 4 - Multi-Core

CPU 1

CPU 2

6384

4439

Name	Intel Pentium G3470	AMD Phenom II X3 B75
PassMark - Single thread mark	2089	1250
PassMark - CPU mark	2428	1751
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	3.537
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	42.733
CompuBench 1.5 Desktop - T-Rex (Frames/s)	0.637
CompuBench 1.5 Desktop - Video Composition (Frames/s)	6.719
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)	6.851
Geekbench 4 - Single Core	3722	1905
Geekbench 4 - Multi-Core	6384	4439

Compare specifications (specs)

	Intel Pentium G3470	AMD Phenom II X3 B75
Essentials
Architecture codename	Haswell	Heka
Launch date	Q1'15	October 2009
Place in performance rating	1473	1506
Processor Number	G3470
Series	Intel® Pentium® Processor G Series	AMD Business Class - AMD Phenom X3 Triple-Core
Status	Discontinued
Vertical segment	Desktop	Desktop
Family		AMD Phenom
OPN Tray		HDXB75WFK3DGM
Price now		$39.99
Value for money (0-100)		21.61
Performance
64 bit support
Base frequency	3.60 GHz	3 GHz
Bus Speed	5 GT/s DMI2
Manufacturing process technology	22 nm	45 nm
Maximum core temperature	72°C
Number of cores	2	3
Number of threads	2	3
Die size		258 mm
L1 cache		128 KB (per core)
L2 cache		512 KB (per core)
L3 cache		6144 KB (shared)
Maximum frequency		3 GHz
Transistor count		758 million
Unlocked
Memory
Max memory channels	2
Maximum memory bandwidth	25.6 GB/s
Maximum memory size	32 GB
Supported memory types	DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V	DDR3
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	1.10 GHz
Intel® Quick Sync Video
Max video memory	1.7 GB
Processor graphics	Intel HD Graphics
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported	3
VGA
Graphics image quality
Max resolution over DisplayPort	2560x1600@60Hz
Max resolution over eDP	2560x1600@60Hz
Max resolution over HDMI 1.4	1920x1080@60Hz
Max resolution over VGA	1920x1200@60Hz
Graphics API support
DirectX	11.1/12
OpenGL	4.3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm
Sockets supported	FCLGA1150	AM3
Thermal Design Power (TDP)	53 Watt	95 Watt
Thermal Solution	PCG 2013C
Peripherals
Max number of PCIe lanes	16
PCI Express revision	Up to 3.0
PCIe configurations	Up to 1x16, 2x8, 1x8+2x4
Scalability	1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)