Intel Xeon E3-1275 v2 vs Intel Xeon L5530

Comparative analysis of Intel Xeon E3-1275 v2 and Intel Xeon L5530 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

Intel Xeon E3-1275 v2

Intel Xeon L5530

Differences

Reasons to consider the Intel Xeon E3-1275 v2

CPU is newer: launch date 2 year(s) 8 month(s) later
Around 47% higher clock speed: 3.90 GHz vs 2.66 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
Around 82% better performance in PassMark - Single thread mark: 2122 vs 1169
2.6x better performance in PassMark - CPU mark: 6616 vs 2522

Specifications (specs)
Launch date	May 2012 vs August 2009
Maximum frequency	3.90 GHz vs 2.66 GHz
Manufacturing process technology	22 nm vs 45 nm
Benchmarks
PassMark - Single thread mark	2122 vs 1169
PassMark - CPU mark	6616 vs 2522

Reasons to consider the Intel Xeon L5530

4.4x more maximum memory size: 144 GB vs 32.77 GB
Around 28% lower typical power consumption: 60 Watt vs 77 Watt

Maximum memory size	144 GB vs 32.77 GB
Max number of CPUs in a configuration	2 vs 1
Thermal Design Power (TDP)	60 Watt vs 77 Watt

Compare benchmarks

CPU 1: Intel Xeon E3-1275 v2
CPU 2: Intel Xeon L5530

PassMark - Single thread mark

CPU 1

CPU 2

2122

1169

PassMark - CPU mark

CPU 1

CPU 2

6616

2522

Name	Intel Xeon E3-1275 v2	Intel Xeon L5530
PassMark - Single thread mark	2122	1169
PassMark - CPU mark	6616	2522
Geekbench 4 - Single Core	821
Geekbench 4 - Multi-Core	3076
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	4.685
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	15.885
CompuBench 1.5 Desktop - T-Rex (Frames/s)	0.56
CompuBench 1.5 Desktop - Video Composition (Frames/s)	2.319
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)	5.602
GFXBench 4.0 - T-Rex (Frames)	2590
GFXBench 4.0 - T-Rex (Fps)	2590

Compare specifications (specs)

	Intel Xeon E3-1275 v2	Intel Xeon L5530
Essentials
Architecture codename	Ivy Bridge	Nehalem EP
Launch date	May 2012	August 2009
Launch price (MSRP)	$808
Place in performance rating	2084	2068
Price now	$394.72	$13.96
Processor Number	E3-1275V2	L5530
Series	Intel® Xeon® Processor E3 v2 Family	Legacy Intel® Xeon® Processors
Status	Launched	Launched
Value for money (0-100)	7.05	91.79
Vertical segment	Server	Server
Performance
64 bit support
Base frequency	3.50 GHz	2.40 GHz
Bus Speed	5 GT/s DMI	5.86 GT/s QPI
Die size	160 mm	263 mm2
L1 cache	64 KB (per core)	64 KB (per core)
L2 cache	256 KB (per core)	256 KB (per core)
L3 cache	8192 KB (shared)	8192 KB (shared)
Manufacturing process technology	22 nm	45 nm
Maximum frequency	3.90 GHz	2.66 GHz
Number of cores	4	4
Number of threads	8	8
Transistor count	1400 million	731 million
Maximum core temperature		70°C
Number of QPI Links		2
VID voltage range		0.75V -1.35V
Memory
ECC memory support
Max memory channels	2	3
Maximum memory bandwidth	25.6 GB/s	25.6 GB/s
Maximum memory size	32.77 GB	144 GB
Supported memory types	DDR3 1333/1600	DDR3 800/1066
Graphics
Graphics base frequency	650 MHz
Graphics max dynamic frequency	1.25 GHz
Graphics max frequency	1.25 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics P4000
Graphics interfaces
Number of displays supported	3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	2
Package Size	37.5mm x 37.5mm	42.5mm x 45mm
Sockets supported	FCLGA1155	FCLGA1366
Thermal Design Power (TDP)	77 Watt	60 Watt
Peripherals
PCI Express revision	3.0
PCIe configurations	1x16 & 1x4, 2x8 & 1x4 or 1x8 & 3x4
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Physical Address Extensions (PAE)		40-bit
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)