Intel Xeon E3-1275 v2 vs Intel Xeon L5530
Comparative analysis of Intel Xeon E3-1275 v2 and Intel Xeon L5530 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Xeon E3-1275 v2
- CPU is newer: launch date 2 year(s) 8 month(s) later
- Around 47% higher clock speed: 3.90 GHz vs 2.66 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
- Around 81% better performance in PassMark - Single thread mark: 2120 vs 1169
- 2.6x better performance in PassMark - CPU mark: 6620 vs 2522
Specifications (specs) | |
Launch date | May 2012 vs August 2009 |
Maximum frequency | 3.90 GHz vs 2.66 GHz |
Manufacturing process technology | 22 nm vs 45 nm |
Benchmarks | |
PassMark - Single thread mark | 2120 vs 1169 |
PassMark - CPU mark | 6620 vs 2522 |
Reasons to consider the Intel Xeon L5530
- 4.4x more maximum memory size: 144 GB vs 32.77 GB
- Around 28% lower typical power consumption: 60 Watt vs 77 Watt
Maximum memory size | 144 GB vs 32.77 GB |
Max number of CPUs in a configuration | 2 vs 1 |
Thermal Design Power (TDP) | 60 Watt vs 77 Watt |
Compare benchmarks
CPU 1: Intel Xeon E3-1275 v2
CPU 2: Intel Xeon L5530
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon E3-1275 v2 | Intel Xeon L5530 |
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PassMark - Single thread mark | 2120 | 1169 |
PassMark - CPU mark | 6620 | 2522 |
Geekbench 4 - Single Core | 821 | |
Geekbench 4 - Multi-Core | 3076 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 4.685 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 15.885 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.56 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.319 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 5.602 | |
GFXBench 4.0 - T-Rex (Frames) | 2590 | |
GFXBench 4.0 - T-Rex (Fps) | 2590 |
Compare specifications (specs)
Intel Xeon E3-1275 v2 | Intel Xeon L5530 | |
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Essentials |
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Architecture codename | Ivy Bridge | Nehalem EP |
Launch date | May 2012 | August 2009 |
Launch price (MSRP) | $808 | |
Place in performance rating | 2084 | 2068 |
Price now | $394.72 | $13.96 |
Processor Number | E3-1275V2 | L5530 |
Series | Intel® Xeon® Processor E3 v2 Family | Legacy Intel® Xeon® Processors |
Status | Launched | Launched |
Value for money (0-100) | 7.05 | 91.79 |
Vertical segment | Server | Server |
Performance |
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64 bit support | ||
Base frequency | 3.50 GHz | 2.40 GHz |
Bus Speed | 5 GT/s DMI | 5.86 GT/s QPI |
Die size | 160 mm | 263 mm2 |
L1 cache | 64 KB (per core) | 64 KB (per core) |
L2 cache | 256 KB (per core) | 256 KB (per core) |
L3 cache | 8192 KB (shared) | 8192 KB (shared) |
Manufacturing process technology | 22 nm | 45 nm |
Maximum frequency | 3.90 GHz | 2.66 GHz |
Number of cores | 4 | 4 |
Number of threads | 8 | 8 |
Transistor count | 1400 million | 731 million |
Maximum core temperature | 70°C | |
Number of QPI Links | 2 | |
VID voltage range | 0.75V -1.35V | |
Memory |
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ECC memory support | ||
Max memory channels | 2 | 3 |
Maximum memory bandwidth | 25.6 GB/s | 25.6 GB/s |
Maximum memory size | 32.77 GB | 144 GB |
Supported memory types | DDR3 1333/1600 | DDR3 800/1066 |
Graphics |
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Graphics base frequency | 650 MHz | |
Graphics max dynamic frequency | 1.25 GHz | |
Graphics max frequency | 1.25 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel HD Graphics P4000 | |
Graphics interfaces |
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Number of displays supported | 3 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 2 |
Package Size | 37.5mm x 37.5mm | 42.5mm x 45mm |
Sockets supported | FCLGA1155 | FCLGA1366 |
Thermal Design Power (TDP) | 77 Watt | 60 Watt |
Peripherals |
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PCI Express revision | 3.0 | |
PCIe configurations | 1x16 & 1x4, 2x8 & 1x4 or 1x8 & 3x4 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Physical Address Extensions (PAE) | 40-bit | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |