Intel Xeon E5-2609 v2 vs AMD Opteron 4332 HE
Comparative analysis of Intel Xeon E5-2609 v2 and AMD Opteron 4332 HE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon E5-2609 v2
- Around 4% higher maximum core temperature: 71°C vs 68°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- Around 25% more L3 cache; more data can be stored in the L3 cache for quick access later
- Around 8% better performance in PassMark - Single thread mark: 1383 vs 1285
- Around 22% better performance in PassMark - CPU mark: 6844 vs 5614
| Specifications (specs) | |
| Maximum core temperature | 71°C vs 68°C |
| Manufacturing process technology | 22 nm vs 32 nm |
| L3 cache | 10240 KB (shared) vs 8 MB |
| Benchmarks | |
| PassMark - Single thread mark | 1383 vs 1285 |
| PassMark - CPU mark | 6844 vs 5614 |
Reasons to consider the AMD Opteron 4332 HE
- 2 more cores, run more applications at once: 6 vs 4
- 2 more threads: 6 vs 4
- Around 48% higher clock speed: 3.7 GHz vs 2.50 GHz
- Around 13% more L1 cache; more data can be stored in the L1 cache for quick access later
- 6x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 23% lower typical power consumption: 65 Watt vs 80 Watt
| Number of cores | 6 vs 4 |
| Number of threads | 6 vs 4 |
| Maximum frequency | 3.7 GHz vs 2.50 GHz |
| L1 cache | 288 KB vs 64 KB (per core) |
| L2 cache | 6 MB vs 256 KB (per core) |
| Thermal Design Power (TDP) | 65 Watt vs 80 Watt |
Compare benchmarks
CPU 1: Intel Xeon E5-2609 v2
CPU 2: AMD Opteron 4332 HE
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Xeon E5-2609 v2 | AMD Opteron 4332 HE |
|---|---|---|
| PassMark - Single thread mark | 1383 | 1285 |
| PassMark - CPU mark | 6844 | 5614 |
| Geekbench 4 - Single Core | 2508 | |
| Geekbench 4 - Multi-Core | 7539 | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 4.725 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 79.456 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.431 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.525 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 8.253 |
Compare specifications (specs)
| Intel Xeon E5-2609 v2 | AMD Opteron 4332 HE | |
|---|---|---|
Essentials |
||
| Architecture codename | Ivy Bridge EP | Seoul |
| Launch date | September 2013 | n/d |
| Launch price (MSRP) | $396 | |
| Place in performance rating | 1840 | 1826 |
| Price now | $509.95 | |
| Processor Number | E5-2609V2 | |
| Series | Intel® Xeon® Processor E5 v2 Family | AMD Opteron 4300 Series Processor |
| Status | Launched | |
| Value for money (0-100) | 2.97 | |
| Vertical segment | Server | Server |
| Family | AMD Opteron | |
| OPN Tray | OS4332OFU6KHK | |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.50 GHz | 3 GHz |
| Bus Speed | 6.4 GT/s QPI | |
| Die size | 160 mm | 315 mm |
| L1 cache | 64 KB (per core) | 288 KB |
| L2 cache | 256 KB (per core) | 6 MB |
| L3 cache | 10240 KB (shared) | 8 MB |
| Manufacturing process technology | 22 nm | 32 nm |
| Maximum core temperature | 71°C | 68°C |
| Maximum frequency | 2.50 GHz | 3.7 GHz |
| Number of cores | 4 | 6 |
| Number of QPI Links | 2 | |
| Number of threads | 4 | 6 |
| Transistor count | 1400 million | 1200 million |
| VID voltage range | 0.65–1.30V | |
| Unlocked | ||
Memory |
||
| ECC memory support | ||
| Max memory channels | 4 | |
| Maximum memory bandwidth | 42.6 GB/s | |
| Maximum memory size | 768 GB | |
| Supported memory types | DDR3 800/1066/1333 | DDR3 |
| Supported memory frequency | 2000 MHz | |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 2 | 2 |
| Package Size | 52.5mm x 45mm | |
| Sockets supported | FCLGA2011 | C32 |
| Thermal Design Power (TDP) | 80 Watt | 65 Watt |
Peripherals |
||
| Max number of PCIe lanes | 40 | |
| PCI Express revision | 3.0 | |
| PCIe configurations | x4, x8, x16 | |
| Scalability | 2S Only | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX | |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Physical Address Extensions (PAE) | 46-bit | |
| Thermal Monitoring | ||
| Fused Multiply-Add (FMA) | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
| AMD Virtualization (AMD-V™) | ||
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