Intel Xeon E5-2630 v2 vs Intel Xeon E3-1290
Comparative analysis of Intel Xeon E5-2630 v2 and Intel Xeon E3-1290 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Xeon E5-2630 v2
- CPU is newer: launch date 2 year(s) 4 month(s) later
- 2 more cores, run more applications at once: 6 vs 4
- 4 more threads: 12 vs 8
- Around 25% higher maximum core temperature: 71°C vs 56.7°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
- Around 88% more L3 cache; more data can be stored in the L3 cache for quick access later
- 24x more maximum memory size: 768 GB vs 32 GB
- Around 19% lower typical power consumption: 80 Watt vs 95 Watt
- 2.5x better performance in PassMark - CPU mark: 13629 vs 5429
- Around 28% better performance in Geekbench 4 - Multi-Core: 3580 vs 2794
Specifications (specs) | |
Launch date | September 2013 vs May 2011 |
Number of cores | 6 vs 4 |
Number of threads | 12 vs 8 |
Maximum core temperature | 71°C vs 56.7°C |
Manufacturing process technology | 22 nm vs 32 nm |
L1 cache | 64 KB (per core) vs 64 KB (per core) |
L2 cache | 256 KB (per core) vs 256 KB (per core) |
L3 cache | 15360 KB (shared) vs 8192 KB (shared) |
Maximum memory size | 768 GB vs 32 GB |
Max number of CPUs in a configuration | 2 vs 1 |
Thermal Design Power (TDP) | 80 Watt vs 95 Watt |
Benchmarks | |
PassMark - CPU mark | 13629 vs 5429 |
Geekbench 4 - Multi-Core | 3580 vs 2794 |
Reasons to consider the Intel Xeon E3-1290
- Around 29% higher clock speed: 4.00 GHz vs 3.10 GHz
- Around 17% better performance in PassMark - Single thread mark: 1834 vs 1572
- Around 21% better performance in Geekbench 4 - Single Core: 725 vs 599
Specifications (specs) | |
Maximum frequency | 4.00 GHz vs 3.10 GHz |
Benchmarks | |
PassMark - Single thread mark | 1834 vs 1572 |
Geekbench 4 - Single Core | 725 vs 599 |
Compare benchmarks
CPU 1: Intel Xeon E5-2630 v2
CPU 2: Intel Xeon E3-1290
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Xeon E5-2630 v2 | Intel Xeon E3-1290 |
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PassMark - Single thread mark | 1572 | 1834 |
PassMark - CPU mark | 13629 | 5429 |
Geekbench 4 - Single Core | 599 | 725 |
Geekbench 4 - Multi-Core | 3580 | 2794 |
Compare specifications (specs)
Intel Xeon E5-2630 v2 | Intel Xeon E3-1290 | |
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Essentials |
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Architecture codename | Ivy Bridge EP | Sandy Bridge |
Launch date | September 2013 | May 2011 |
Launch price (MSRP) | $250 | $885 |
Place in performance rating | 1771 | 1763 |
Price now | $62.98 | $885 |
Processor Number | E5-2630V2 | E3-1290 |
Series | Intel® Xeon® Processor E5 v2 Family | Intel® Xeon® Processor E3 Family |
Status | Launched | Discontinued |
Value for money (0-100) | 48.64 | 2.89 |
Vertical segment | Server | Server |
Performance |
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64 bit support | ||
Base frequency | 2.60 GHz | 3.60 GHz |
Bus Speed | 7.2 GT/s QPI | 5 GT/s DMI |
Die size | 160 mm | 216 mm |
L1 cache | 64 KB (per core) | 64 KB (per core) |
L2 cache | 256 KB (per core) | 256 KB (per core) |
L3 cache | 15360 KB (shared) | 8192 KB (shared) |
Manufacturing process technology | 22 nm | 32 nm |
Maximum core temperature | 71°C | 56.7°C |
Maximum frequency | 3.10 GHz | 4.00 GHz |
Number of cores | 6 | 4 |
Number of QPI Links | 2 | |
Number of threads | 12 | 8 |
Transistor count | 1400 million | 1160 million |
VID voltage range | 0.65–1.30V | |
Memory |
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ECC memory support | ||
Max memory channels | 4 | 2 |
Maximum memory bandwidth | 51.2 GB/s | 21 GB/s |
Maximum memory size | 768 GB | 32 GB |
Supported memory types | DDR3 800/1066/1333/1600 | DDR3 1066/1333 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 2 | 1 |
Package Size | 52.5mm x 45mm | 37.5mm x 37.5mm |
Sockets supported | FCLGA2011 | LGA1155 |
Thermal Design Power (TDP) | 80 Watt | 95 Watt |
Peripherals |
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Max number of PCIe lanes | 40 | 20 |
PCI Express revision | 3.0 | 2.0 |
PCIe configurations | x4, x8, x16 | |
Scalability | 2S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 46-bit | |
Thermal Monitoring | ||
Flexible Display interface (FDI) | ||
Intel® Fast Memory Access | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics |
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Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Graphics interfaces |
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Wireless Display (WiDi) support |