Intel Xeon E5-2651 v2 vs AMD Opteron 4386
Comparative analysis of Intel Xeon E5-2651 v2 and AMD Opteron 4386 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon E5-2651 v2
- 4 more cores, run more applications at once: 12 vs 8
- 16 more threads: 24 vs 8
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 3.8x more L3 cache, more data can be stored in the L3 cache for quick access later
Number of cores | 12 vs 8 |
Number of threads | 24 vs 8 |
Manufacturing process technology | 22 nm vs 32 nm |
L1 cache | 768 KB vs 384 KB |
L3 cache | 30 MB vs 8 MB |
Reasons to consider the AMD Opteron 4386
- 2.7x more L2 cache, more data can be stored in the L2 cache for quick access later
L2 cache | 8 MB vs 3 MB |
Compare benchmarks
CPU 1: Intel Xeon E5-2651 v2
CPU 2: AMD Opteron 4386
Name | Intel Xeon E5-2651 v2 | AMD Opteron 4386 |
---|---|---|
Geekbench 4 - Single Core | 2030 | |
Geekbench 4 - Multi-Core | 18071 | |
PassMark - Single thread mark | 494 | |
PassMark - CPU mark | 5419 |
Compare specifications (specs)
Intel Xeon E5-2651 v2 | AMD Opteron 4386 | |
---|---|---|
Essentials |
||
Architecture codename | Ivy Bridge-EP | Seoul |
Family | Intel Xeon E5-2600 v2 | AMD Opteron |
Launch date | November 2013 | n/d |
Place in performance rating | 291 | 2692 |
Processor Number | E5-2651 v2 | |
Vertical segment | Server | Server |
OPN Tray | OS4386WLU8KHK | |
Series | AMD Opteron 4300 Series Processor | |
Performance |
||
64 bit support | ||
Base frequency | 1800 MHz | 3.1 GHz |
Bus Speed | 5 GT/s DMI | |
L1 cache | 768 KB | 384 KB |
L2 cache | 3 MB | 8 MB |
L3 cache | 30 MB | 8 MB |
Manufacturing process technology | 22 nm | 32 nm |
Number of cores | 12 | 8 |
Number of threads | 24 | 8 |
Die size | 315 mm | |
Maximum core temperature | 70.50°C | |
Maximum frequency | 3.8 GHz | |
Transistor count | 1200 million | |
Unlocked | ||
Memory |
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ECC memory support | ||
Max memory channels | 4 | |
Maximum memory size | 768 GB (per socket) | |
Supported memory types | DDR3 | DDR3 |
Supported memory frequency | 2200 MHz | |
Compatibility |
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Max number of CPUs in a configuration | 2 | 2 |
Sockets supported | LGA2011 | C32 |
Thermal Design Power (TDP) | 95 Watt | |
Peripherals |
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PCI Express revision | 3.0 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Fused Multiply-Add (FMA) | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
AMD Virtualization (AMD-V™) |