Intel Xeon E5-2670 v2 vs AMD Opteron 3350 HE

Comparative analysis of Intel Xeon E5-2670 v2 and AMD Opteron 3350 HE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

Intel Xeon E5-2670 v2

AMD Opteron 3350 HE

Differences

Reasons to consider the Intel Xeon E5-2670 v2

6 more cores, run more applications at once: 10 vs 4
16 more threads: 20 vs 4
Around 19% higher maximum core temperature: 82°C vs 69.10°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
3.3x more L1 cache, more data can be stored in the L1 cache for quick access later
3.1x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 26% better performance in PassMark - Single thread mark: 1586 vs 1263
4.8x better performance in PassMark - CPU mark: 19387 vs 4009

Specifications (specs)
Number of cores	10 vs 4
Number of threads	20 vs 4
Maximum core temperature	82°C vs 69.10°C
Manufacturing process technology	22 nm vs 32 nm
L1 cache	64 KB (per core) vs 192 KB
L3 cache	25600 KB (shared) vs 8 MB
Max number of CPUs in a configuration	2 vs 1
Benchmarks
PassMark - Single thread mark	1586 vs 1263
PassMark - CPU mark	19387 vs 4009

Reasons to consider the AMD Opteron 3350 HE

Around 15% higher clock speed: 3.8 GHz vs 3.30 GHz
Around 60% more L2 cache; more data can be stored in the L2 cache for quick access later
2.6x lower typical power consumption: 45 Watt vs 115 Watt

Maximum frequency	3.8 GHz vs 3.30 GHz
L2 cache	4 MB vs 256 KB (per core)
Thermal Design Power (TDP)	45 Watt vs 115 Watt

Compare benchmarks

CPU 1: Intel Xeon E5-2670 v2
CPU 2: AMD Opteron 3350 HE

PassMark - Single thread mark

CPU 1

CPU 2

1586

1263

PassMark - CPU mark

CPU 1

CPU 2

19387

4009

Name	Intel Xeon E5-2670 v2	AMD Opteron 3350 HE
PassMark - Single thread mark	1586	1263
PassMark - CPU mark	19387	4009
Geekbench 4 - Single Core	546
Geekbench 4 - Multi-Core	6174
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	8.749
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	70.641
CompuBench 1.5 Desktop - T-Rex (Frames/s)	0.994
CompuBench 1.5 Desktop - Video Composition (Frames/s)	4.413
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)	12.303

Compare specifications (specs)

	Intel Xeon E5-2670 v2	AMD Opteron 3350 HE
Essentials
Architecture codename	Ivy Bridge EP	Delhi
Launch date	September 2013	n/d
Launch price (MSRP)	$927
Place in performance rating	1842	1814
Price now	$489
Processor Number	E5-2670V2
Series	Intel® Xeon® Processor E5 v2 Family	AMD Opteron 3300 Series Processor
Status	Launched
Value for money (0-100)	9.03
Vertical segment	Server	Server
Family		AMD Opteron
OPN Tray		OS3350HOW4KHK
Performance
64 bit support
Base frequency	2.50 GHz	2.8 GHz
Bus Speed	8 GT/s QPI
Die size	160 mm	315 mm
L1 cache	64 KB (per core)	192 KB
L2 cache	256 KB (per core)	4 MB
L3 cache	25600 KB (shared)	8 MB
Manufacturing process technology	22 nm	32 nm
Maximum core temperature	82°C	69.10°C
Maximum frequency	3.30 GHz	3.8 GHz
Number of cores	10	4
Number of QPI Links	2
Number of threads	20	4
Transistor count	1400 million	1200 million
VID voltage range	0.65–1.30V
Unlocked
Memory
ECC memory support
Max memory channels	4
Maximum memory bandwidth	59.7 GB/s
Maximum memory size	768 GB
Supported memory types	DDR3 800/1066/1333/1600/1866	DDR3
Supported memory frequency		2000 MHz
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	2	1
Package Size	52.5mm x 45mm
Sockets supported	FCLGA2011	AM3+
Thermal Design Power (TDP)	115 Watt	45 Watt
Peripherals
Max number of PCIe lanes	40
PCI Express revision	3.0
PCIe configurations	x4, x8, x16
Scalability	2S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)	46-bit
Thermal Monitoring
Fused Multiply-Add (FMA)
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)