Intel Xeon E5-2670 v2 vs AMD Opteron 3350 HE

Comparative analysis of Intel Xeon E5-2670 v2 and AMD Opteron 3350 HE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

 

Differences

Reasons to consider the Intel Xeon E5-2670 v2

  • 6 more cores, run more applications at once: 10 vs 4
  • 16 more threads: 20 vs 4
  • Around 19% higher maximum core temperature: 82°C vs 69.10°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
  • 3.3x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 3.1x more L3 cache, more data can be stored in the L3 cache for quick access later
  • Around 25% better performance in PassMark - Single thread mark: 1575 vs 1263
  • 4.8x better performance in PassMark - CPU mark: 19200 vs 4009
Specifications (specs)
Number of cores 10 vs 4
Number of threads 20 vs 4
Maximum core temperature 82°C vs 69.10°C
Manufacturing process technology 22 nm vs 32 nm
L1 cache 64 KB (per core) vs 192 KB
L3 cache 25600 KB (shared) vs 8 MB
Max number of CPUs in a configuration 2 vs 1
Benchmarks
PassMark - Single thread mark 1575 vs 1263
PassMark - CPU mark 19200 vs 4009

Reasons to consider the AMD Opteron 3350 HE

  • Around 15% higher clock speed: 3.8 GHz vs 3.30 GHz
  • Around 60% more L2 cache; more data can be stored in the L2 cache for quick access later
  • 2.6x lower typical power consumption: 45 Watt vs 115 Watt
Maximum frequency 3.8 GHz vs 3.30 GHz
L2 cache 4 MB vs 256 KB (per core)
Thermal Design Power (TDP) 45 Watt vs 115 Watt

Compare benchmarks

CPU 1: Intel Xeon E5-2670 v2
CPU 2: AMD Opteron 3350 HE

PassMark - Single thread mark
CPU 1
CPU 2
1575
1263
PassMark - CPU mark
CPU 1
CPU 2
19200
4009
Name Intel Xeon E5-2670 v2 AMD Opteron 3350 HE
PassMark - Single thread mark 1575 1263
PassMark - CPU mark 19200 4009
Geekbench 4 - Single Core 546
Geekbench 4 - Multi-Core 6174
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 8.749
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 70.641
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.994
CompuBench 1.5 Desktop - Video Composition (Frames/s) 4.413
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 12.303

Compare specifications (specs)

Intel Xeon E5-2670 v2 AMD Opteron 3350 HE

Essentials

Architecture codename Ivy Bridge EP Delhi
Launch date September 2013 n/d
Launch price (MSRP) $927
Place in performance rating 1933 1912
Price now $489
Processor Number E5-2670V2
Series Intel® Xeon® Processor E5 v2 Family AMD Opteron 3300 Series Processor
Status Launched
Value for money (0-100) 9.03
Vertical segment Server Server
Family AMD Opteron
OPN Tray OS3350HOW4KHK

Performance

64 bit support
Base frequency 2.50 GHz 2.8 GHz
Bus Speed 8 GT/s QPI
Die size 160 mm 315 mm
L1 cache 64 KB (per core) 192 KB
L2 cache 256 KB (per core) 4 MB
L3 cache 25600 KB (shared) 8 MB
Manufacturing process technology 22 nm 32 nm
Maximum core temperature 82°C 69.10°C
Maximum frequency 3.30 GHz 3.8 GHz
Number of cores 10 4
Number of QPI Links 2
Number of threads 20 4
Transistor count 1400 million 1200 million
VID voltage range 0.65–1.30V
Unlocked

Memory

ECC memory support
Max memory channels 4
Maximum memory bandwidth 59.7 GB/s
Maximum memory size 768 GB
Supported memory types DDR3 800/1066/1333/1600/1866 DDR3
Supported memory frequency 2000 MHz

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 2 1
Package Size 52.5mm x 45mm
Sockets supported FCLGA2011 AM3+
Thermal Design Power (TDP) 115 Watt 45 Watt

Peripherals

Max number of PCIe lanes 40
PCI Express revision 3.0
PCIe configurations x4, x8, x16
Scalability 2S Only

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 46-bit
Thermal Monitoring
Fused Multiply-Add (FMA)

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)