Intel Xeon E5-2670 v3 vs AMD Z-60
Comparative analysis of Intel Xeon E5-2670 v3 and AMD Z-60 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Xeon E5-2670 v3
- 10 more cores, run more applications at once: 12 vs 2
- Around 210% higher clock speed: 3.10 GHz vs 1 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 40 nm
- 5.3x better performance in PassMark - Single thread mark: 1694 vs 318
- 84.6x better performance in PassMark - CPU mark: 22166 vs 262
Specifications (specs) | |
Number of cores | 12 vs 2 |
Maximum frequency | 3.10 GHz vs 1 GHz |
Manufacturing process technology | 22 nm vs 40 nm |
Max number of CPUs in a configuration | 2 vs 1 |
Benchmarks | |
PassMark - Single thread mark | 1694 vs 318 |
PassMark - CPU mark | 22166 vs 262 |
Reasons to consider the AMD Z-60
- 24x lower typical power consumption: 5 Watt vs 120 Watt
Thermal Design Power (TDP) | 5 Watt vs 120 Watt |
Compare benchmarks
CPU 1: Intel Xeon E5-2670 v3
CPU 2: AMD Z-60
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon E5-2670 v3 | AMD Z-60 |
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PassMark - Single thread mark | 1694 | 318 |
PassMark - CPU mark | 22166 | 262 |
Geekbench 4 - Single Core | 705 | |
Geekbench 4 - Multi-Core | 7047 |
Compare specifications (specs)
Intel Xeon E5-2670 v3 | AMD Z-60 | |
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Essentials |
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Architecture codename | Haswell | Hondo |
Launch date | Q3'14 | October 2012 |
Place in performance rating | 1411 | 3227 |
Processor Number | E5-2670V3 | |
Series | Intel® Xeon® Processor E5 v3 Family | |
Status | Launched | |
Vertical segment | Server | Laptop |
Performance |
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64 bit support | ||
Base frequency | 2.30 GHz | |
Bus Speed | 9.6 GT/s QPI | |
Manufacturing process technology | 22 nm | 40 nm |
Maximum core temperature | 84.5°C | |
Maximum frequency | 3.10 GHz | 1 GHz |
Number of cores | 12 | 2 |
Number of QPI Links | 2 | |
Number of threads | 24 | |
VID voltage range | 0.65V–1.30V | |
L1 cache | 64 KB | |
L2 cache | 1024 KB | |
Memory |
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Max memory channels | 4 | |
Maximum memory bandwidth | 68 GB/s | |
Maximum memory size | 768 GB | |
Supported memory types | DDR4 1600/1866/2133 | DDR3 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 2 | 1 |
Package Size | 52.5mm x 45mm | |
Sockets supported | FCLGA2011-3 | FT1 |
Thermal Design Power (TDP) | 120 Watt | 5 Watt |
Peripherals |
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Max number of PCIe lanes | 40 | |
PCI Express revision | 3.0 | |
PCIe configurations | x4, x8, x16 | |
Scalability | 2S | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 46-bit | |
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |