Intel Xeon E5-2670 v3 vs AMD Z-60

Comparative analysis of Intel Xeon E5-2670 v3 and AMD Z-60 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Xeon E5-2670 v3

  • 10 more cores, run more applications at once: 12 vs 2
  • Around 210% higher clock speed: 3.10 GHz vs 1 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 40 nm
  • 5.3x better performance in PassMark - Single thread mark: 1694 vs 318
  • 84.6x better performance in PassMark - CPU mark: 22166 vs 262
Specifications (specs)
Number of cores 12 vs 2
Maximum frequency 3.10 GHz vs 1 GHz
Manufacturing process technology 22 nm vs 40 nm
Max number of CPUs in a configuration 2 vs 1
Benchmarks
PassMark - Single thread mark 1694 vs 318
PassMark - CPU mark 22166 vs 262

Reasons to consider the AMD Z-60

  • 24x lower typical power consumption: 5 Watt vs 120 Watt
Thermal Design Power (TDP) 5 Watt vs 120 Watt

Compare benchmarks

CPU 1: Intel Xeon E5-2670 v3
CPU 2: AMD Z-60

PassMark - Single thread mark
CPU 1
CPU 2
1694
318
PassMark - CPU mark
CPU 1
CPU 2
22166
262
Name Intel Xeon E5-2670 v3 AMD Z-60
PassMark - Single thread mark 1694 318
PassMark - CPU mark 22166 262
Geekbench 4 - Single Core 705
Geekbench 4 - Multi-Core 7047

Compare specifications (specs)

Intel Xeon E5-2670 v3 AMD Z-60

Essentials

Architecture codename Haswell Hondo
Launch date Q3'14 October 2012
Place in performance rating 1411 3227
Processor Number E5-2670V3
Series Intel® Xeon® Processor E5 v3 Family
Status Launched
Vertical segment Server Laptop

Performance

64 bit support
Base frequency 2.30 GHz
Bus Speed 9.6 GT/s QPI
Manufacturing process technology 22 nm 40 nm
Maximum core temperature 84.5°C
Maximum frequency 3.10 GHz 1 GHz
Number of cores 12 2
Number of QPI Links 2
Number of threads 24
VID voltage range 0.65V–1.30V
L1 cache 64 KB
L2 cache 1024 KB

Memory

Max memory channels 4
Maximum memory bandwidth 68 GB/s
Maximum memory size 768 GB
Supported memory types DDR4 1600/1866/2133 DDR3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 2 1
Package Size 52.5mm x 45mm
Sockets supported FCLGA2011-3 FT1
Thermal Design Power (TDP) 120 Watt 5 Watt

Peripherals

Max number of PCIe lanes 40
PCI Express revision 3.0
PCIe configurations x4, x8, x16
Scalability 2S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 46-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)