Intel Xeon E5-2670 v3 vs Intel Core i7-960

Comparative analysis of Intel Xeon E5-2670 v3 and Intel Core i7-960 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

Intel Xeon E5-2670 v3

Intel Core i7-960

Differences

Reasons to consider the Intel Xeon E5-2670 v3

8 more cores, run more applications at once: 12 vs 4
16 more threads: 24 vs 8
Around 24% higher maximum core temperature: 84.5°C vs 67.9°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
32x more maximum memory size: 768 GB vs 24 GB
Around 8% lower typical power consumption: 120 Watt vs 130 Watt
Around 16% better performance in PassMark - Single thread mark: 1694 vs 1460
6.6x better performance in PassMark - CPU mark: 22166 vs 3366
Around 25% better performance in Geekbench 4 - Single Core: 705 vs 565
3.2x better performance in Geekbench 4 - Multi-Core: 7047 vs 2198

Specifications (specs)
Number of cores	12 vs 4
Number of threads	24 vs 8
Maximum core temperature	84.5°C vs 67.9°C
Manufacturing process technology	22 nm vs 45 nm
Maximum memory size	768 GB vs 24 GB
Max number of CPUs in a configuration	2 vs 1
Thermal Design Power (TDP)	120 Watt vs 130 Watt
Benchmarks
PassMark - Single thread mark	1694 vs 1460
PassMark - CPU mark	22166 vs 3366
Geekbench 4 - Single Core	705 vs 565
Geekbench 4 - Multi-Core	7047 vs 2198

Reasons to consider the Intel Core i7-960

Around 12% higher clock speed: 3.46 GHz vs 3.10 GHz

Maximum frequency	3.46 GHz vs 3.10 GHz

Compare benchmarks

CPU 1: Intel Xeon E5-2670 v3
CPU 2: Intel Core i7-960

PassMark - Single thread mark

CPU 1

CPU 2

1694

1460

PassMark - CPU mark

CPU 1

CPU 2

22166

3366

Geekbench 4 - Single Core

CPU 1

CPU 2

705

565

Geekbench 4 - Multi-Core

CPU 1

CPU 2

7047

2198

Name	Intel Xeon E5-2670 v3	Intel Core i7-960
PassMark - Single thread mark	1694	1460
PassMark - CPU mark	22166	3366
Geekbench 4 - Single Core	705	565
Geekbench 4 - Multi-Core	7047	2198
3DMark Fire Strike - Physics Score		0
CompuBench 1.5 Desktop - Face Detection (mPixels/s)		1.115
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)		59.327
CompuBench 1.5 Desktop - T-Rex (Frames/s)		0.374
CompuBench 1.5 Desktop - Video Composition (Frames/s)		0.395
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)		4.942

Compare specifications (specs)

	Intel Xeon E5-2670 v3	Intel Core i7-960
Essentials
Architecture codename	Haswell	Bloomfield
Launch date	Q3'14	October 2009
Place in performance rating	1411	2772
Processor Number	E5-2670V3	i7-960
Series	Intel® Xeon® Processor E5 v3 Family	Legacy Intel® Core™ Processors
Status	Launched	Discontinued
Vertical segment	Server	Desktop
Launch price (MSRP)		$316
Price now		$99.99
Value for money (0-100)		17.14
Performance
64 bit support
Base frequency	2.30 GHz	3.20 GHz
Bus Speed	9.6 GT/s QPI	4.8 GT/s QPI
Manufacturing process technology	22 nm	45 nm
Maximum core temperature	84.5°C	67.9°C
Maximum frequency	3.10 GHz	3.46 GHz
Number of cores	12	4
Number of QPI Links	2	1
Number of threads	24	8
VID voltage range	0.65V–1.30V	0.800V-1.375V
Die size		263 mm2
Front-side bus (FSB)		1333 MHz
L1 cache		64 KB (per core)
L2 cache		256 KB (per core)
L3 cache		8192 KB (shared)
Transistor count		731 million
Memory
Max memory channels	4	3
Maximum memory bandwidth	68 GB/s	25.6 GB/s
Maximum memory size	768 GB	24 GB
Supported memory types	DDR4 1600/1866/2133	DDR3 800/1066
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	2	1
Package Size	52.5mm x 45mm	42.5mm x 45.0mm
Sockets supported	FCLGA2011-3	FCLGA1366
Thermal Design Power (TDP)	120 Watt	130 Watt
Peripherals
Max number of PCIe lanes	40
PCI Express revision	3.0
PCIe configurations	x4, x8, x16
Scalability	2S
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® AVX2	Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)	46-bit	36-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)