Intel Xeon E5-2690 v3 vs AMD Ryzen 5 PRO 1600
Comparative analysis of Intel Xeon E5-2690 v3 and AMD Ryzen 5 PRO 1600 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon E5-2690 v3
- 6 more cores, run more applications at once: 12 vs 6
- 12 more threads: 24 vs 12
- Around 2% better performance in PassMark - Single thread mark: 1924 vs 1884
- 2.3x better performance in PassMark - CPU mark: 26358 vs 11240
Specifications (specs) | |
Number of cores | 12 vs 6 |
Number of threads | 24 vs 12 |
Max number of CPUs in a configuration | 2 vs 1 |
Benchmarks | |
PassMark - Single thread mark | 1924 vs 1884 |
PassMark - CPU mark | 26358 vs 11240 |
Reasons to consider the AMD Ryzen 5 PRO 1600
- Around 3% higher clock speed: 3.6 GHz vs 3.50 GHz
- Around 6% higher maximum core temperature: 95°C vs 89.9°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- 2.1x lower typical power consumption: 65 Watt vs 135 Watt
- 4.4x better performance in Geekbench 4 - Single Core: 3665 vs 834
- Around 95% better performance in Geekbench 4 - Multi-Core: 16580 vs 8521
Specifications (specs) | |
Maximum frequency | 3.6 GHz vs 3.50 GHz |
Maximum core temperature | 95°C vs 89.9°C |
Manufacturing process technology | 14 nm vs 22 nm |
Thermal Design Power (TDP) | 65 Watt vs 135 Watt |
Benchmarks | |
Geekbench 4 - Single Core | 3665 vs 834 |
Geekbench 4 - Multi-Core | 16580 vs 8521 |
Compare benchmarks
CPU 1: Intel Xeon E5-2690 v3
CPU 2: AMD Ryzen 5 PRO 1600
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Xeon E5-2690 v3 | AMD Ryzen 5 PRO 1600 |
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PassMark - Single thread mark | 1924 | 1884 |
PassMark - CPU mark | 26358 | 11240 |
Geekbench 4 - Single Core | 834 | 3665 |
Geekbench 4 - Multi-Core | 8521 | 16580 |
3DMark Fire Strike - Physics Score | 5995 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 18.545 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 43.086 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.893 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.543 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 9.469 |
Compare specifications (specs)
Intel Xeon E5-2690 v3 | AMD Ryzen 5 PRO 1600 | |
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Essentials |
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Architecture codename | Haswell | Zen |
Launch date | Q3'14 | 29 June 2017 |
Place in performance rating | 1183 | 1190 |
Processor Number | E5-2690V3 | |
Series | Intel® Xeon® Processor E5 v3 Family | AMD Ryzen 5 PRO Desktop Processors |
Status | Launched | |
Vertical segment | Server | Desktop |
Family | AMD Ryzen PRO Processors | |
OPN Tray | YD160BBBM6IAE | |
OS Support | Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit | |
Performance |
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64 bit support | ||
Base frequency | 2.60 GHz | 3.2 GHz |
Bus Speed | 9.6 GT/s QPI | |
Manufacturing process technology | 22 nm | 14 nm |
Maximum core temperature | 89.9°C | 95°C |
Maximum frequency | 3.50 GHz | 3.6 GHz |
Number of cores | 12 | 6 |
Number of QPI Links | 2 | |
Number of threads | 24 | 12 |
VID voltage range | 0.65V–1.30V | |
Die size | 192 mm | |
L1 cache | 576 KB | |
L2 cache | 3 MB | |
L3 cache | 16 MB | |
Transistor count | 4800 million | |
Unlocked | ||
Memory |
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Max memory channels | 4 | 2 |
Maximum memory bandwidth | 68 GB/s | |
Maximum memory size | 768 GB | |
Supported memory types | DDR4 1600/1866/2133 | DDR4 |
Supported memory frequency | 2667 MHz | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 2 | 1 |
Package Size | 52.5mm x 45mm | |
Sockets supported | FCLGA2011-3 | AM4 |
Thermal Design Power (TDP) | 135 Watt | 65 Watt |
Peripherals |
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Max number of PCIe lanes | 40 | |
PCI Express revision | 3.0 | 3.0 x16 |
PCIe configurations | x4, x8, x16 | |
Scalability | 2S | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 46-bit | |
Thermal Monitoring | ||
AMD SenseMI | ||
Extended Frequency Range (XFR) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
TSM Encryption | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |