Intel Xeon Gold 5217 vs Intel Core 2 Duo SU7300

Comparative analysis of Intel Xeon Gold 5217 and Intel Core 2 Duo SU7300 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Xeon Gold 5217

Intel Core 2 Duo SU7300

Differences

Reasons to consider the Intel Xeon Gold 5217

CPU is newer: launch date 9 year(s) 7 month(s) later
6 more cores, run more applications at once: 8 vs 2
14 more threads: 16 vs 2
Around 185% higher clock speed: 3.70 GHz vs 1.3 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
2.7x more L2 cache, more data can be stored in the L2 cache for quick access later

Launch date	2 Apr 2019 vs 1 September 2009
Number of cores	8 vs 2
Number of threads	16 vs 2
Maximum frequency	3.70 GHz vs 1.3 GHz
Manufacturing process technology	14 nm vs 45 nm
L2 cache	8 MB vs 3 MB

Reasons to consider the Intel Core 2 Duo SU7300

11.5x lower typical power consumption: 10 Watt vs 115 Watt

Thermal Design Power (TDP)	10 Watt vs 115 Watt

Compare benchmarks

CPU 1: Intel Xeon Gold 5217
CPU 2: Intel Core 2 Duo SU7300

Name	Intel Xeon Gold 5217	Intel Core 2 Duo SU7300
PassMark - Single thread mark	2089
PassMark - CPU mark	25455
Geekbench 4 - Single Core		177
Geekbench 4 - Multi-Core		309

Compare specifications (specs)

	Intel Xeon Gold 5217	Intel Core 2 Duo SU7300
Essentials
Architecture codename	Cascade Lake	Penryn
Launch date	2 Apr 2019	1 September 2009
Launch price (MSRP)	$1522
Place in performance rating	943	3300
Processor Number	5217
Series	2nd Generation Intel Xeon Scalable Processors	Intel Core 2 Duo
Status	Launched
Vertical segment	Server	Laptop
Performance
Base frequency	3.00 GHz
L1 cache	512 KB
L2 cache	8 MB	3 MB
L3 cache	11 MB
Manufacturing process technology	14 nm	45 nm
Maximum core temperature	79°C
Maximum frequency	3.70 GHz	1.3 GHz
Number of cores	8	2
Number of threads	16	2
Number of Ultra Path Interconnect (UPI) Links	2
64 bit support
Die size		107 mm
Front-side bus (FSB)		800 MHz
Transistor count		410 Million
Memory
Max memory channels	6
Maximum memory size	1 TB
Supported memory frequency	2667 MHz
Supported memory types	DDR4-2667
Compatibility
Package Size	76.0mm x 56.5mm
Sockets supported	FCLGA3647	BGA956
Thermal Design Power (TDP)	115 Watt	10 Watt
Peripherals
Max number of PCIe lanes	48
PCI Express revision	3.0
Scalability	4S
Security & Reliability
Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Instruction set extensions	Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Number of AVX-512 FMA Units	1
Speed Shift technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)