Intel Xeon Gold 6138F vs AMD Opteron 6262 HE
Comparative analysis of Intel Xeon Gold 6138F and AMD Opteron 6262 HE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Xeon Gold 6138F
- 4 more cores, run more applications at once: 20 vs 16
- 24 more threads: 40 vs 16
- Around 28% higher clock speed: 3.70 GHz vs 2.9 GHz
- Around 34% higher maximum core temperature: 87°C vs 65°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
| Number of cores | 20 vs 16 |
| Number of threads | 40 vs 16 |
| Maximum frequency | 3.70 GHz vs 2.9 GHz |
| Maximum core temperature | 87°C vs 65°C |
| Manufacturing process technology | 14 nm vs 32 nm |
Reasons to consider the AMD Opteron 6262 HE
- Around 59% lower typical power consumption: 85 Watt vs 135 Watt
| Thermal Design Power (TDP) | 85 Watt vs 135 Watt |
Compare specifications (specs)
| Intel Xeon Gold 6138F | AMD Opteron 6262 HE | |
|---|---|---|
Essentials |
||
| Architecture codename | Skylake | Interlagos |
| Launch date | Q3'17 | November 2011 |
| Place in performance rating | not rated | not rated |
| Processor Number | 6138F | |
| Series | Intel® Xeon® Scalable Processors | AMD Opteron 6200 Series Processor |
| Status | Launched | |
| Vertical segment | Server | Server |
| Family | AMD Opteron | |
| OPN Tray | OS6262VATGGGU | |
Performance |
||
| Base frequency | 2.00 GHz | 1.6 GHz |
| Manufacturing process technology | 14 nm | 32 nm |
| Maximum core temperature | 87°C | 65°C |
| Maximum frequency | 3.70 GHz | 2.9 GHz |
| Number of cores | 20 | 16 |
| Number of threads | 40 | 16 |
| Number of Ultra Path Interconnect (UPI) Links | 2 | |
| 64 bit support | ||
| Die size | 316 mm | |
| L1 cache | 768 KB | |
| L2 cache | 16 MB | |
| L3 cache | 16 MB | |
| Maximum case temperature (TCase) | 69 °C | |
| Transistor count | 2400 million | |
| Unlocked | ||
Memory |
||
| Max memory channels | 6 | |
| Maximum memory size | 768 GB | |
| Supported memory frequency | 2666 MHz | 1800 MHz |
| Supported memory types | DDR4-2666 | DDR3 |
Compatibility |
||
| Low Halogen Options Available | ||
| Package Size | 88.0mm x 56.5mm | |
| Sockets supported | FCLGA3647 | G34 |
| Thermal Design Power (TDP) | 135 Watt | 85 Watt |
| Max number of CPUs in a configuration | 2 | |
Peripherals |
||
| Max number of PCIe lanes | 48 | |
| PCI Express revision | 3.0 | |
| Scalability | 2S | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Run Sure Technology | ||
| Intel® Trusted Execution technology (TXT) | ||
| Mode-based Execute Control (MBE) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Instruction set extensions | Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 | |
| Integrated Intel® Omni-Path Architecture (Intel® OPA) | ||
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® Volume Management Device (VMD) | ||
| Intel® vPro™ Platform Eligibility | ||
| Number of AVX-512 FMA Units | 2 | |
| Speed Shift technology | ||
| Fused Multiply-Add (FMA) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
| AMD Virtualization (AMD-V™) | ||
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