Intel Xeon Phi 7210 vs Intel Xeon E5520
Comparative analysis of Intel Xeon Phi 7210 and Intel Xeon E5520 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon Phi 7210
- CPU is newer: launch date 7 year(s) 3 month(s) later
- 60 more cores, run more applications at once: 64 vs 4
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
- 8x more L1 cache, more data can be stored in the L1 cache for quick access later
- 32x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2.7x more maximum memory size: 384 GB vs 144 GB
- Around 58% better performance in PassMark - CPU mark: 7306 vs 4620
Specifications (specs) | |
Launch date | June 2016 vs March 2009 |
Number of cores | 64 vs 4 |
Manufacturing process technology | 14 nm vs 45 nm |
L1 cache | 32 KB (per core) vs 64 KB (per core) |
L2 cache | 512 KB (per core) vs 256 KB (per core) |
Maximum memory size | 384 GB vs 144 GB |
Benchmarks | |
PassMark - CPU mark | 7306 vs 4620 |
Reasons to consider the Intel Xeon E5520
- Around 69% higher clock speed: 2.53 GHz vs 1.50 GHz
- 2.7x lower typical power consumption: 80 Watt vs 215 Watt
- 2.4x better performance in PassMark - Single thread mark: 1106 vs 460
Specifications (specs) | |
Maximum frequency | 2.53 GHz vs 1.50 GHz |
Max number of CPUs in a configuration | 2 vs 1 |
Thermal Design Power (TDP) | 80 Watt vs 215 Watt |
Benchmarks | |
PassMark - Single thread mark | 1106 vs 460 |
Compare benchmarks
CPU 1: Intel Xeon Phi 7210
CPU 2: Intel Xeon E5520
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon Phi 7210 | Intel Xeon E5520 |
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PassMark - Single thread mark | 460 | 1106 |
PassMark - CPU mark | 7306 | 4620 |
Geekbench 4 - Single Core | 397 | |
Geekbench 4 - Multi-Core | 1969 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.453 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 62.27 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.429 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.436 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 6.95 |
Compare specifications (specs)
Intel Xeon Phi 7210 | Intel Xeon E5520 | |
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Essentials |
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Architecture codename | Knights Landing | Nehalem EP |
Launch date | June 2016 | March 2009 |
Place in performance rating | 2731 | 2717 |
Processor Number | 7210 | E5520 |
Series | Intel® Xeon Phi™ x200 Product Family | Legacy Intel® Xeon® Processors |
Status | Launched | Launched |
Vertical segment | Server | Server |
Launch price (MSRP) | $19 | |
Price now | $42.39 | |
Value for money (0-100) | 30.90 | |
Performance |
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64 bit support | ||
Base frequency | 1.30 GHz | 2.26 GHz |
L1 cache | 32 KB (per core) | 64 KB (per core) |
L2 cache | 512 KB (per core) | 256 KB (per core) |
Manufacturing process technology | 14 nm | 45 nm |
Maximum frequency | 1.50 GHz | 2.53 GHz |
Number of cores | 64 | 4 |
Transistor count | 8000 million | 731 million |
VID voltage range | 0.550-1.125V | 0.75V -1.35V |
Bus Speed | 5.86 GT/s QPI | |
Die size | 263 mm2 | |
L3 cache | 8192 KB (shared) | |
Maximum core temperature | 72°C | |
Number of QPI Links | 2 | |
Number of threads | 8 | |
Memory |
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ECC memory support | ||
Max memory channels | 6 | 3 |
Maximum memory bandwidth | 102 GB/s | 25.6 GB/s |
Maximum memory size | 384 GB | 144 GB |
Supported memory types | DDR4-2133 | DDR3 800/1066 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 2 |
Sockets supported | SVLCLGA3647 | FCLGA1366 |
Thermal Design Power (TDP) | 215 Watt | 80 Watt |
Package Size | 42.5mm x 45mm | |
Peripherals |
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Max number of PCIe lanes | 36 | |
PCI Express revision | 3.0 | |
PCIe configurations | x16 port (Port 2 and 3) may negotiate down to x8, x4, x2, or x1. x4 port (Port1) may negotiate down to x2, or x1 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Idle States | ||
Instruction set extensions | Intel® AVX-512 | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Enhanced Intel SpeedStep® technology | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Physical Address Extensions (PAE) | 40-bit | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |