Intel Xeon Phi 7210 vs Intel Xeon W3530
Comparative analysis of Intel Xeon Phi 7210 and Intel Xeon W3530 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon Phi 7210
- CPU is newer: launch date 6 year(s) 3 month(s) later
- 60 more cores, run more applications at once: 64 vs 4
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
- 8x more L1 cache, more data can be stored in the L1 cache for quick access later
- 32x more L2 cache, more data can be stored in the L2 cache for quick access later
- 16x more maximum memory size: 384 GB vs 24 GB
- 2.4x better performance in PassMark - CPU mark: 7306 vs 3068
| Specifications (specs) | |
| Launch date | June 2016 vs March 2010 |
| Number of cores | 64 vs 4 |
| Manufacturing process technology | 14 nm vs 45 nm |
| L1 cache | 32 KB (per core) vs 64 KB (per core) |
| L2 cache | 512 KB (per core) vs 256 KB (per core) |
| Maximum memory size | 384 GB vs 24 GB |
| Benchmarks | |
| PassMark - CPU mark | 7306 vs 3068 |
Reasons to consider the Intel Xeon W3530
- Around 104% higher clock speed: 3.06 GHz vs 1.50 GHz
- Around 65% lower typical power consumption: 130 Watt vs 215 Watt
- 2.9x better performance in PassMark - Single thread mark: 1335 vs 460
| Specifications (specs) | |
| Maximum frequency | 3.06 GHz vs 1.50 GHz |
| Thermal Design Power (TDP) | 130 Watt vs 215 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 1335 vs 460 |
Compare benchmarks
CPU 1: Intel Xeon Phi 7210
CPU 2: Intel Xeon W3530
| PassMark - Single thread mark |
|
|
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| PassMark - CPU mark |
|
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| Name | Intel Xeon Phi 7210 | Intel Xeon W3530 |
|---|---|---|
| PassMark - Single thread mark | 460 | 1335 |
| PassMark - CPU mark | 7306 | 3068 |
| Geekbench 4 - Single Core | 493 | |
| Geekbench 4 - Multi-Core | 1998 | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 0.917 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 48.982 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.297 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.553 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 4.283 |
Compare specifications (specs)
| Intel Xeon Phi 7210 | Intel Xeon W3530 | |
|---|---|---|
Essentials |
||
| Architecture codename | Knights Landing | Bloomfield |
| Launch date | June 2016 | March 2010 |
| Place in performance rating | 2731 | 2752 |
| Processor Number | 7210 | W3530 |
| Series | Intel® Xeon Phi™ x200 Product Family | Legacy Intel® Xeon® Processors |
| Status | Launched | Discontinued |
| Vertical segment | Server | Server |
| Launch price (MSRP) | $999 | |
| Price now | $293.95 | |
| Value for money (0-100) | 5.37 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.30 GHz | 2.80 GHz |
| L1 cache | 32 KB (per core) | 64 KB (per core) |
| L2 cache | 512 KB (per core) | 256 KB (per core) |
| Manufacturing process technology | 14 nm | 45 nm |
| Maximum frequency | 1.50 GHz | 3.06 GHz |
| Number of cores | 64 | 4 |
| Transistor count | 8000 million | 731 million |
| VID voltage range | 0.550-1.125V | 0.800V-1.375V |
| Bus Speed | 4.8 GT/s QPI | |
| Die size | 263 mm2 | |
| L3 cache | 8192 KB (shared) | |
| Maximum core temperature | 67.9°C | |
| Number of QPI Links | 1 | |
| Number of threads | 8 | |
Memory |
||
| ECC memory support | ||
| Max memory channels | 6 | 3 |
| Maximum memory bandwidth | 102 GB/s | 25.6 GB/s |
| Maximum memory size | 384 GB | 24 GB |
| Supported memory types | DDR4-2133 | DDR3 800/1066 |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Sockets supported | SVLCLGA3647 | FCLGA1366 |
| Thermal Design Power (TDP) | 215 Watt | 130 Watt |
| Package Size | 42.5mm x 45.0mm | |
Peripherals |
||
| Max number of PCIe lanes | 36 | |
| PCI Express revision | 3.0 | |
| PCIe configurations | x16 port (Port 2 and 3) may negotiate down to x8, x4, x2, or x1. x4 port (Port1) may negotiate down to x2, or x1 | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
Advanced Technologies |
||
| Idle States | ||
| Instruction set extensions | Intel® AVX-512 | Intel® SSE4.2 |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| Enhanced Intel SpeedStep® technology | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Physical Address Extensions (PAE) | 36-bit | |
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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