Intel Xeon Platinum 8380 vs AMD E1-2150
Comparative analysis of Intel Xeon Platinum 8380 and AMD E1-2150 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon Platinum 8380
- CPU is newer: launch date 7 year(s) 2 month(s) later
- 38 more cores, run more applications at once: 40 vs 2
- Around 224% higher clock speed: 3.40 GHz vs 1.05 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 32 nm
- 10x more L1 cache, more data can be stored in the L1 cache for quick access later
- 40x more L2 cache, more data can be stored in the L2 cache for quick access later
Launch date | 6 Apr 2021 vs February 2014 |
Number of cores | 40 vs 2 |
Maximum frequency | 3.40 GHz vs 1.05 GHz |
Manufacturing process technology | 10 nm vs 32 nm |
L1 cache | 2.5 MB vs 128 KB (per core) |
L2 cache | 40 MB vs 512 KB (per core) |
Reasons to consider the AMD E1-2150
- 30x lower typical power consumption: 9 Watt vs 270 Watt
Thermal Design Power (TDP) | 9 Watt vs 270 Watt |
Compare benchmarks
CPU 1: Intel Xeon Platinum 8380
CPU 2: AMD E1-2150
Name | Intel Xeon Platinum 8380 | AMD E1-2150 |
---|---|---|
PassMark - Single thread mark | 2400 | |
PassMark - CPU mark | 91257 |
Compare specifications (specs)
Intel Xeon Platinum 8380 | AMD E1-2150 | |
---|---|---|
Essentials |
||
Architecture codename | Ice Lake | Kabini |
Launch date | 6 Apr 2021 | February 2014 |
Launch price (MSRP) | $8099 | |
Place in performance rating | 155 | not rated |
Processor Number | 8380 | |
Series | 3rd Generation Intel Xeon Scalable Processors | |
Status | Launched | |
Vertical segment | Server | Laptop |
Performance |
||
Base frequency | 2.30 GHz | |
L1 cache | 2.5 MB | 128 KB (per core) |
L2 cache | 40 MB | 512 KB (per core) |
L3 cache | 60 MB | |
Manufacturing process technology | 10 nm | 32 nm |
Maximum core temperature | 83°C | |
Maximum frequency | 3.40 GHz | 1.05 GHz |
Number of cores | 40 | 2 |
Number of threads | 80 | |
Number of Ultra Path Interconnect (UPI) Links | 3 | |
64 bit support | ||
Die size | 246 mm | |
Maximum case temperature (TCase) | 90 °C | |
Transistor count | 1178 million | |
Memory |
||
Max memory channels | 8 | |
Maximum memory size | 6 TB | |
Supported memory frequency | 3200 MHz | |
Supported memory types | DDR4-3200 | DDR3 |
Compatibility |
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Package Size | 77.5mm x 56.5mm | |
Sockets supported | FCLGA4189 | FT3 |
Thermal Design Power (TDP) | 270 Watt | 9 Watt |
Max number of CPUs in a configuration | 1 | |
Peripherals |
||
Max number of PCIe lanes | 64 | |
PCI Express revision | 4.0 | |
Scalability | 2S | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Run Sure Technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Mode-based Execute Control (MBE) | ||
Advanced Technologies |
||
Instruction set extensions | Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Number of AVX-512 FMA Units | 2 | |
Speed Shift technology | ||
Intel® Advanced Vector Extensions (AVX) | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |