Intel Xeon Platinum 8380 vs AMD E1-2150

Comparative analysis of Intel Xeon Platinum 8380 and AMD E1-2150 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Xeon Platinum 8380

  • CPU is newer: launch date 7 year(s) 2 month(s) later
  • 38 more cores, run more applications at once: 40 vs 2
  • Around 224% higher clock speed: 3.40 GHz vs 1.05 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 32 nm
  • 10x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 40x more L2 cache, more data can be stored in the L2 cache for quick access later
Launch date 6 Apr 2021 vs February 2014
Number of cores 40 vs 2
Maximum frequency 3.40 GHz vs 1.05 GHz
Manufacturing process technology 10 nm vs 32 nm
L1 cache 2.5 MB vs 128 KB (per core)
L2 cache 40 MB vs 512 KB (per core)

Reasons to consider the AMD E1-2150

  • 30x lower typical power consumption: 9 Watt vs 270 Watt
Thermal Design Power (TDP) 9 Watt vs 270 Watt

Compare benchmarks

CPU 1: Intel Xeon Platinum 8380
CPU 2: AMD E1-2150

Name Intel Xeon Platinum 8380 AMD E1-2150
PassMark - Single thread mark 2400
PassMark - CPU mark 91257

Compare specifications (specs)

Intel Xeon Platinum 8380 AMD E1-2150

Essentials

Architecture codename Ice Lake Kabini
Launch date 6 Apr 2021 February 2014
Launch price (MSRP) $8099
Place in performance rating 155 not rated
Processor Number 8380
Series 3rd Generation Intel Xeon Scalable Processors
Status Launched
Vertical segment Server Laptop

Performance

Base frequency 2.30 GHz
L1 cache 2.5 MB 128 KB (per core)
L2 cache 40 MB 512 KB (per core)
L3 cache 60 MB
Manufacturing process technology 10 nm 32 nm
Maximum core temperature 83°C
Maximum frequency 3.40 GHz 1.05 GHz
Number of cores 40 2
Number of threads 80
Number of Ultra Path Interconnect (UPI) Links 3
64 bit support
Die size 246 mm
Maximum case temperature (TCase) 90 °C
Transistor count 1178 million

Memory

Max memory channels 8
Maximum memory size 6 TB
Supported memory frequency 3200 MHz
Supported memory types DDR4-3200 DDR3

Compatibility

Package Size 77.5mm x 56.5mm
Sockets supported FCLGA4189 FT3
Thermal Design Power (TDP) 270 Watt 9 Watt
Max number of CPUs in a configuration 1

Peripherals

Max number of PCIe lanes 64
PCI Express revision 4.0
Scalability 2S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)

Advanced Technologies

Instruction set extensions Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Number of AVX-512 FMA Units 2
Speed Shift technology
Intel® Advanced Vector Extensions (AVX)

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)