Intel Xeon W-2275 vs Intel Core 2 Duo T8300
Comparative analysis of Intel Xeon W-2275 and Intel Core 2 Duo T8300 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon W-2275
- CPU is newer: launch date 11 year(s) 8 month(s) later
- 12 more cores, run more applications at once: 14 vs 2
- 26 more threads: 28 vs 2
- Around 92% higher clock speed: 4.60 GHz vs 2.4 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
- 4.7x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2.8x better performance in PassMark - Single thread mark: 2746 vs 970
- 30.9x better performance in PassMark - CPU mark: 27893 vs 902
Specifications (specs) | |
Launch date | 7 Oct 2019 vs 10 January 2008 |
Number of cores | 14 vs 2 |
Number of threads | 28 vs 2 |
Maximum frequency | 4.60 GHz vs 2.4 GHz |
Manufacturing process technology | 14 nm vs 45 nm |
L2 cache | 14 MB vs 3072 KB |
Benchmarks | |
PassMark - Single thread mark | 2746 vs 970 |
PassMark - CPU mark | 27893 vs 902 |
Reasons to consider the Intel Core 2 Duo T8300
- Around 69% higher maximum core temperature: 105°C vs 62°C
- 4.7x lower typical power consumption: 35 Watt vs 165 Watt
Maximum core temperature | 105°C vs 62°C |
Thermal Design Power (TDP) | 35 Watt vs 165 Watt |
Compare benchmarks
CPU 1: Intel Xeon W-2275
CPU 2: Intel Core 2 Duo T8300
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon W-2275 | Intel Core 2 Duo T8300 |
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PassMark - Single thread mark | 2746 | 970 |
PassMark - CPU mark | 27893 | 902 |
Geekbench 4 - Single Core | 321 | |
Geekbench 4 - Multi-Core | 535 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 0.259 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 15.787 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.075 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 0.479 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 1.875 |
Compare specifications (specs)
Intel Xeon W-2275 | Intel Core 2 Duo T8300 | |
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Essentials |
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Architecture codename | Cascade Lake | Penryn |
Launch date | 7 Oct 2019 | 10 January 2008 |
Launch price (MSRP) | $1112 | $241 |
Place in performance rating | 606 | 3206 |
Processor Number | W-2275 | T8300 |
Series | Intel Xeon W Processor | Legacy Intel® Core™ Processors |
Status | Launched | Discontinued |
Vertical segment | Workstation | Mobile |
Price now | $213.99 | |
Value for money (0-100) | 2.03 | |
Performance |
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64 bit support | ||
Base frequency | 3.30 GHz | 2.40 GHz |
Bus Speed | 8 GT/s | 800 MHz FSB |
L1 cache | 896 KB | |
L2 cache | 14 MB | 3072 KB |
L3 cache | 19.25 MB | |
Manufacturing process technology | 14 nm | 45 nm |
Maximum core temperature | 62°C | 105°C |
Maximum frequency | 4.60 GHz | 2.4 GHz |
Number of cores | 14 | 2 |
Number of QPI Links | 0 | |
Number of threads | 28 | 2 |
Number of Ultra Path Interconnect (UPI) Links | 0 | |
Die size | 107 mm2 | |
Front-side bus (FSB) | 800 MHz | |
Transistor count | 410 million | |
VID voltage range | 1.000V-1.250V | |
Memory |
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Max memory channels | 4 | |
Maximum memory bandwidth | 93.85 GB/s | |
Maximum memory size | 1 TB | |
Supported memory types | DDR4 2933 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | |
Package Size | 45mm x 52.5mm | 35mm x 35mm |
Sockets supported | FCLGA2066 | PGA478, BGA479 |
Thermal Design Power (TDP) | 165 Watt | 35 Watt |
Low Halogen Options Available | ||
Peripherals |
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Max number of PCIe lanes | 48 | |
PCI Express revision | 3.0 | |
PCIe configurations | x4, x8, x16 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Number of AVX-512 FMA Units | 2 | |
Physical Address Extensions (PAE) | 46-bit | |
Speed Shift technology | ||
Thermal Monitoring | ||
FSB parity | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |