Intel Xeon X5690 vs Intel Xeon W3550

Comparative analysis of Intel Xeon X5690 and Intel Xeon W3550 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

 

Differences

Reasons to consider the Intel Xeon X5690

  • CPU is newer: launch date 1 year(s) 6 month(s) later
  • 2 more cores, run more applications at once: 6 vs 4
  • 4 more threads: 12 vs 8
  • Around 12% higher clock speed: 3.73 GHz vs 3.33 GHz
  • Around 16% higher maximum core temperature: 78.5°C vs 67.9°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
  • Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
  • Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
  • Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
  • 12x more maximum memory size: 288 GB vs 24 GB
  • Around 21% better performance in PassMark - Single thread mark: 1713 vs 1410
  • 4x better performance in PassMark - CPU mark: 12914 vs 3240
  • Around 16% better performance in Geekbench 4 - Single Core: 637 vs 548
  • Around 62% better performance in Geekbench 4 - Multi-Core: 3517 vs 2171
Specifications (specs)
Launch date February 2011 vs August 2009
Number of cores 6 vs 4
Number of threads 12 vs 8
Maximum frequency 3.73 GHz vs 3.33 GHz
Maximum core temperature 78.5°C vs 67.9°C
Manufacturing process technology 32 nm vs 45 nm
L1 cache 64 KB (per core) vs 64 KB (per core)
L2 cache 256 KB (per core) vs 256 KB (per core)
L3 cache 12288 KB (shared) vs 8192 KB (shared)
Maximum memory size 288 GB vs 24 GB
Max number of CPUs in a configuration 2 vs 1
Benchmarks
PassMark - Single thread mark 1713 vs 1410
PassMark - CPU mark 12914 vs 3240
Geekbench 4 - Single Core 637 vs 548
Geekbench 4 - Multi-Core 3517 vs 2171

Compare benchmarks

CPU 1: Intel Xeon X5690
CPU 2: Intel Xeon W3550

PassMark - Single thread mark
CPU 1
CPU 2
1713
1410
PassMark - CPU mark
CPU 1
CPU 2
12914
3240
Geekbench 4 - Single Core
CPU 1
CPU 2
637
548
Geekbench 4 - Multi-Core
CPU 1
CPU 2
3517
2171
Name Intel Xeon X5690 Intel Xeon W3550
PassMark - Single thread mark 1713 1410
PassMark - CPU mark 12914 3240
Geekbench 4 - Single Core 637 548
Geekbench 4 - Multi-Core 3517 2171
3DMark Fire Strike - Physics Score 0
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 3.301
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 57.148
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.762
CompuBench 1.5 Desktop - Video Composition (Frames/s) 5.122
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 15.77

Compare specifications (specs)

Intel Xeon X5690 Intel Xeon W3550

Essentials

Architecture codename Westmere EP Bloomfield
Launch date February 2011 August 2009
Launch price (MSRP) $205 $235
Place in performance rating 2267 2167
Price now $149 $59.95
Processor Number X5690 W3550
Series Legacy Intel® Xeon® Processors Legacy Intel® Xeon® Processors
Status Discontinued Discontinued
Value for money (0-100) 17.68 27.98
Vertical segment Server Server

Performance

64 bit support
Base frequency 3.46 GHz 3.06 GHz
Bus Speed 6.4 GT/s QPI 4.8 GT/s QPI
Die size 239 mm 263 mm2
L1 cache 64 KB (per core) 64 KB (per core)
L2 cache 256 KB (per core) 256 KB (per core)
L3 cache 12288 KB (shared) 8192 KB (shared)
Manufacturing process technology 32 nm 45 nm
Maximum core temperature 78.5°C 67.9°C
Maximum frequency 3.73 GHz 3.33 GHz
Number of cores 6 4
Number of QPI Links 2 1
Number of threads 12 8
Transistor count 1170 million 731 million
VID voltage range 0.750V-1.350V 0.800V-1.375V

Memory

ECC memory support
Max memory channels 3 3
Maximum memory bandwidth 32 GB/s 25.6 GB/s
Maximum memory size 288 GB 24 GB
Supported memory types DDR3 800/1066/1333 DDR3 800/1066

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 2 1
Package Size 42.5mm X 45mm 42.5mm x 45.0mm
Sockets supported FCLGA1366 FCLGA1366
Thermal Design Power (TDP) 130 Watt 130 Watt

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.2 Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 40-bit 36-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)