Intel Xeon X7350 vs Intel Xeon E5-2643

Comparative analysis of Intel Xeon X7350 and Intel Xeon E5-2643 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Xeon E5-2643

  • Around 11% higher maximum core temperature: 73°C vs 66°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
  • 1310720x more L3 cache, more data can be stored in the L3 cache for quick access later
  • Around 35% better performance in PassMark - Single thread mark: 1600 vs 1186
  • Around 25% better performance in PassMark - CPU mark: 9774 vs 7836
Specifications (specs)
Maximum core temperature 73°C vs 66°C
Manufacturing process technology 32 nm vs 65 nm
L3 cache 10240 KB (shared) vs 8 MB L2 Cache
Benchmarks
PassMark - Single thread mark 1600 vs 1186
PassMark - CPU mark 9774 vs 7836

Compare benchmarks

CPU 1: Intel Xeon X7350
CPU 2: Intel Xeon E5-2643

PassMark - Single thread mark
CPU 1
CPU 2
1186
1600
PassMark - CPU mark
CPU 1
CPU 2
7836
9774
Name Intel Xeon X7350 Intel Xeon E5-2643
PassMark - Single thread mark 1186 1600
PassMark - CPU mark 7836 9774
Geekbench 4 - Single Core 638
Geekbench 4 - Multi-Core 2761

Compare specifications (specs)

Intel Xeon X7350 Intel Xeon E5-2643

Essentials

Architecture codename Tigerton Sandy Bridge EP
Launch date Q3'07 March 2012
Place in performance rating 1853 1858
Processor Number X7350 E5-2643
Series Legacy Intel Xeon Processors Intel® Xeon® Processor E5 Family
Vertical segment Server Server
Launch price (MSRP) $218
Price now $2,664
Status Discontinued
Value for money (0-100) 0.93

Performance

64 bit support
Base frequency 2.93 GHz 3.30 GHz
Bus Speed 1066 MHz 8 GT/s QPI
Die size 286 mm2 294 mm
L3 cache 8 MB L2 Cache 10240 KB (shared)
Manufacturing process technology 65 nm 32 nm
Maximum core temperature 66°C 73°C
Number of cores 4 4
Transistor count 582 million 1270 million
VID voltage range 1.0000V-1.5000V 0.60V-1.35V
L1 cache 64 KB (per core)
L2 cache 256 KB (per core)
Maximum frequency 3.50 GHz
Number of QPI Links 2
Number of threads 8

Compatibility

Package Size 53.3mm x 53.3mm 52.5mm x 45.0mm
Sockets supported PGA604, PPGA604 FCLGA2011
Thermal Design Power (TDP) 130 Watt 130 Watt
Low Halogen Options Available
Max number of CPUs in a configuration 2

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Intel® Identity Protection technology

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Instruction set extensions Intel® AVX
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Flex Memory Access
Intel® vPro™ Platform Eligibility

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Memory

ECC memory support
Max memory channels 4
Maximum memory bandwidth 51.2 GB/s
Maximum memory size 384 GB
Supported memory types DDR3 800/1066/1333/1600

Peripherals

Max number of PCIe lanes 40
PCI Express revision 3.0
Scalability 2S Only