Intel Xeon X7550 vs Intel Xeon Bronze 3104
Comparative analysis of Intel Xeon X7550 and Intel Xeon Bronze 3104 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon X7550
- 2 more cores, run more applications at once: 8 vs 6
- 10 more threads: 16 vs 6
- Around 1% better performance in PassMark - Single thread mark: 1067 vs 1054
Specifications (specs) | |
Number of cores | 8 vs 6 |
Number of threads | 16 vs 6 |
Benchmarks | |
PassMark - Single thread mark | 1067 vs 1054 |
Reasons to consider the Intel Xeon Bronze 3104
- Around 13% higher maximum core temperature: 78°C vs 69°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
- Around 53% lower typical power consumption: 85 Watt vs 130 Watt
- Around 3% better performance in PassMark - CPU mark: 8079 vs 7873
Specifications (specs) | |
Maximum core temperature | 78°C vs 69°C |
Manufacturing process technology | 14 nm vs 45 nm |
Thermal Design Power (TDP) | 85 Watt vs 130 Watt |
Benchmarks | |
PassMark - CPU mark | 8079 vs 7873 |
Compare benchmarks
CPU 1: Intel Xeon X7550
CPU 2: Intel Xeon Bronze 3104
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon X7550 | Intel Xeon Bronze 3104 |
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PassMark - Single thread mark | 1067 | 1054 |
PassMark - CPU mark | 7873 | 8079 |
Compare specifications (specs)
Intel Xeon X7550 | Intel Xeon Bronze 3104 | |
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Essentials |
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Architecture codename | Nehalem EX | Skylake |
Launch date | Q1'10 | Q3'17 |
Place in performance rating | 1974 | 1988 |
Processor Number | X7550 | 3104 |
Series | Legacy Intel Xeon Processors | Intel® Xeon® Scalable Processors |
Vertical segment | Server | Server |
Status | Launched | |
Performance |
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Base frequency | 2.00 GHz | 1.70 GHz |
Bus Speed | 6.4 GT/s | |
L3 cache | 18 MB L3 Cache | |
Manufacturing process technology | 45 nm | 14 nm |
Maximum core temperature | 69°C | 78°C |
Maximum frequency | 2.40 GHz | |
Number of cores | 8 | 6 |
Number of threads | 16 | 6 |
Number of Ultra Path Interconnect (UPI) Links | 2 | |
Memory |
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Supported memory types | DDR3 800/978/1066/1333 (Max Speed 1066 MHz) | DDR4-2133 |
Max memory channels | 6 | |
Maximum memory size | 768 GB | |
Supported memory frequency | 2133 MHz | |
Compatibility |
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Sockets supported | FCLGA1567 | FCLGA3647 |
Thermal Design Power (TDP) | 130 Watt | 85 Watt |
Low Halogen Options Available | ||
Package Size | 76.0mm x 56.5mm | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Mode-based Execute Control (MBE) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Intel 64 | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Instruction set extensions | Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 | |
Intel® AES New Instructions | ||
Intel® Optane™ Memory Supported | ||
Intel® TSX-NI | ||
Intel® Volume Management Device (VMD) | ||
Intel® vPro™ Platform Eligibility | ||
Number of AVX-512 FMA Units | 1 | |
Speed Shift technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Peripherals |
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Max number of PCIe lanes | 48 | |
PCI Express revision | 3.0 | |
Scalability | 2S |