AMD FirePro V3900 videocard review
FirePro V3900 videocard released by AMD; release date: 7 February 2012. The videocard is designed for workstation-computers and based on TeraScale 2 microarchitecture codenamed Turks.
Core clock speed - 650 MHz. Texture fill rate - 15.6 GTexel / s. Pipelines - 480. Floating-point performance - 624.0 gflops. Manufacturing process technology - 40 nm. Transistors count - 716 million. Power consumption (TDP) - 199 Watt.
Memory type: GDDR3. Maximum RAM amount - 1 GB. Memory bus width - 128 Bit. Memory clock speed - 1800 MHz. Memory bandwidth - 28 GB / s.
Benchmarks
| PassMark G3D Mark |
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| PassMark G2D Mark |
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| Geekbench OpenCL |
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| CompuBench 1.5 Desktop Face Detection |
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| CompuBench 1.5 Desktop Ocean Surface Simulation |
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| CompuBench 1.5 Desktop T-Rex |
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| CompuBench 1.5 Desktop Video Composition |
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| CompuBench 1.5 Desktop Bitcoin Mining |
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| GFXBench 4.0 Car Chase Offscreen |
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| GFXBench 4.0 Manhattan |
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| GFXBench 4.0 T-Rex |
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| GFXBench 4.0 Car Chase Offscreen |
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| GFXBench 4.0 Manhattan |
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| GFXBench 4.0 T-Rex |
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| Name | Value |
|---|---|
| PassMark - G3D Mark | 640 |
| PassMark - G2D Mark | 236 |
| Geekbench - OpenCL | 1564 |
| CompuBench 1.5 Desktop - Face Detection | 4.646 mPixels/s |
| CompuBench 1.5 Desktop - Ocean Surface Simulation | 279.435 Frames/s |
| CompuBench 1.5 Desktop - T-Rex | 0.468 Frames/s |
| CompuBench 1.5 Desktop - Video Composition | 13.784 Frames/s |
| CompuBench 1.5 Desktop - Bitcoin Mining | 58.580 mHash/s |
| GFXBench 4.0 - Car Chase Offscreen | 1311 Frames |
| GFXBench 4.0 - Manhattan | 1631 Frames |
| GFXBench 4.0 - T-Rex | 3358 Frames |
| GFXBench 4.0 - Car Chase Offscreen | 1311.000 Fps |
| GFXBench 4.0 - Manhattan | 1631.000 Fps |
| GFXBench 4.0 - T-Rex | 3358.000 Fps |
Specifications (specs)
Essentials |
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| Architecture | TeraScale 2 |
| Code name | Turks |
| Launch date | 7 February 2012 |
| Place in performance rating | 1347 |
| Type | Workstation |
Technical info |
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| Core clock speed | 650 MHz |
| Floating-point performance | 624.0 gflops |
| Manufacturing process technology | 40 nm |
| Pipelines | 480 |
| Texture fill rate | 15.6 GTexel / s |
| Thermal Design Power (TDP) | 199 Watt |
| Transistor count | 716 million |
Video outputs and ports |
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| Display Connectors | 1x DVI, 1x DisplayPort |
| DisplayPort count | 1 |
| Dual-link DVI support | |
| HD сomponent video output | |
Compatibility, dimensions and requirements |
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| Bus support | PCIe 2.1 x16 |
| Form factor | Half Height / Half Length |
| Interface | PCIe 2.0 x16 |
| Length | 168 mm |
| Supplementary power connectors | None |
API support |
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| DirectX | 11.2 (11_0) |
| OpenGL | 4.4 |
Memory |
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| Maximum RAM amount | 1 GB |
| Memory bandwidth | 28 GB / s |
| Memory bus width | 128 Bit |
| Memory clock speed | 1800 MHz |
| Memory type | GDDR3 |
Navigation
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