AMD FirePro V5900 videocard review
FirePro V5900 videocard released by AMD; release date: 24 May 2011. The videocard is designed for workstation-computers and based on TeraScale 3 microarchitecture codenamed Cayman.
Core clock speed - 600 MHz. Texture fill rate - 19.2 GTexel / s. Pipelines - 512. Floating-point performance - 614.4 gflops. Manufacturing process technology - 40 nm. Transistors count - 2,640 million. Power consumption (TDP) - 75 Watt.
Memory type: GDDR5. Maximum RAM amount - 2 GB. Memory bus width - 256 Bit. Memory clock speed - 2000 MHz. Memory bandwidth - 128.0 GB / s.
Benchmarks
| PassMark G3D Mark |
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| PassMark G2D Mark |
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| Geekbench OpenCL |
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| CompuBench 1.5 Desktop Face Detection |
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| CompuBench 1.5 Desktop Ocean Surface Simulation |
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| CompuBench 1.5 Desktop T-Rex |
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| CompuBench 1.5 Desktop Video Composition |
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| CompuBench 1.5 Desktop Bitcoin Mining |
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| GFXBench 4.0 Car Chase Offscreen |
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| GFXBench 4.0 Manhattan |
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| GFXBench 4.0 T-Rex |
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| GFXBench 4.0 Car Chase Offscreen |
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| GFXBench 4.0 Manhattan |
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| GFXBench 4.0 T-Rex |
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| Name | Value |
|---|---|
| PassMark - G3D Mark | 1265 |
| PassMark - G2D Mark | 355 |
| Geekbench - OpenCL | 2880 |
| CompuBench 1.5 Desktop - Face Detection | 8.167 mPixels/s |
| CompuBench 1.5 Desktop - Ocean Surface Simulation | 409.102 Frames/s |
| CompuBench 1.5 Desktop - T-Rex | 0.772 Frames/s |
| CompuBench 1.5 Desktop - Video Composition | 20.064 Frames/s |
| CompuBench 1.5 Desktop - Bitcoin Mining | 66.259 mHash/s |
| GFXBench 4.0 - Car Chase Offscreen | 1713 Frames |
| GFXBench 4.0 - Manhattan | 2091 Frames |
| GFXBench 4.0 - T-Rex | 5078 Frames |
| GFXBench 4.0 - Car Chase Offscreen | 1713.000 Fps |
| GFXBench 4.0 - Manhattan | 2091.000 Fps |
| GFXBench 4.0 - T-Rex | 5078.000 Fps |
Specifications (specs)
Essentials |
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| Architecture | TeraScale 3 |
| Code name | Cayman |
| Launch date | 24 May 2011 |
| Place in performance rating | 1098 |
| Type | Workstation |
Technical info |
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| Core clock speed | 600 MHz |
| Floating-point performance | 614.4 gflops |
| Manufacturing process technology | 40 nm |
| Pipelines | 512 |
| Texture fill rate | 19.2 GTexel / s |
| Thermal Design Power (TDP) | 75 Watt |
| Transistor count | 2,640 million |
Video outputs and ports |
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| Display Connectors | 1x DVI |
Compatibility, dimensions and requirements |
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| Interface | PCIe 2.0 x16 |
| Length | 230 mm |
| Supplementary power connectors | None |
API support |
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| DirectX | 11.2 (11_0) |
| OpenGL | 4.4 |
Memory |
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| Maximum RAM amount | 2 GB |
| Memory bandwidth | 128.0 GB / s |
| Memory bus width | 256 Bit |
| Memory clock speed | 2000 MHz |
| Memory type | GDDR5 |
Navigation
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