AMD FirePro W7100 videocard review
FirePro W7100 videocard released by AMD; release date: 12 August 2014. The videocard is designed for workstation-computers and based on GCN 3.0 microarchitecture codenamed Tonga.
Core clock speed - 920 MHz. Texture fill rate - 103.0 GTexel / s. Pipelines - 1792. Floating-point performance - 3,297 gflops. Manufacturing process technology - 28 nm. Transistors count - 5,000 million. Power consumption (TDP) - 400 Watt.
Memory type: GDDR5. Maximum RAM amount - 8 GB. Memory bus width - 256 Bit. Memory clock speed - 5000 MHz. Memory bandwidth - 160 GB / s.
Benchmarks
| PassMark G3D Mark |
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| PassMark G2D Mark |
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| Geekbench OpenCL |
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| CompuBench 1.5 Desktop Face Detection |
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| CompuBench 1.5 Desktop Ocean Surface Simulation |
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| CompuBench 1.5 Desktop T-Rex |
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| CompuBench 1.5 Desktop Video Composition |
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| CompuBench 1.5 Desktop Bitcoin Mining |
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| GFXBench 4.0 Car Chase Offscreen |
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| GFXBench 4.0 Manhattan |
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| GFXBench 4.0 T-Rex |
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| GFXBench 4.0 Car Chase Offscreen |
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| GFXBench 4.0 Manhattan |
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| GFXBench 4.0 T-Rex |
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| Name | Value |
|---|---|
| PassMark - G3D Mark | 5191 |
| PassMark - G2D Mark | 663 |
| Geekbench - OpenCL | 24892 |
| CompuBench 1.5 Desktop - Face Detection | 65.781 mPixels/s |
| CompuBench 1.5 Desktop - Ocean Surface Simulation | 1248.285 Frames/s |
| CompuBench 1.5 Desktop - T-Rex | 5.854 Frames/s |
| CompuBench 1.5 Desktop - Video Composition | 94.086 Frames/s |
| CompuBench 1.5 Desktop - Bitcoin Mining | 361.580 mHash/s |
| GFXBench 4.0 - Car Chase Offscreen | 6362 Frames |
| GFXBench 4.0 - Manhattan | 3713 Frames |
| GFXBench 4.0 - T-Rex | 3355 Frames |
| GFXBench 4.0 - Car Chase Offscreen | 6362.000 Fps |
| GFXBench 4.0 - Manhattan | 3713.000 Fps |
| GFXBench 4.0 - T-Rex | 3355.000 Fps |
Specifications (specs)
Essentials |
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| Architecture | GCN 3.0 |
| Code name | Tonga |
| Launch date | 12 August 2014 |
| Place in performance rating | 450 |
| Type | Workstation |
Technical info |
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| Core clock speed | 920 MHz |
| Floating-point performance | 3,297 gflops |
| Manufacturing process technology | 28 nm |
| Pipelines | 1792 |
| Texture fill rate | 103.0 GTexel / s |
| Thermal Design Power (TDP) | 400 Watt |
| Transistor count | 5,000 million |
Video outputs and ports |
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| Display Connectors | 4x DisplayPort |
| DisplayPort count | 4 |
| Dual-link DVI support | |
| HD сomponent video output | |
| StereoOutput3D | |
Compatibility, dimensions and requirements |
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| Bus support | PCIe 3.0 |
| Form factor | Full Height / Full Length |
| Interface | PCIe 3.0 x16 |
| Length | 241 mm |
| Supplementary power connectors | 1x 6-pin |
API support |
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| DirectX | 12.0 (12_0) |
| OpenGL | 4.5 |
Memory |
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| Maximum RAM amount | 8 GB |
| Memory bandwidth | 160 GB / s |
| Memory bus width | 256 Bit |
| Memory clock speed | 5000 MHz |
| Memory type | GDDR5 |

