AMD Radeon R7 M520 vs Intel Iris Graphics 5100

Comparative analysis of AMD Radeon R7 M520 and Intel Iris Graphics 5100 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, Memory, API support, Technologies. Benchmark videocards performance analysis: Geekbench - OpenCL, PassMark - G3D Mark, PassMark - G2D Mark, GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

AMD Radeon R7 M520

Intel Iris Graphics 5100

Differences

Reasons to consider the AMD Radeon R7 M520

Videocard is newer: launch date 3 year(s) 10 month(s) later
5.2x more core clock speed: 1030 MHz vs 200 MHz
8x more pipelines: 320 vs 40
4.4x better performance in Geekbench - OpenCL: 17889 vs 4025

Specifications (specs)
Launch date	18 April 2017 vs 27 May 2013
Core clock speed	1030 MHz vs 200 MHz
Pipelines	320 vs 40
Benchmarks
Geekbench - OpenCL	17889 vs 4025

Reasons to consider the Intel Iris Graphics 5100

A newer manufacturing process allows for a more powerful, yet cooler running videocard: 22 nm vs 28 nm
Around 67% lower typical power consumption: 30 Watt vs 50 Watt

Manufacturing process technology	22 nm vs 28 nm
Thermal Design Power (TDP)	30 Watt vs 50 Watt

Compare benchmarks

GPU 1: AMD Radeon R7 M520
GPU 2: Intel Iris Graphics 5100

Geekbench - OpenCL

GPU 1

GPU 2

17889

4025

Name	AMD Radeon R7 M520	Intel Iris Graphics 5100
Geekbench - OpenCL	17889	4025
PassMark - G3D Mark		747
PassMark - G2D Mark		270
GFXBench 4.0 - Manhattan (Frames)		1019
GFXBench 4.0 - Manhattan (Fps)		1019
GFXBench 4.0 - T-Rex (Frames)		1668
GFXBench 4.0 - T-Rex (Fps)		1668

Compare specifications (specs)

	AMD Radeon R7 M520	Intel Iris Graphics 5100
Essentials
Architecture	GCN 1.0	Generation 7.5
Code name	Oland	Haswell GT3
Launch date	18 April 2017	27 May 2013
Place in performance rating	1181	1184
Type	Desktop	Laptop
Technical info
Core clock speed	1030 MHz	200 MHz
Floating-point performance	659.2 gflops
Manufacturing process technology	28 nm	22 nm
Pipelines	320	40
Texture fill rate	20.6 GTexel / s
Thermal Design Power (TDP)	50 Watt	30 Watt
Transistor count	1,040 million	1,300 million
Boost clock speed		1200 MHz
Video outputs and ports
Display Connectors	1x DVI, 1x HDMI, 1x VGA	No outputs
Compatibility, dimensions and requirements
Interface	PCIe 3.0 x8	PCIe 1.0 x16
Supplementary power connectors	None
Memory
Maximum RAM amount	2 GB
Memory bandwidth	16 GB / s
Memory bus width	64 Bit	64 / 128 Bit
Memory clock speed	2000 MHz
Memory type	DDR3
Shared memory		1
API support
DirectX		12.0 (11_1)
OpenGL		4.3
Technologies
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